JPH02131340U - - Google Patents
Info
- Publication number
- JPH02131340U JPH02131340U JP4061889U JP4061889U JPH02131340U JP H02131340 U JPH02131340 U JP H02131340U JP 4061889 U JP4061889 U JP 4061889U JP 4061889 U JP4061889 U JP 4061889U JP H02131340 U JPH02131340 U JP H02131340U
- Authority
- JP
- Japan
- Prior art keywords
- section
- tape
- bonding
- angle correction
- supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003909 pattern recognition Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989040618U JPH0711467Y2 (ja) | 1989-04-06 | 1989-04-06 | インナリードボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989040618U JPH0711467Y2 (ja) | 1989-04-06 | 1989-04-06 | インナリードボンディング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02131340U true JPH02131340U (en, 2012) | 1990-10-31 |
JPH0711467Y2 JPH0711467Y2 (ja) | 1995-03-15 |
Family
ID=31550559
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989040618U Expired - Lifetime JPH0711467Y2 (ja) | 1989-04-06 | 1989-04-06 | インナリードボンディング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0711467Y2 (en, 2012) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58165335A (ja) * | 1982-03-26 | 1983-09-30 | Nec Corp | テ−プキヤリア方式による半導体装置の製造方法及びその製造装置 |
-
1989
- 1989-04-06 JP JP1989040618U patent/JPH0711467Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58165335A (ja) * | 1982-03-26 | 1983-09-30 | Nec Corp | テ−プキヤリア方式による半導体装置の製造方法及びその製造装置 |
Also Published As
Publication number | Publication date |
---|---|
JPH0711467Y2 (ja) | 1995-03-15 |
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