JPH02116739U - - Google Patents
Info
- Publication number
- JPH02116739U JPH02116739U JP1997790U JP1997790U JPH02116739U JP H02116739 U JPH02116739 U JP H02116739U JP 1997790 U JP1997790 U JP 1997790U JP 1997790 U JP1997790 U JP 1997790U JP H02116739 U JPH02116739 U JP H02116739U
- Authority
- JP
- Japan
- Prior art keywords
- scribe line
- compound semiconductor
- substrate
- dividing
- semiconductor wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 claims 3
- 239000010409 thin film Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990019977U JPH0622991Y2 (ja) | 1990-02-28 | 1990-02-28 | 化合物半導体ウエハ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990019977U JPH0622991Y2 (ja) | 1990-02-28 | 1990-02-28 | 化合物半導体ウエハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02116739U true JPH02116739U (US08124630-20120228-C00102.png) | 1990-09-19 |
| JPH0622991Y2 JPH0622991Y2 (ja) | 1994-06-15 |
Family
ID=31235964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990019977U Expired - Lifetime JPH0622991Y2 (ja) | 1990-02-28 | 1990-02-28 | 化合物半導体ウエハ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622991Y2 (US08124630-20120228-C00102.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009538528A (ja) * | 2006-05-25 | 2009-11-05 | スカイワークス ソリューションズ，インコーポレイテッド | 改善された半導体シールリング |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919012A (US08124630-20120228-C00102.png) * | 1972-06-12 | 1974-02-20 | ||
| JPS4933907A (US08124630-20120228-C00102.png) * | 1972-07-28 | 1974-03-28 | ||
| JPS55124243A (en) * | 1979-03-20 | 1980-09-25 | Nec Corp | Compound semiconductor device |
| JPS57164546A (en) * | 1981-04-03 | 1982-10-09 | Oki Electric Ind Co Ltd | Semiconductor device |
| JPS5893266A (ja) * | 1981-11-30 | 1983-06-02 | Toshiba Corp | 半導体集積回路 |
-
1990
- 1990-02-28 JP JP1990019977U patent/JPH0622991Y2/ja not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919012A (US08124630-20120228-C00102.png) * | 1972-06-12 | 1974-02-20 | ||
| JPS4933907A (US08124630-20120228-C00102.png) * | 1972-07-28 | 1974-03-28 | ||
| JPS55124243A (en) * | 1979-03-20 | 1980-09-25 | Nec Corp | Compound semiconductor device |
| JPS57164546A (en) * | 1981-04-03 | 1982-10-09 | Oki Electric Ind Co Ltd | Semiconductor device |
| JPS5893266A (ja) * | 1981-11-30 | 1983-06-02 | Toshiba Corp | 半導体集積回路 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009538528A (ja) * | 2006-05-25 | 2009-11-05 | スカイワークス ソリューションズ，インコーポレイテッド | 改善された半導体シールリング |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622991Y2 (ja) | 1994-06-15 |
