JPH02118948U - - Google Patents

Info

Publication number
JPH02118948U
JPH02118948U JP2686689U JP2686689U JPH02118948U JP H02118948 U JPH02118948 U JP H02118948U JP 2686689 U JP2686689 U JP 2686689U JP 2686689 U JP2686689 U JP 2686689U JP H02118948 U JPH02118948 U JP H02118948U
Authority
JP
Japan
Prior art keywords
lead
mounting base
element mounting
semiconductor element
suspension lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2686689U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2686689U priority Critical patent/JPH02118948U/ja
Publication of JPH02118948U publication Critical patent/JPH02118948U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2686689U 1989-03-08 1989-03-08 Pending JPH02118948U (US06605200-20030812-C00035.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2686689U JPH02118948U (US06605200-20030812-C00035.png) 1989-03-08 1989-03-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2686689U JPH02118948U (US06605200-20030812-C00035.png) 1989-03-08 1989-03-08

Publications (1)

Publication Number Publication Date
JPH02118948U true JPH02118948U (US06605200-20030812-C00035.png) 1990-09-25

Family

ID=31248877

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2686689U Pending JPH02118948U (US06605200-20030812-C00035.png) 1989-03-08 1989-03-08

Country Status (1)

Country Link
JP (1) JPH02118948U (US06605200-20030812-C00035.png)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129493A (ja) * 1991-11-05 1993-05-25 Hitachi Cable Ltd リードフレームの製造方法
WO2013024561A1 (ja) * 2011-08-12 2013-02-21 シャープ株式会社 発光装置
JP2016105506A (ja) * 2016-02-24 2016-06-09 シャープ株式会社 発光装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129493A (ja) * 1991-11-05 1993-05-25 Hitachi Cable Ltd リードフレームの製造方法
WO2013024561A1 (ja) * 2011-08-12 2013-02-21 シャープ株式会社 発光装置
JP2013041951A (ja) * 2011-08-12 2013-02-28 Sharp Corp 発光装置
US9331254B2 (en) 2011-08-12 2016-05-03 Sharp Kabushiki Kaisha Light emitting device
US9537072B2 (en) 2011-08-12 2017-01-03 Sharp Kabushiki Kaisha Light emitting device, lead frame and resin cavity molding package
JP2016105506A (ja) * 2016-02-24 2016-06-09 シャープ株式会社 発光装置

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