JPH02125338U - - Google Patents
Info
- Publication number
- JPH02125338U JPH02125338U JP3351589U JP3351589U JPH02125338U JP H02125338 U JPH02125338 U JP H02125338U JP 3351589 U JP3351589 U JP 3351589U JP 3351589 U JP3351589 U JP 3351589U JP H02125338 U JPH02125338 U JP H02125338U
- Authority
- JP
- Japan
- Prior art keywords
- discharge nozzle
- nozzle
- nozzles
- intersections
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図はその下面図、第３図はそのノズル配置図、第
４図は従来のノズルの下面図、第５図はそのノズ
ル配置図である。 １……ノズルブロツク、２……ペースト供給チ
ユーブ、４……ノズル。
図はその下面図、第３図はそのノズル配置図、第
４図は従来のノズルの下面図、第５図はそのノズ
ル配置図である。 １……ノズルブロツク、２……ペースト供給チ
ユーブ、４……ノズル。
Claims (1)
- ノズルブロツクの下面に複数の円筒状ノズルを
突設配置してなるペーストマウント用吐出ノズル
において、前記ノズルが複数の平行線同志が斜め
に交差する交差点に配置されていることを特徴と
するペーストマウント用吐出ノズル。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3351589U JPH02125338U (ja) | 1989-03-23 | 1989-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3351589U JPH02125338U (ja) | 1989-03-23 | 1989-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125338U true JPH02125338U (ja) | 1990-10-16 |
Family
ID=31537232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3351589U Pending JPH02125338U (ja) | 1989-03-23 | 1989-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125338U (ja) |
-
1989
- 1989-03-23 JP JP3351589U patent/JPH02125338U/ja active Pending
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