JPH02122436U - - Google Patents
Info
- Publication number
- JPH02122436U JPH02122436U JP3110889U JP3110889U JPH02122436U JP H02122436 U JPH02122436 U JP H02122436U JP 3110889 U JP3110889 U JP 3110889U JP 3110889 U JP3110889 U JP 3110889U JP H02122436 U JPH02122436 U JP H02122436U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- dispensing device
- sealing
- circuit board
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000000565 sealant Substances 0.000 description 2
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3110889U JPH02122436U (fr) | 1989-03-17 | 1989-03-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3110889U JPH02122436U (fr) | 1989-03-17 | 1989-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122436U true JPH02122436U (fr) | 1990-10-08 |
Family
ID=31256721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3110889U Pending JPH02122436U (fr) | 1989-03-17 | 1989-03-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122436U (fr) |
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1989
- 1989-03-17 JP JP3110889U patent/JPH02122436U/ja active Pending