JPH02122477U - - Google Patents
Info
- Publication number
- JPH02122477U JPH02122477U JP3110189U JP3110189U JPH02122477U JP H02122477 U JPH02122477 U JP H02122477U JP 3110189 U JP3110189 U JP 3110189U JP 3110189 U JP3110189 U JP 3110189U JP H02122477 U JPH02122477 U JP H02122477U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- substrate
- insulating layer
- bonded
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3110189U JPH02122477U (ko) | 1989-03-17 | 1989-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3110189U JPH02122477U (ko) | 1989-03-17 | 1989-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122477U true JPH02122477U (ko) | 1990-10-08 |
Family
ID=31256714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3110189U Pending JPH02122477U (ko) | 1989-03-17 | 1989-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122477U (ko) |
-
1989
- 1989-03-17 JP JP3110189U patent/JPH02122477U/ja active Pending