JPH02122800U - - Google Patents
Info
- Publication number
- JPH02122800U JPH02122800U JP3009089U JP3009089U JPH02122800U JP H02122800 U JPH02122800 U JP H02122800U JP 3009089 U JP3009089 U JP 3009089U JP 3009089 U JP3009089 U JP 3009089U JP H02122800 U JPH02122800 U JP H02122800U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cutting
- groove
- stopper
- cutting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3009089U JPH02122800U (hu) | 1989-03-16 | 1989-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3009089U JPH02122800U (hu) | 1989-03-16 | 1989-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122800U true JPH02122800U (hu) | 1990-10-09 |
Family
ID=31254845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3009089U Pending JPH02122800U (hu) | 1989-03-16 | 1989-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122800U (hu) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018127961A1 (ja) * | 2017-01-05 | 2018-07-12 | 株式会社島津製作所 | 試料採取チップ分割用器具 |
| JP2020035780A (ja) * | 2018-08-27 | 2020-03-05 | 三菱電機株式会社 | プリント回路基板分割装置、プリント回路基板分割用押さえ治具、プリント回路基板分割方法及びプリント回路装置の製造方法 |
-
1989
- 1989-03-16 JP JP3009089U patent/JPH02122800U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018127961A1 (ja) * | 2017-01-05 | 2018-07-12 | 株式会社島津製作所 | 試料採取チップ分割用器具 |
| JPWO2018127961A1 (ja) * | 2017-01-05 | 2019-11-07 | 株式会社島津製作所 | 試料採取チップ分割用器具 |
| US11467069B2 (en) | 2017-01-05 | 2022-10-11 | Shimadzu Corporation | Sampling chip dividing instrument |
| JP2020035780A (ja) * | 2018-08-27 | 2020-03-05 | 三菱電機株式会社 | プリント回路基板分割装置、プリント回路基板分割用押さえ治具、プリント回路基板分割方法及びプリント回路装置の製造方法 |