JPH021289Y2 - - Google Patents

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Publication number
JPH021289Y2
JPH021289Y2 JP1983086167U JP8616783U JPH021289Y2 JP H021289 Y2 JPH021289 Y2 JP H021289Y2 JP 1983086167 U JP1983086167 U JP 1983086167U JP 8616783 U JP8616783 U JP 8616783U JP H021289 Y2 JPH021289 Y2 JP H021289Y2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit boards
belt
lift
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983086167U
Other languages
Japanese (ja)
Other versions
JPS59190729U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8616783U priority Critical patent/JPS59190729U/en
Publication of JPS59190729U publication Critical patent/JPS59190729U/en
Application granted granted Critical
Publication of JPH021289Y2 publication Critical patent/JPH021289Y2/ja
Granted legal-status Critical Current

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Description

【考案の詳細な説明】 この考案は、薄板特に部品取付用の小孔を多数
あけたプリント基板を1枚づつ移送するプリント
基板用移送装置に関する。
[Detailed Description of the Invention] This invention relates to a printed circuit board transfer device that transfers thin plates, particularly printed circuit boards with many small holes for mounting parts, one by one.

第1図に示すように直径1mm前後の小孔1を部
品取付用として多数厚さ方向に貫通させたプリン
ト基板2を移送するには、従来第2図に示すよう
な装置を用いていた。すなわち多数のプリント基
板2を積重ねて昇降するリフト3を設け、リフト
3の一側にはプリント基板2の一端を位置決めす
る側板4を上下方向に設ける。上部にはシリンダ
5によつて左右へ、シリンダ6によつて上下に移
動する真空(又はブロワー)吸着パツト7を設け
る。吸着パツト7は、下降して最上段の基板2を
吸着して上昇したのち、側方へ移動して基板2を
次工程へ移送するものである。しかしこの装置で
は、基板2に多数の小孔1が貫通されているた
め、確実に基板2を吸着できないほか、ブロワー
吸着の場合には、複数枚の基板2を同時に持ち上
げてしまう欠点があつた。
As shown in FIG. 1, a device as shown in FIG. 2 has conventionally been used to transfer a printed circuit board 2 having a plurality of small holes 1 of about 1 mm in diameter passed through it in the thickness direction for mounting parts. That is, a lift 3 is provided which lifts and lowers a stack of a large number of printed circuit boards 2, and a side plate 4 for positioning one end of the printed circuit boards 2 is provided on one side of the lift 3 in the vertical direction. A vacuum (or blower) suction pad 7 is provided at the top, which is moved left and right by a cylinder 5 and vertically by a cylinder 6. The suction pad 7 descends, suctions the uppermost substrate 2, ascends, and then moves laterally to transfer the substrate 2 to the next process. However, with this device, the substrate 2 is penetrated by a large number of small holes 1, so it cannot reliably suction the substrate 2, and in the case of blower suction, it has the disadvantage of lifting multiple substrates 2 at the same time. .

この考案は上記の欠点を解消して、必ず1枚ず
つに分離して移送できるプリント基板用移送装置
を提供しようとするものである。
This invention aims to eliminate the above-mentioned drawbacks and provide a transfer device for printed circuit boards that can always separate and transfer one board at a time.

以下にこの考案の実施例を図面に基いて説明す
る。多数のプリント基板11を載置して昇降する
リフト12を設け、その一側には基板11の一端
を位置決めする側板13,13を上下方向に立設
する。上部には左右一対のプーリ14,14を介
して移送用のベルト15を張設し、これを前後に
間隔をおいて一対設ける。前後のプーリ14,1
4は同軸とし、前面よりみて左側のシヤフト16
を駆動シヤフトとし、これをギヤ17、チエーン
18を介してモータ19に接続する。モータ19
を駆動して、両ベルト15,15の下側が側板1
3方向へ走るように回わす。側板13,13の上
端には、それぞれローラ20,20を設け、該ロ
ーラ20とベルト15との間に基板11の厚さに
相当する送り出し用のギヤツプ21を設ける。ベ
ルト15のやや下方に、エアを薄板の木口へ向け
て吹き出すエアの吹出しノズル22を、基板11
の前後にそれぞれ3本設け、これをエアパイプ
(図示せず)により任意のエア源に接続する。
Examples of this invention will be described below based on the drawings. A lift 12 is provided which lifts and lowers a large number of printed circuit boards 11, and side plates 13, 13 for positioning one end of the circuit boards 11 are vertically provided on one side of the lift 12. A conveying belt 15 is stretched over the upper part via a pair of left and right pulleys 14, 14, and a pair of belts 15 are provided at an interval in the front and rear. Front and rear pulleys 14,1
4 is coaxial, and the shaft 16 on the left side when viewed from the front
is used as a drive shaft, which is connected to a motor 19 via a gear 17 and a chain 18. motor 19
is driven so that the lower side of both belts 15, 15 is
Turn it so that it runs in three directions. Rollers 20, 20 are provided at the upper ends of the side plates 13, 13, respectively, and a feeding gap 21 corresponding to the thickness of the substrate 11 is provided between the rollers 20 and the belt 15. Slightly below the belt 15, an air blowing nozzle 22 for blowing air toward the end of the thin plate is installed on the substrate 11.
Three air pipes are provided at the front and rear of the air conditioner, and these are connected to an arbitrary air source through an air pipe (not shown).

つぎに上記装置の動作につき説明する。リフト
12上に多数板のプリント基板11を載置し、そ
の左端を定規となる側板13,13に合わせて位
置決めする。モータ19を起動してベルト15,
15を矢印Aの方向に駆動する。リフト12を上
昇させて、最上段の基板11をローラ20の位置
まで上げると共に、前後のノズル22からエアを
吹出す。エアを吹出すと、その噴出力により上部
の基板11が分離浮上する。浮上すると最上段の
基板11はベルト15,15に接するため、該ベ
ルト15,15との接触摩擦により左方へ引き出
され、ギヤツプ21より機外へ送り出される。1
枚の基板11が送り出されたら、リフト12を基
板11の厚さ分だけ上昇させて、次の基板11の
送り出しに入る。
Next, the operation of the above device will be explained. A large number of printed circuit boards 11 are placed on a lift 12, and their left ends are positioned to match side plates 13, 13 serving as rulers. Start the motor 19 and move the belt 15,
15 in the direction of arrow A. The lift 12 is raised to raise the uppermost substrate 11 to the position of the rollers 20, and air is blown out from the front and rear nozzles 22. When air is blown out, the upper substrate 11 is separated and floated due to the blowing force. When floating, the uppermost substrate 11 comes into contact with the belts 15, 15, and is pulled out to the left by the contact friction with the belts 15, 15, and sent out of the machine through the gap 21. 1
When one substrate 11 is sent out, the lift 12 is raised by the thickness of the substrate 11, and the next substrate 11 is sent out.

この考案は以上説明したように、多数枚のプリ
ント基板を載置して上昇するリフトの上部に左右
方向へ走るベルトを張設すると共に、ベルトのや
や下方にプリント基板の木口に向けてエアを吹出
すノズルを設け、このエアの噴出力によつてプリ
ント基板を分離浮上させる。浮上すると最上段の
基板がベルトに接し、該ベルトとの接触摩擦によ
りこれを引き出して、スリツトから1枚づつ機外
に送り出す機構とした。このため貫通する小孔の
ために吸着し難く、且つブロワー吸着にすると複
数枚を同時に持ち上げる虞れが多いプリント基板
を、従来装置とちがつて必ず1枚づつに分離して
移送でき、且つ機構が簡単なため小さな動力で運
転できるという大きな効果を奏するものである。
As explained above, this idea consists of a belt running left and right on top of a lift that lifts up with a large number of printed circuit boards placed on it, and air directed slightly below the belt towards the end of the printed circuit boards. A blowing nozzle is provided, and the printed circuit board is separated and levitated by the force of this air jet. When the substrate floats up, the uppermost substrate comes into contact with the belt, and the friction caused by the contact with the belt pulls it out and sends it out of the machine one by one through the slit. Therefore, unlike conventional equipment, it is difficult to suction printed circuit boards because of the small holes that pass through them, and there is a risk of lifting multiple sheets at the same time when using blower suction. Since it is simple, it can be operated with a small amount of power, which is a great effect.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はプリント基板を示す斜視図、第2図は
従来のプリント基板用移送装置を示す正面図、第
3図はこの考案によるプリント基板用移送装置を
示す正面図、第4図は同斜視図である。 11……プリント基板、12……リフト、14
……プーリ、15……ベルト、22……ノズル。
FIG. 1 is a perspective view of a printed circuit board, FIG. 2 is a front view of a conventional printed circuit board transfer device, FIG. 3 is a front view of a printed circuit board transfer device according to this invention, and FIG. 4 is a perspective view of the same. It is a diagram. 11...Printed circuit board, 12...lift, 14
...Pulley, 15...Belt, 22...Nozzle.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の小孔を有するプリント基板を多数枚載置
して上昇するリフトを設け、その上部に左右方向
へ走るベルトを張設し、該ベルトのやや下方にプ
リント基板の木口に向けて相対する側からエアを
吹出すノズルを設け、このエアの噴出力によりプ
リント基板を1枚づつに分離して水平に浮上さ
せ、最上段のプリント基板を上記ベルトとの接触
摩擦により1枚づつ機外へ送り出すプリント基板
用移送装置。
A lift is provided that lifts a large number of printed circuit boards with many small holes placed thereon, and a belt running left and right is stretched over the top of the lift, and a side facing toward the end of the printed circuit board is placed slightly below the belt. A nozzle is installed to blow air out of the machine, and the force of this air jet separates the printed circuit boards one by one and causes them to float horizontally, and the topmost printed circuit board is sent out of the machine one by one by the contact friction with the belt. Transfer device for printed circuit boards.
JP8616783U 1983-06-06 1983-06-06 Transfer device for printed circuit boards Granted JPS59190729U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8616783U JPS59190729U (en) 1983-06-06 1983-06-06 Transfer device for printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8616783U JPS59190729U (en) 1983-06-06 1983-06-06 Transfer device for printed circuit boards

Publications (2)

Publication Number Publication Date
JPS59190729U JPS59190729U (en) 1984-12-18
JPH021289Y2 true JPH021289Y2 (en) 1990-01-12

Family

ID=30216108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8616783U Granted JPS59190729U (en) 1983-06-06 1983-06-06 Transfer device for printed circuit boards

Country Status (1)

Country Link
JP (1) JPS59190729U (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102388445B (en) * 2009-04-07 2014-05-07 住友金属精密科技股份有限公司 Wafer transfer method and wafer transfer apparatus
JP5254114B2 (en) * 2009-04-07 2013-08-07 日鉄住金ファインテック株式会社 Wafer transfer method and wafer transfer apparatus
JP5368222B2 (en) * 2009-09-14 2013-12-18 日鉄住金ファインテック株式会社 Wafer transfer method and wafer transfer apparatus
JP5457113B2 (en) * 2009-09-14 2014-04-02 日鉄住金ファインテック株式会社 Wafer transfer method and wafer transfer apparatus
JP2011068477A (en) * 2009-09-28 2011-04-07 Kyocera Mita Corp Sheet carrying mechanism and image forming device incorporated with sheet carrying mechanism

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130800U (en) * 1974-08-30 1976-03-05
JPS5130800A (en) * 1974-09-09 1976-03-16 Idec Izumi Corp JOHOKAADOTONO JIDOTEIKYOSOCHI
JPS5831832A (en) * 1981-08-18 1983-02-24 Yamada Kikai Kogyo Kk Sorter feeding apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130800U (en) * 1974-08-30 1976-03-05
JPS5130800A (en) * 1974-09-09 1976-03-16 Idec Izumi Corp JOHOKAADOTONO JIDOTEIKYOSOCHI
JPS5831832A (en) * 1981-08-18 1983-02-24 Yamada Kikai Kogyo Kk Sorter feeding apparatus

Also Published As

Publication number Publication date
JPS59190729U (en) 1984-12-18

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