JPH02120690A - Cooling apparatus of electronic apparatus - Google Patents

Abstract

PURPOSE:To suppress the temp. rise of the integrated circuit element in an electron apparatus to a low level by controlling the amount of the liquid cooling medium sent into an object to be cooled so as to temporarily increase or decrease the same by the order from a control part to a flow rate valve at the time of load variation. CONSTITUTION:In this apparatus, an object 9 to be cooled is cooled by a method wherein a liquid cooling medium is subjected to heat-exchange in a heat exchanger 1 by the order of a control part 2 so as to become temp. slightly higher than circumferential temp. to reache a tank 3 and sent out by a pump 4 to pass through a flow rate valve 15. Since the capacity of a heat exchanger 1 is not issued soon when the power supply of an electronic apparatus 22 is closed, the control part emits an order for controlling an opening degree to the flow rate valve 5 and the liquid cooling medium is temporarily sent to the object 9 to be cooled in an amount more than a usual sending-out amount and the overshoot of the temp of the object 9 to be cooled is suppressed to a lower level.

Description

[Detailed description of the invention] [Industrial use? ] This article relates to a cooling device for supplying liquid chilled liquid to an electronic device such as an electronic computer, which is an object to be cooled.

[Prior Art] In general, electronic devices such as computers are equipped with a plurality of boards on which a large number of electronic circuit elements such as integrated circuits are mounted on a P5 board, and forced air cooling is performed by a fan mounted on the rack. However, in recent years, with the large-scale integration and high-density packaging of circuit elements T, the density of heat generation within the rack has increased, and liquid cooling systems are increasingly being adopted.

Examples of this liquid cooling method include a method in which a liquid refrigerant is poured onto a flat plate, circuit elements are brought into close contact with the flat plate, and heat is transferred to the refrigerant.

There is a cooling device having a configuration shown in FIG. 2, which circulates and supplies this type of liquid refrigerant to an electronic device as an object to be cooled and removes heat from the object to be cooled.

In FIG. 2, 21 is a cooling device, and 22 is an electronic device. 3 is a tank for storing liquid refrigerant and absorbing changes in volume due to temperature of the refrigerant; 4 is a pump for circulating and supplying the refrigerant to the electronic device 22;

5 is a constant flow valve for sending a fixed amount of refrigerant to the electronic device 22.

Further, 6 is a refrigerant outlet, 7 is a refrigerant receiving port, 1 is a heat exchanger for exchanging heat with the refrigerant, and 11 is a refrigerant pipe connecting these.

In the cooling device 21, the control unit 2 constantly monitors the temperature of the object to be cooled 9 in the electronic device 22 using a temperature sensor 8, and if a temperature abnormality occurs, the temperature is controlled from the temperature sensor 8 via a signal line 10. Abnormalities can be reported to Department 2. In addition, the control unit 2 constantly monitors the ambient temperature inside the electronic device 22 using an ambient temperature sensor 12 disposed within the electronic device 22, and the ambient temperature detected by the ambient temperature sensor 12 and transmitted via the signal line 10. Operation command line 1 for heat exchange ml so that the liquid refrigerant has a slightly higher temperature
Control commands are issued via 4.

[Problems to be Solved] The conventional cooling device described above does not maintain the constant flow rate valve 5 even during load fluctuations that occur when the electronic equipment RL122 is powered on or off.
Since a certain amount of chilled tofu is fed into the object 9 to be cooled, if the object 9 to be cooled cannot be sufficiently cooled and there is an electronic device whose power must be cut off among the plurality of electronic devices 22,
Sending a fixed amount of liquid refrigerant to the object to be cooled 9 has a problem in that it adversely affects the reliability of the electronic device 22 and becomes a cause of dew condensation.

The present invention has been made in view of the above-mentioned problems, and makes it possible to temporarily increase or decrease the temperature of the liquid refrigerant sent to the object to be cooled, thereby reducing the temperature rise of integrated circuit elements in electronic devices due to the rise in the temperature of the liquid refrigerant. The purpose of this project is to provide a cooling device for electronic devices that can be kept within a small range.

[Means for Solving the Problems] In order to achieve the above object, a cooling device according to the present invention that cools an electronic device having an object to be cooled by circulating a liquid refrigerant includes a sensor that monitors the temperature of the object to be cooled, a temperature sensor that monitors the ambient temperature within the device; a control unit that uses these temperature sensors to command the refrigerant wave interval adjustment when the electronic device is turned on and off, and when A load changes; The device is installed in the middle of the piping of the circulation device and controls the opening degree based on a command from the control device.
7, and the liquid refrigerant meteor flowing through the circulation device is 2g1
This is a configuration consisting of a flow rate valve for flA.

[Example] Hereinafter, an example of the present invention will be described with reference to the drawings. In the following, parts that are common to those of the prior art are given the same reference numerals, and redundant explanations will be omitted.

FIG. 1 is a block diagram showing the configuration of an embodiment of the present invention.

In the figure, 15 is the flow j11 valve, and unlike the conventional one, the opening degree, ijl
The flow rate of the refrigerant can be controlled by adjusting the flow rate. In the liquid chilled tofu cycle, the refrigerant enters through the refrigerant intake 7, passes through the chilled tofu piping 11, passes through the heat exchanger 1, and reaches the tank 3. From the pump 4, it passes through the flow valve 15, and then from the refrigerant outlet 6 to each cooled object 9.
The structure is as follows.

The control unit 2 constantly monitors the temperature inside the electronic device 22 using the temperature sensor 8 and the ambient temperature sensor 12 as in the conventional case. In addition, the control unit 2 issues a command to the heat exchanger l via the operation command line 14 to exchange heat so that the temperature of the liquid refrigerant becomes slightly higher than the atmospheric humidity, and when the electronic device 22 is powered on or off, etc. When a load change occurs, the opening degree of the flow valve 15 is adjusted by the operation command line 13 connected to the flow valve 15, and the amount of liquid refrigerant sent from the pump 4 to the object to be cooled 9 through the FL welfare valve 15 is adjusted. 4.In other words, the cooling of the object 9 to be cooled by this device is performed by using the liquid refrigerant in the heat exchanger 1 according to the command from the control unit 2, at a temperature slightly higher than the ambient temperature. The liquid refrigerant is exchanged to reach the desired temperature, then reaches the tank 3, where it is pumped out by the pump 4, passes through the flow valve 15, and reaches the object to be cooled 9.
It is supposed to cool down.

'When turning on the power to the heat exchanger 2122,
Since the capacity is not available immediately, the control unit issues a command to adjust the opening degree of the flow rate valve 15, and temporarily causes a larger amount of liquid refrigerant to be sent to the object to be cooled 9 than the liquid refrigerant that is normally sent out. , to narrow the open neatness of the temperature of the object to be cooled 9.

[Effects of the Investigation] As explained above, the cooling device of the present invention has the advantage that the heat exchanger capacity cannot be utilized immediately when the power of an electronic device is turned on or off, or when the load fluctuates due to a change in the load of a child device. By controlling the amount of liquid refrigerant sent to the object to be cooled by increasing or decreasing the amount of liquid refrigerant sent to the object to be cooled by commands from the control unit to the flow rate valve, the temperature of the liquid refrigerant −f=”A can reduce the accumulation in electronic devices. This has the effect of being able to suppress the temperature A of the circuit elements to a small extent, and also has the effect of effectively taking measures against dew condensation within the electronic device.

[Brief explanation of the drawing]

FIG. 1 is a block diagram showing the structure of a cooling device according to an embodiment of the present invention, and FIG. 2 is a block diagram showing the structure of a conventional cooling device. 1: Heat exchanger 2 2 Control unit 3: Tank 4: Pump 8: Temperature sensor 9: Cooled object 11: Refrigerant distribution 12; Ambient temperature sensor 15: Flow valve 21; Cooling device 22/electronic device agent Patent attorney g mo watanabe

Claims (1)

[Claims] A cooling device that cools an electronic device having an object to be cooled inside thereof by circulating a liquid refrigerant, comprising: a sensor that monitors the temperature of the object to be cooled; and a temperature sensor that monitors the ambient temperature within the electronic device. , a control section that uses these temperature sensors to command the refrigerant flow rate adjustment when powering on and off the electronic device, and when changing the load; a circulation device for the liquid refrigerant; and a control section provided in the middle of piping of the circulation device; 1. A cooling device for an electronic device, comprising a flow valve whose opening degree is varied based on a command from a control device to adjust the flow rate of liquid refrigerant flowing through the circulation device.