JPH02125438A - Method for processing data of wire bonder - Google Patents
Method for processing data of wire bonderInfo
- Publication number
- JPH02125438A JPH02125438A JP63278689A JP27868988A JPH02125438A JP H02125438 A JPH02125438 A JP H02125438A JP 63278689 A JP63278689 A JP 63278689A JP 27868988 A JP27868988 A JP 27868988A JP H02125438 A JPH02125438 A JP H02125438A
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- bond
- data
- height
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 6
- 238000003672 processing method Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 2
- 238000013523 data management Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、ワイヤボンダの高さデータ登録作業の簡略化
、及びキャピラリ交換によってキャピラリ取り付は位置
が変化した後で装置を運転する際に、キャピラリ交換前
に登録されたボンド面高さデータを自動補正する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention simplifies the work of registering height data of a wire bonder, and eliminates the need for capillary replacement when operating the device after changing the capillary position. The present invention relates to a method for automatically correcting previously registered bond surface height data.
従来の技術
ワイヤボンダでは、ボンディングの対象である基板と基
板上のＩＣ等の高さが一定でないために、自動運転の前
に各ボンド位置ごとにボンド面高さデータを登録してお
く必要がある。With conventional technology wire bonders, the height of the substrate to be bonded and the IC, etc. on the substrate are not constant, so it is necessary to register bond surface height data for each bond position before automatic operation. .
従来は、高さデータを登録する場合は、手動スイッチを
押し続けることによってキャピラリを降下させ、キャピ
ラリ先端が目標物に接触したことを目視で確認し、手動
スイッチを離すことによってキャピラリを停止し、その
時のキャピラリの位置データをオペレータがＮＣ装置か
ら読み取って入力していた。Conventionally, when registering height data, the capillary is lowered by holding down the manual switch, visually confirming that the capillary tip has contacted the target, and stopping the capillary by releasing the manual switch. The operator read the capillary position data at that time from the NC device and input it.
ワイヤボンダのキャピラリは、寿命や破損等によって頻
繁に取り替えられるが、もし、取り替え作業でキャピラ
リの取り付は位置が変化した後で、以前に登録された自
動運転データでそのままボンディングすれば、キャピラ
リの下降がオーバーしてボンド位置にあるＩＣを破損し
たり、あるいは、キャピラリがボンド位置まで届かない
ために正常にワイヤが接合できなかったりする。The capillary of a wire bonder is frequently replaced due to lifespan or damage, but if the position of the capillary changes during replacement work, if you continue bonding using the previously registered automatic operation data, the lowering of the capillary will be easier. The capillary may exceed the bond position and damage the IC at the bond position, or the wire may not be properly bonded because the capillary cannot reach the bond position.
このため従来は、キャピラリの交換時に以前と同じ位置
に正確に取り付けるか、もしくは、自動運転データのボ
ンド面高さデータを変更して高さを合わせる等の方法が
取られていた。For this reason, in the past, when replacing the capillary, methods were used such as installing it exactly in the same position as before, or changing the bond surface height data in the automatic operation data to match the height.
ボールボンド方式のワイヤボンダでは、第一ボンドの前
にワイヤ先端の形状がボール状になっている必要がある
。そのために、第二ボンド位置にボンディング後、スパ
ーク高さデータに基づいてキャピラリをスパーク位置ま
で上昇させ、トーチをキャピラリ下部まで移動し、トー
チとキャピラリから出ているワイヤの先端との間にスパ
ークを・発生させてワイヤの先端をボール状に形成する
が、スパークギャップが正確に合っていないとスパーク
が発生しない。In a ball bond type wire bonder, the tip of the wire must have a ball shape before the first bond. To do this, after bonding to the second bond position, the capillary is raised to the spark position based on the spark height data, the torch is moved to the bottom of the capillary, and a spark is created between the torch and the tip of the wire coming out of the capillary.・Sparks are generated to form the tip of the wire into a ball shape, but if the spark gap is not aligned correctly, sparks will not be generated.
このため、前記と同じようにキャピラリ取り付けを正確
に行うか、自動運転データのスパーク高さデータを変更
する等の方法が取られていた。For this reason, methods such as installing the capillary accurately as described above or changing the spark height data in the automatic operation data have been taken.
発明が解決しようとする課題
従来の技術では、ボンド面高さデータの登録においてキ
ャピラリと目標物との正確な位置合わせが困難なために
作業性が悪（、データの信頼性も低かった。Problems to be Solved by the Invention In the conventional technology, it is difficult to accurately align the capillary and the target object when registering bond surface height data, resulting in poor workability (and low data reliability).
また、キャピラリ交換の度に取り付は位置の正確な微調
整が必要であったり、高さデータの再登録が必要となる
など、メカ調整やデータ管理の効率が著しく悪かった。In addition, each time the capillary was replaced, the installation required accurate fine adjustment of the position, and height data had to be re-registered, making mechanical adjustment and data management extremely inefficient.
課題を解決するための手段
本発明は、高さデータを登録するときに、装置の当り検
出部からの信号を利用して自動登録を可能とし、さらに
、自動運転データ内の基準高さデータと設備固有パラメ
ータ内の基準となる高さデータを比較して、ボンド面高
さを適正な位置に自動補正する。Means for Solving the Problems The present invention enables automatic registration when registering height data by using a signal from the hit detection section of the device, and furthermore, allows automatic registration to be performed using a signal from the collision detection section of the device, and furthermore, when registering height data, it is possible to automatically register height data using the signal from the collision detection section of the device. The bond surface height is automatically corrected to the appropriate position by comparing the reference height data in the equipment-specific parameters.
作 用
装置の当り検出部からの信号をキャピラリと目標物との
接触タイミングとし、キャピラリの下降速度が、当り検
出信号を受けてからキャピラリを停止するまでの時間と
比べて士１分に遅いので、キャピラリの停止位置を目標
物の高さデータとして登録する。The contact timing between the capillary and the target is determined by the signal from the hit detection section of the working device, and the descending speed of the capillary is approximately 1 minute slower than the time from receiving the hit detection signal to stopping the capillary. , the capillary stop position is registered as target object height data.
また、自動運転データ内の基準となる高さデータとは、
ボンド面高さデータを登録したときのキャピラリの絶対
位置を表し、設備固有パラメータ内の基準高さデータと
は、ボンディングを実行しようとするときのキャピラリ
の絶対位置をあられすので、両者の差をとってボンド面
高さデータを補正する。In addition, the height data that serves as the standard in the automated driving data is
It represents the absolute position of the capillary when the bond surface height data is registered, and the reference height data in the equipment-specific parameters is the absolute position of the capillary when bonding is to be performed. and correct the bond surface height data.
さらに、ボンディングを実行しようとするときのスパー
ク位置は、真のキャピラリ高さ（キャピラリが設計値通
りに正確に取り付いていると仮定したときのテーブル面
からキャピラリ先端までの高さ）と設備固有パラメータ
のキャピラリ高さの差によって補正する。Furthermore, the spark position when attempting to perform bonding is determined by the true capillary height (the height from the table surface to the tip of the capillary assuming that the capillary is mounted exactly as designed) and equipment-specific parameters. Corrected by the difference in capillary height.
実施例 次に本発明の実施例について説明する。Example Next, examples of the present invention will be described.
本方式は、コンソールのキーを押すことによって、自動
的に装置が高さ測定のための動作を実行し、常に安定し
たデータを登録できることを特徴とする。This method is characterized in that by pressing a key on the console, the device automatically executes operations for height measurement, and stable data can always be registered.
第１図は本発明の実施例の高さデータを登録するための
システムの構成を示す説明図である。FIG. 1 is an explanatory diagram showing the configuration of a system for registering height data according to an embodiment of the present invention.
以下に高さ測定の方法を説明する。高さ測定の前にモニ
タ画面１を見ながら基板テーブル２を動かして測定位置
をテレビカメラ３の中心に合わせる。ここで、コンソー
ル４のキーを押せば基板テーブルが動いてテーブル上の
測定位置がキャピラリ５の真下に移動し、キャピラリが
下降し始める。キャピラリが目標物に接触すると、装置
の当り検出部６よりマイクロコンピュータ（以下ＭＰＵ
）７に当り検出信号が入るので、ＭＰＵはＮＣ装置８に
対して停止指令を送りキャピラリの下降を停止する。次
に、ＭＰＵはＮＣ装置からキャピラリの現在位置データ
を受取り、それを高さデータとしてＭＰＵの記憶装置の
自動運転データ９または設備固有パラメータｌＯに記憶
する。その後、キャピラリを原点位置まで上昇させて、
基板テーブルをカメラ側へ移動して終了する。The method of height measurement will be explained below. Before height measurement, the substrate table 2 is moved while looking at the monitor screen 1 to align the measurement position with the center of the television camera 3. Here, if a key on the console 4 is pressed, the substrate table moves and the measurement position on the table moves to just below the capillary 5, and the capillary begins to descend. When the capillary comes into contact with the target object, a microcomputer (hereinafter MPU
) 7 and a detection signal is input, so the MPU sends a stop command to the NC device 8 to stop the capillary from descending. Next, the MPU receives the current position data of the capillary from the NC device, and stores it as height data in the automatic operation data 9 or equipment-specific parameters IO in the storage device of the MPU. After that, raise the capillary to the origin position,
Move the board table to the camera side and finish.
本方式では、キャピラリ交換前に登録されたボンド面高
さデータに対して、現在取り付けられているキャピラリ
の高さによって補正をかけ、正確なボンド面高さを得る
ことができる。In this method, the bond surface height data registered before capillary replacement is corrected based on the height of the currently installed capillary, thereby making it possible to obtain accurate bond surface height.
第２図および第３図は高さデータ登録におけるキャピラ
リと測定位置の関係を示すものである。FIGS. 2 and 3 show the relationship between capillaries and measurement positions in height data registration.
以下にボンド面高さの補正方法を示す。オペレータは、
ボンド位置の登録前に前記高さデータの自動登録機能に
よって基準点１の高さ（基準高さ）Ｈｌを登録する。こ
の高さデータは自動運転データの一部として登録される
。次に、各ボンド位置ごとに、前記高さデータの自動登
録機能によって、第一ボンド位置２の高さＢ１と第二ボ
ンド位置３の高さＢ２を登録する。自動運転データが全
て登録されれば、そのままボンディングを実行できる。The method for correcting the bond surface height is shown below. The operator is
Before registering the bond position, the height (reference height) Hl of reference point 1 is registered using the height data automatic registration function. This height data is registered as part of the automatic driving data. Next, for each bond position, the height B1 of the first bond position 2 and the height B2 of the second bond position 3 are registered using the height data automatic registration function. Once all automated driving data is registered, bonding can be performed as is.
その後キャピラリが交換されて取り付は位置が変化した
ときは、前記高さデータの自動登録機能によって基準点
の高さＨ２を設備固有パラメータ１０として登録する。After that, when the capillary is replaced and the installation position changes, the height H2 of the reference point is registered as the equipment-specific parameter 10 by the height data automatic registration function.
その後のボンディングでは、下記の補正を行う。In subsequent bonding, the following corrections are made.
第一ボンド位置の高さＢＨＩは
ＢＨＩ ＝ Ｂｌ−（Ｈｌ−１４２）第二ボンド位
置の高さＢＨ２は
ＢＨ２＝ ８２−（Ｈｌ−８２）
となる。The height BHI of the first bond position is BHI=Bl-(Hl-142), and the height BH2 of the second bond position is BH2=82-(Hl-82).
キャピラリ交換後は、スパーク位置の高さがずれるので
下記の補正を行う。After replacing the capillary, the height of the spark position will shift, so make the following corrections.
真のスパーク位置高さ（キャピラリを設計値通り正確に
取り付けたときの、スパーク位置高さ）を８３、真のキ
ャピラリ高さをＨＴとすると、キャピラリの取り付けが
ずれた時に補正して求めるスパーク位置Ｈ４は
Ｈ４＝ ８３− （ＨＴ−Ｈ２）
となる。If the true spark position height (the spark position height when the capillary is installed accurately according to the design value) is 83, and the true capillary height is HT, then the spark position is calculated by correcting when the capillary installation is misaligned. H4 becomes H4=83- (HT-H2).
キャピラリ交換によって取り付は位置がつれている場合
に、Ｈ３データをそのまま使えば第３図の破線で示すよ
うにトーチとワイヤが接触したり、あるいはスパークギ
ャップが大きすぎてスパークが発生しなかったりするが
、この方式で補正することにより常にスパークギャップ
を一定に保つことができるので、スパークエラーの頻度
が大幅に減少する。If the installation position is incorrect due to capillary replacement, if you use the H3 data as is, the torch and wire may come into contact as shown by the broken line in Figure 3, or the spark gap may be too large and no spark will occur. However, by correcting with this method, the spark gap can always be kept constant, so the frequency of spark errors is greatly reduced.
発明の詳細
な説明したように、本発明では高さデータの測定におい
て、オペレータの操作はコンソールのキーを一度押すだ
けでよいので作業効率が良く、また、当り検出部からキ
ャピラリと目標物の接触のタイミングが正確に送られて
くるので、信頼性が高（常に安定したデータが得られる
。As described in detail, in the present invention, when measuring height data, the operator only needs to press a key on the console once, which improves work efficiency. The timing is sent accurately, so reliability is high (stable data is always obtained).
さらに、この方法ではキャピラリ交換作業において、キ
ャピラリの取り付は位置の誤差を気にする必要がな（、
作業時間を短縮することができる。Furthermore, with this method, there is no need to worry about positional errors when installing capillaries during capillary replacement work.
Work time can be shortened.
また、キャピラリを交換するごとに設備固有パラメータ
を登録することにより、以前に登録したボンド面高さデ
ータを変更せずにそのまま使えるので、−度作成された
自動運転データはいつ作成されたデータであっても、そ
の後のキャピラリ交換時にデータを変更する必要がなく
、データの管理が容易である。In addition, by registering equipment-specific parameters each time a capillary is replaced, previously registered bond surface height data can be used as is without changing, so automatic operation data created once can be used as is. Even if there is a capillary, there is no need to change the data when replacing the capillary afterwards, and data management is easy.
第１図は本発明の一実施例における高さデータを自動登
録するためのシステムの構成を示す説明図、第２図およ
び第３図は同高さデータ登録におけるキャピラリと測定
位置の関係を示す説明図である。
２２・・・・・・第１ボンド位置、２３・・・・・・第
２ボンド位置、２４・・・・・・キャピラリ、２６・・
・・・・ワイヤ。
代理人の氏名 弁理士 粟野重孝 ほか１名第
図
第
図
、革￥！７ミ。Fig. 1 is an explanatory diagram showing the configuration of a system for automatically registering height data in an embodiment of the present invention, and Figs. 2 and 3 show the relationship between capillaries and measurement positions in the same height data registration. It is an explanatory diagram. 22...First bond position, 23...Second bond position, 24...Capillary, 26...
...Wire. Name of agent: Patent attorney Shigetaka Awano and 1 other person Fig. Fig. Fig. Leather ¥! 7 mi.
Claims (2)
を第一ボンド位置に降下させてその位置にワイヤの先端
を接合し、次にワイヤを繰り出しながらキャピラリを上
昇させ、基板テーブルを第二ボンド位置へ移動し、続い
て第二ボンド面高さデータに基づいて、キャピラリを降
下させてその位置にワイヤを接合し、接合面でワイヤを
切断することによって、第一ボンド位置と第二ボンド位
置の間にワイヤを接続するワイヤボンディング方法にお
いて、ボンド面高さデータを自動登録するために、装置
の当り検出部により当り検出信号を得てこれによりボン
ド面高さを登録するワイヤボンダのデータ処理方法。(1) Based on the first bond surface height data, lower the capillary to the first bond position and bond the tip of the wire at that position, then raise the capillary while feeding out the wire and move the substrate table to the second bond position. the first bond position and the second bond by moving to the bond position, then lowering the capillary to bond the wire at that position based on the second bond surface height data, and cutting the wire at the bond surface. In wire bonding methods that connect wires between positions, wire bonder data processing involves obtaining a hit detection signal from the hit detection section of the device and registering the bond surface height in order to automatically register the bond surface height data. Method.
高さデータを登録後、キャピラリ交換によって基板テー
ブル面からキャピラリ先端までの高さが変化した時に、
その変化量を補正して正確な高さでワイヤをボンディン
グする請求項１記載のワイヤボンダのデータ処理方法。(2) After registering the bond surface height data using the height data automatic registration function, when the height from the substrate table surface to the capillary tip changes due to capillary replacement,
2. The wire bonder data processing method according to claim 1, wherein the amount of change is corrected to bond the wire at an accurate height.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63278689A JP2584017B2 (en) | 1988-11-04 | 1988-11-04 | Wire bonder data processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63278689A JP2584017B2 (en) | 1988-11-04 | 1988-11-04 | Wire bonder data processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02125438A true JPH02125438A (en) | 1990-05-14 |
| JP2584017B2 JP2584017B2 (en) | 1997-02-19 |
Family
ID=17600805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63278689A Expired - Lifetime JP2584017B2 (en) | 1988-11-04 | 1988-11-04 | Wire bonder data processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2584017B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59107530A (en) * | 1982-12-13 | 1984-06-21 | Nec Corp | Method for wire bonding |
| JPS6173339A (en) * | 1984-09-18 | 1986-04-15 | Toshiba Corp | Wire bonding method |
| JPS63197348A (en) * | 1987-02-10 | 1988-08-16 | Nec Yamagata Ltd | Method for replacing capillary |
-
1988
- 1988-11-04 JP JP63278689A patent/JP2584017B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59107530A (en) * | 1982-12-13 | 1984-06-21 | Nec Corp | Method for wire bonding |
| JPS6173339A (en) * | 1984-09-18 | 1986-04-15 | Toshiba Corp | Wire bonding method |
| JPS63197348A (en) * | 1987-02-10 | 1988-08-16 | Nec Yamagata Ltd | Method for replacing capillary |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2584017B2 (en) | 1997-02-19 |
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