JPH02122444U - - Google Patents

Info

Publication number
JPH02122444U
JPH02122444U JP3076689U JP3076689U JPH02122444U JP H02122444 U JPH02122444 U JP H02122444U JP 3076689 U JP3076689 U JP 3076689U JP 3076689 U JP3076689 U JP 3076689U JP H02122444 U JPH02122444 U JP H02122444U
Authority
JP
Japan
Prior art keywords
semiconductor device
measured
probe needle
suction force
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3076689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3076689U priority Critical patent/JPH02122444U/ja
Publication of JPH02122444U publication Critical patent/JPH02122444U/ja
Pending legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の半導体素子測定治具を示す平
面図、第2図は第1図の正面図、第3図は従来の
半導体素子測定治具を示す平面図、第4図は第3
図の正面図である。 1……プローブ針、2……粗動上下調整部、3
……上下スライド部、4……スプリング、5……
プローブ針固定部、6……ボイスコイル。
FIG. 1 is a plan view showing a semiconductor device measuring jig of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a plan view showing a conventional semiconductor device measuring jig, and FIG.
FIG. 1...Probe needle, 2...Coarse vertical adjustment section, 3
...Vertical slide part, 4...Spring, 5...
Probe needle fixing part, 6...Voice coil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 被測定用半導体素子に対するプローブ針の加重
力を調整し、該プローブ針を被測定用半導体素子
にコンタクトさせる半導体素子測定治具において
、前記プローブ針を被測定用半導体素子に対し相
対変位可能に支持するスライド機構と、通電電流
値に比例した吸着力を発生し、その吸着力にてプ
ローブ針を被測定用半導体素子側に吸引するボイ
スコイルとを有することを特徴とする半導体素子
測定治具。
In a semiconductor device measurement jig that adjusts the weight force of the probe needle on the semiconductor device to be measured and brings the probe needle into contact with the semiconductor device to be measured, the probe needle is supported so as to be movable relative to the semiconductor device to be measured. 1. A semiconductor device measuring jig comprising: a slide mechanism that generates a suction force proportional to a current value; and a voice coil that uses the suction force to attract a probe needle toward a semiconductor device to be measured.
JP3076689U 1989-03-17 1989-03-17 Pending JPH02122444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3076689U JPH02122444U (en) 1989-03-17 1989-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3076689U JPH02122444U (en) 1989-03-17 1989-03-17

Publications (1)

Publication Number Publication Date
JPH02122444U true JPH02122444U (en) 1990-10-08

Family

ID=31256121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3076689U Pending JPH02122444U (en) 1989-03-17 1989-03-17

Country Status (1)

Country Link
JP (1) JPH02122444U (en)

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