JPH02115478U - - Google Patents

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Publication number
JPH02115478U
JPH02115478U JP2316189U JP2316189U JPH02115478U JP H02115478 U JPH02115478 U JP H02115478U JP 2316189 U JP2316189 U JP 2316189U JP 2316189 U JP2316189 U JP 2316189U JP H02115478 U JPH02115478 U JP H02115478U
Authority
JP
Japan
Prior art keywords
card
base
molding material
semiconductor device
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2316189U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2316189U priority Critical patent/JPH02115478U/ja
Publication of JPH02115478U publication Critical patent/JPH02115478U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2316189U 1989-03-01 1989-03-01 Pending JPH02115478U (US07345094-20080318-C00003.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2316189U JPH02115478U (US07345094-20080318-C00003.png) 1989-03-01 1989-03-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2316189U JPH02115478U (US07345094-20080318-C00003.png) 1989-03-01 1989-03-01

Publications (1)

Publication Number Publication Date
JPH02115478U true JPH02115478U (US07345094-20080318-C00003.png) 1990-09-14

Family

ID=31241924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2316189U Pending JPH02115478U (US07345094-20080318-C00003.png) 1989-03-01 1989-03-01

Country Status (1)

Country Link
JP (1) JPH02115478U (US07345094-20080318-C00003.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119558A (ja) * 2010-12-02 2012-06-21 Sony Corp 半導体装置及びその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224151A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体装置
JPS63185689A (ja) * 1987-01-28 1988-08-01 三菱電機株式会社 薄型半導体カ−ド
JPH01253494A (ja) * 1988-04-02 1989-10-09 Hitachi Ltd 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224151A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体装置
JPS63185689A (ja) * 1987-01-28 1988-08-01 三菱電機株式会社 薄型半導体カ−ド
JPH01253494A (ja) * 1988-04-02 1989-10-09 Hitachi Ltd 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012119558A (ja) * 2010-12-02 2012-06-21 Sony Corp 半導体装置及びその製造方法

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