JPH02123369U - - Google Patents
Info
- Publication number
- JPH02123369U JPH02123369U JP3120389U JP3120389U JPH02123369U JP H02123369 U JPH02123369 U JP H02123369U JP 3120389 U JP3120389 U JP 3120389U JP 3120389 U JP3120389 U JP 3120389U JP H02123369 U JPH02123369 U JP H02123369U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- holder
- board soldering
- rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図、第2図はこの考案の一実施例によるプ
リント基板の半田付装置を示す図であり、第1図
はレール近傍の平面図、第2図は第1図の―
線における断面図、第3図、第4図はこの考案の
一実施例のキヤリア部の詳細図であり第3図は第
1図の―線による断面図、第4図は第3図の
平面図、第5図、第6図は従来のプリント基板の
半田付装置を示す図で、第5図は平面図、第6図
は第5図の側面図である。
図において、1……車、2……キヤリア、7…
…レール、10……ホルダー、12……キヤリア
ガイドである。なお、図中、同一符号は同一また
は相当部分を示す。
1 and 2 are diagrams showing a printed circuit board soldering device according to an embodiment of this invention. FIG. 1 is a plan view of the vicinity of the rail, and FIG.
3 and 4 are detailed views of the carrier section of an embodiment of this invention, FIG. 3 is a sectional view taken along the line -- in FIG. 1, and FIG. 4 is a plan view of FIG. 3. 5 and 6 are views showing a conventional printed circuit board soldering apparatus, with FIG. 5 being a plan view and FIG. 6 being a side view of FIG. 5. In the diagram, 1...car, 2...carrier, 7...
...Rail, 10...Holder, 12...Carrier guide. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
キヤリアが駆動装置により駆動されて回動し所定
位置にて半田付をするプリント基板の半田付装置
において、上記レールの側面で上記ホルダーの底
面に接するようにキヤリアガイドを配設したこと
を特徴とするプリント基板の半田付装置。 In a printed circuit board soldering device in which a carrier supported by a car on a rail supporting a holder is rotated by a drive device and soldered at a predetermined position, the side surface of the rail touches the bottom surface of the holder. A printed circuit board soldering device characterized by having a carrier guide arranged as shown in FIG.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3120389U JPH02123369U (en) | 1989-03-17 | 1989-03-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3120389U JPH02123369U (en) | 1989-03-17 | 1989-03-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02123369U true JPH02123369U (en) | 1990-10-11 |
Family
ID=31256894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3120389U Pending JPH02123369U (en) | 1989-03-17 | 1989-03-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02123369U (en) |
-
1989
- 1989-03-17 JP JP3120389U patent/JPH02123369U/ja active Pending
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