JPH02127059U - - Google Patents

Info

Publication number
JPH02127059U
JPH02127059U JP3558489U JP3558489U JPH02127059U JP H02127059 U JPH02127059 U JP H02127059U JP 3558489 U JP3558489 U JP 3558489U JP 3558489 U JP3558489 U JP 3558489U JP H02127059 U JPH02127059 U JP H02127059U
Authority
JP
Japan
Prior art keywords
chip component
pattern
integrated circuit
substrate
sandwich
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3558489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0741178Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989035584U priority Critical patent/JPH0741178Y2/ja
Publication of JPH02127059U publication Critical patent/JPH02127059U/ja
Application granted granted Critical
Publication of JPH0741178Y2 publication Critical patent/JPH0741178Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1989035584U 1989-03-30 1989-03-30 厚膜混成集積回路基板 Expired - Lifetime JPH0741178Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989035584U JPH0741178Y2 (ja) 1989-03-30 1989-03-30 厚膜混成集積回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989035584U JPH0741178Y2 (ja) 1989-03-30 1989-03-30 厚膜混成集積回路基板

Publications (2)

Publication Number Publication Date
JPH02127059U true JPH02127059U (US07345094-20080318-C00003.png) 1990-10-19
JPH0741178Y2 JPH0741178Y2 (ja) 1995-09-20

Family

ID=31541065

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989035584U Expired - Lifetime JPH0741178Y2 (ja) 1989-03-30 1989-03-30 厚膜混成集積回路基板

Country Status (1)

Country Link
JP (1) JPH0741178Y2 (US07345094-20080318-C00003.png)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929068U (ja) * 1982-08-18 1984-02-23 富士通株式会社 チツプ型部品の位置決め構造
JPS59158334U (ja) * 1983-04-07 1984-10-24 三菱電機株式会社 回路部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5929068U (ja) * 1982-08-18 1984-02-23 富士通株式会社 チツプ型部品の位置決め構造
JPS59158334U (ja) * 1983-04-07 1984-10-24 三菱電機株式会社 回路部品

Also Published As

Publication number Publication date
JPH0741178Y2 (ja) 1995-09-20

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