JPH0212118U - - Google Patents
Info
- Publication number
- JPH0212118U JPH0212118U JP8987388U JP8987388U JPH0212118U JP H0212118 U JPH0212118 U JP H0212118U JP 8987388 U JP8987388 U JP 8987388U JP 8987388 U JP8987388 U JP 8987388U JP H0212118 U JPH0212118 U JP H0212118U
- Authority
- JP
- Japan
- Prior art keywords
- contact
- heat radiating
- radiating member
- thermal conductivity
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第１図および第２図は本考案に係る端子構造を
示す斜視図である。 １〜接点、２〜放熱部材、３〜接触片、４〜凹
凸部、５〜スリツト。
示す斜視図である。 １〜接点、２〜放熱部材、３〜接触片、４〜凹
凸部、５〜スリツト。
Claims (1)
- 端子片あるいは接触片上に熱伝導性の良好な放
熱部材を介して接点を取り付けた接点構造におい
て、前記放熱部材の表面に凹凸部あるいはスリツ
ト部を設けたことを特徴とする端子構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8987388U JPH0212118U (ja) | 1988-07-06 | 1988-07-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8987388U JPH0212118U (ja) | 1988-07-06 | 1988-07-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0212118U true JPH0212118U (ja) | 1990-01-25 |
Family
ID=31314408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8987388U Pending JPH0212118U (ja) | 1988-07-06 | 1988-07-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0212118U (ja) |
-
1988
- 1988-07-06 JP JP8987388U patent/JPH0212118U/ja active Pending