JPH02125373U - - Google Patents
Info
- Publication number
- JPH02125373U JPH02125373U JP3326189U JP3326189U JPH02125373U JP H02125373 U JPH02125373 U JP H02125373U JP 3326189 U JP3326189 U JP 3326189U JP 3326189 U JP3326189 U JP 3326189U JP H02125373 U JPH02125373 U JP H02125373U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- groove
- circuit board
- electronic components
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3326189U JPH02125373U (fr) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3326189U JPH02125373U (fr) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125373U true JPH02125373U (fr) | 1990-10-16 |
Family
ID=31536786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3326189U Pending JPH02125373U (fr) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125373U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275940A (ja) * | 1993-03-23 | 1994-09-30 | Meiki Co Ltd | 凸部または凹部を有する成形回路基板の製造方法および成形用回路フィルム |
-
1989
- 1989-03-27 JP JP3326189U patent/JPH02125373U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275940A (ja) * | 1993-03-23 | 1994-09-30 | Meiki Co Ltd | 凸部または凹部を有する成形回路基板の製造方法および成形用回路フィルム |