JPH02125345U - - Google Patents
Info
- Publication number
- JPH02125345U JPH02125345U JP1989035337U JP3533789U JPH02125345U JP H02125345 U JPH02125345 U JP H02125345U JP 1989035337 U JP1989035337 U JP 1989035337U JP 3533789 U JP3533789 U JP 3533789U JP H02125345 U JPH02125345 U JP H02125345U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- wall portion
- semiconductor device
- solder layer
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989035337U JPH02125345U (US07488766-20090210-C00029.png) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989035337U JPH02125345U (US07488766-20090210-C00029.png) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125345U true JPH02125345U (US07488766-20090210-C00029.png) | 1990-10-16 |
Family
ID=31540603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989035337U Pending JPH02125345U (US07488766-20090210-C00029.png) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125345U (US07488766-20090210-C00029.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008047701A (ja) * | 2006-08-16 | 2008-02-28 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュール |
| JP2009524234A (ja) * | 2006-01-20 | 2009-06-25 | ハイマイト アクティーゼルスカブ | 静電放電保護を内蔵した発光素子用のパッケージ |
| JP2014132610A (ja) * | 2013-01-07 | 2014-07-17 | Seiko Epson Corp | パッケージ、光学モジュール、及び電子機器 |
| WO2018043094A1 (ja) * | 2016-09-01 | 2018-03-08 | 日機装株式会社 | 光半導体装置および光半導体装置の製造方法 |
| JP2021034612A (ja) * | 2019-08-27 | 2021-03-01 | 京セラ株式会社 | 電子部品パッケージおよび電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5591844A (en) * | 1978-12-28 | 1980-07-11 | Fujitsu Ltd | Electronic parts package |
-
1989
- 1989-03-27 JP JP1989035337U patent/JPH02125345U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5591844A (en) * | 1978-12-28 | 1980-07-11 | Fujitsu Ltd | Electronic parts package |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009524234A (ja) * | 2006-01-20 | 2009-06-25 | ハイマイト アクティーゼルスカブ | 静電放電保護を内蔵した発光素子用のパッケージ |
| JP2008047701A (ja) * | 2006-08-16 | 2008-02-28 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュール |
| JP2014132610A (ja) * | 2013-01-07 | 2014-07-17 | Seiko Epson Corp | パッケージ、光学モジュール、及び電子機器 |
| WO2018043094A1 (ja) * | 2016-09-01 | 2018-03-08 | 日機装株式会社 | 光半導体装置および光半導体装置の製造方法 |
| JP2018037581A (ja) * | 2016-09-01 | 2018-03-08 | 日機装株式会社 | 光半導体装置および光半導体装置の製造方法 |
| US10840414B2 (en) | 2016-09-01 | 2020-11-17 | Nikkiso Co., Ltd. | Optical semiconductor apparatus and method of manufacturing optical semiconductor apparatus |
| JP2021034612A (ja) * | 2019-08-27 | 2021-03-01 | 京セラ株式会社 | 電子部品パッケージおよび電子装置 |
