JPH02121910U - - Google Patents
Info
- Publication number
- JPH02121910U JPH02121910U JP3086789U JP3086789U JPH02121910U JP H02121910 U JPH02121910 U JP H02121910U JP 3086789 U JP3086789 U JP 3086789U JP 3086789 U JP3086789 U JP 3086789U JP H02121910 U JPH02121910 U JP H02121910U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- thermosetting resin
- mold
- gate
- injected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989030867U JPH079614Y2 (ja) | 1989-03-20 | 1989-03-20 | 熱硬化性樹脂封止用金型 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989030867U JPH079614Y2 (ja) | 1989-03-20 | 1989-03-20 | 熱硬化性樹脂封止用金型 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02121910U true JPH02121910U (US07943777-20110517-C00090.png) | 1990-10-04 |
| JPH079614Y2 JPH079614Y2 (ja) | 1995-03-08 |
Family
ID=31256302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989030867U Expired - Fee Related JPH079614Y2 (ja) | 1989-03-20 | 1989-03-20 | 熱硬化性樹脂封止用金型 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH079614Y2 (US07943777-20110517-C00090.png) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61186416U (US07943777-20110517-C00090.png) * | 1985-05-15 | 1986-11-20 | ||
| JPS6237119A (ja) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | モ−ルド金型およびモ−ルド方法 |
| JPS6311314A (ja) * | 1986-07-02 | 1988-01-18 | Matsushita Electric Ind Co Ltd | 樹脂成形金型 |
| JPS6448432A (en) * | 1987-08-19 | 1989-02-22 | Hitachi Ltd | Molding die and manufacture of semiconductor device by using said die |
-
1989
- 1989-03-20 JP JP1989030867U patent/JPH079614Y2/ja not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61186416U (US07943777-20110517-C00090.png) * | 1985-05-15 | 1986-11-20 | ||
| JPS6237119A (ja) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | モ−ルド金型およびモ−ルド方法 |
| JPS6311314A (ja) * | 1986-07-02 | 1988-01-18 | Matsushita Electric Ind Co Ltd | 樹脂成形金型 |
| JPS6448432A (en) * | 1987-08-19 | 1989-02-22 | Hitachi Ltd | Molding die and manufacture of semiconductor device by using said die |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH079614Y2 (ja) | 1995-03-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |