JPH02117382U

JPH02117382U -

Info

Publication number: JPH02117382U
Application number: JP2631089U
Authority: JP
Priority date: 1989-03-08
Filing date: 1989-03-08
Publication date: 1990-09-20

Description

[Brief explanation of drawings]

第１図は本考案の一実施例の電子部品包装運搬
用トレーを示す一部切欠斜視図、第２図は本発明
の実施例の裏底面の斜視図、第３図、第４図は本
発明の使用状況の断面図、第５図は従来の電子部
品包装運搬用トレーを示す一部切欠斜視図、第６
図、第７図は従来品の使用状況断面図である。１１……成形品トレー本体、１２……雌型段差
、１３……底面、１４……中仕切り、１５……ス
ペース、１６……裏底面、１７……裏底面突状型
中仕切り、１８……裏底面突状型外枠、１９……
外枠、２０……電子部品、２１……すき間。 FIG. 1 is a partially cutaway perspective view showing a tray for packaging and transporting electronic components according to an embodiment of the present invention, FIG. 2 is a perspective view of the back bottom of an embodiment of the present invention, and FIGS. FIG. 5 is a sectional view of the usage of the invention; FIG. 5 is a partially cutaway perspective view showing a conventional tray for packaging and transporting electronic components;
7 are sectional views of the conventional product in use. 11... Molded product tray body, 12... Female mold step, 13... Bottom surface, 14... Middle partition, 15... Space, 16... Back bottom surface, 17... Back bottom protruding mold middle partition, 18... ...Back bottom protruding outer frame, 19...
Outer frame, 20...Electronic components, 21...Gap.

Claims

[Scope of utility model registration request]

A molded product tray body consisting of an outer frame and a bottom part is provided with a partition on the bottom part for separating electronic components in a fixed amount or individually, and the partition is provided on the back bottom surface on the opposite side of the bottom part where the partition is installed. A projecting-shaped inner partition and a projecting-shaped outer frame are provided at positions opposite to the position where the projecting-shaped inner partition is installed, and the sum of the above-mentioned inner partition and the above-mentioned projecting-shaped inner partition is at least smaller than the height from the bottom of the bottom part to the top of the outer frame. Tray for packaging and transporting electronic components.