JPH02122800U - - Google Patents

Info

Publication number
JPH02122800U
JPH02122800U JP3009089U JP3009089U JPH02122800U JP H02122800 U JPH02122800 U JP H02122800U JP 3009089 U JP3009089 U JP 3009089U JP 3009089 U JP3009089 U JP 3009089U JP H02122800 U JPH02122800 U JP H02122800U
Authority
JP
Japan
Prior art keywords
substrate
cutting
groove
stopper
cutting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3009089U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3009089U priority Critical patent/JPH02122800U/ja
Publication of JPH02122800U publication Critical patent/JPH02122800U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
JP3009089U 1989-03-16 1989-03-16 Pending JPH02122800U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3009089U JPH02122800U (de) 1989-03-16 1989-03-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3009089U JPH02122800U (de) 1989-03-16 1989-03-16

Publications (1)

Publication Number Publication Date
JPH02122800U true JPH02122800U (de) 1990-10-09

Family

ID=31254845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3009089U Pending JPH02122800U (de) 1989-03-16 1989-03-16

Country Status (1)

Country Link
JP (1) JPH02122800U (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018127961A1 (ja) * 2017-01-05 2018-07-12 株式会社島津製作所 試料採取チップ分割用器具
JP2020035780A (ja) * 2018-08-27 2020-03-05 三菱電機株式会社 プリント回路基板分割装置、プリント回路基板分割用押さえ治具、プリント回路基板分割方法及びプリント回路装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018127961A1 (ja) * 2017-01-05 2018-07-12 株式会社島津製作所 試料採取チップ分割用器具
JPWO2018127961A1 (ja) * 2017-01-05 2019-11-07 株式会社島津製作所 試料採取チップ分割用器具
US11467069B2 (en) 2017-01-05 2022-10-11 Shimadzu Corporation Sampling chip dividing instrument
JP2020035780A (ja) * 2018-08-27 2020-03-05 三菱電機株式会社 プリント回路基板分割装置、プリント回路基板分割用押さえ治具、プリント回路基板分割方法及びプリント回路装置の製造方法

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