JPH02127054U - - Google Patents
Info
- Publication number
- JPH02127054U JPH02127054U JP3554189U JP3554189U JPH02127054U JP H02127054 U JPH02127054 U JP H02127054U JP 3554189 U JP3554189 U JP 3554189U JP 3554189 U JP3554189 U JP 3554189U JP H02127054 U JPH02127054 U JP H02127054U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- metal core
- contact
- insulating layer
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3554189U JPH02127054U (it) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3554189U JPH02127054U (it) | 1989-03-30 | 1989-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02127054U true JPH02127054U (it) | 1990-10-19 |
Family
ID=31540990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3554189U Pending JPH02127054U (it) | 1989-03-30 | 1989-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02127054U (it) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179309A (ja) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | プリント回路基板の放熱構造とその製造方法 |
JP2011146665A (ja) * | 2010-01-12 | 2011-07-28 | Samsung Electro-Mechanics Co Ltd | ハイブリッド型放熱基板およびその製造方法 |
-
1989
- 1989-03-30 JP JP3554189U patent/JPH02127054U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004179309A (ja) * | 2002-11-26 | 2004-06-24 | New Japan Radio Co Ltd | プリント回路基板の放熱構造とその製造方法 |
JP2011146665A (ja) * | 2010-01-12 | 2011-07-28 | Samsung Electro-Mechanics Co Ltd | ハイブリッド型放熱基板およびその製造方法 |