JPH02114965U - - Google Patents
Info
- Publication number
- JPH02114965U JPH02114965U JP2330989U JP2330989U JPH02114965U JP H02114965 U JPH02114965 U JP H02114965U JP 2330989 U JP2330989 U JP 2330989U JP 2330989 U JP2330989 U JP 2330989U JP H02114965 U JPH02114965 U JP H02114965U
- Authority
- JP
- Japan
- Prior art keywords
- view
- leads
- showing
- sectional
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の第１の実施例を示す組立分解
斜視図、第２図は第１図の組立完了斜視図、第３
図は第２図のＡ−Ａ線に沿う断面図、第４図は第
２図のＢ−Ｂ線に沿う断面図、第５図は正常な姿
勢にあるリードの接続状態を示す拡大断面図、第
６図は曲がりが発生したリードの接続状態を示す
断面図である。第７図は異方導電性ゴムの他の例
を示す斜視図である。第８図は本考案の第２の実
施例を示す組立分解斜視図、第９図は第８図の組
立完了斜視図、第１０図は第９図のＣ−Ｃ線に沿
う断面図、第１１図は第９図のＤ−Ｄ線に沿う断
面図である。第１２図は本考案の第３の実施例を
示す組立分解斜視図、第１３図は第１２図の組立
完了斜視図、第１４図は第１３図のＥ−Ｅ線に沿
う断面図である。第１５図は異方導電性ゴムの他
の例を示す斜視図である。第１６図は本考案の第
４の実施例を示す組立分解斜視図、第１７図は第
１６図の組立完了斜視図、第１８図は第１７図の
Ｆ−Ｆ線に沿う断面図である。第１９図は本考案
の第５の実施例を示す組立分解斜視図、第２０図
は第１９図の組立完了斜視図、第２１図は第２０
図のＧ−Ｇ線に沿う断面図である。第２２図はリ
ード付き電子部品の組付け構体の従来例を示す組
立分解斜視図、第２３図は電子部品の組立完了状
態を示す断面図、第２４図は電子部品のリードに
曲がりが発生した状態を示す拡大断面図である。
１１……電子部品、１２……部品本体、１３…
…リード、１４……被マウント部材（プリント配
線体）、１６……配線パターン、２０，２０′…
…導電性を有する弾性部材（異方導電性ゴム）、
２７，２７′，４０，４４……支持機構。
FIG. 1 is an exploded perspective view showing the first embodiment of the present invention, FIG. 2 is a perspective view of the completed assembly of FIG. 1, and FIG.
The figure is a cross-sectional view taken along the line A-A in Figure 2, Figure 4 is a cross-sectional view taken along the line B-B in Figure 2, and Figure 5 is an enlarged cross-sectional view showing the connected state of the lead in a normal position. , FIG. 6 is a sectional view showing a connected state of a lead in which a bend has occurred. FIG. 7 is a perspective view showing another example of anisotropically conductive rubber. 8 is an exploded perspective view showing the second embodiment of the present invention, FIG. 9 is a perspective view of the completed assembly of FIG. 8, FIG. FIG. 11 is a sectional view taken along line DD in FIG. 9. Fig. 12 is an exploded perspective view showing a third embodiment of the present invention, Fig. 13 is a perspective view of the completed assembly of Fig. 12, and Fig. 14 is a sectional view taken along line E-E in Fig. 13. . FIG. 15 is a perspective view showing another example of anisotropically conductive rubber. Fig. 16 is an exploded perspective view showing a fourth embodiment of the present invention, Fig. 17 is a perspective view of the completed assembly of Fig. 16, and Fig. 18 is a sectional view taken along the line FF in Fig. 17. . FIG. 19 is an exploded perspective view showing the fifth embodiment of the present invention, FIG. 20 is a perspective view of the completed assembly of FIG. 19, and FIG.
FIG. 3 is a cross-sectional view taken along line GG in the figure. Fig. 22 is an exploded perspective view showing a conventional example of an assembly structure for electronic components with leads, Fig. 23 is a sectional view showing a completed state of assembly of the electronic parts, and Fig. 24 shows bending of the leads of the electronic parts. It is an enlarged sectional view showing a state. 11...Electronic component, 12...Part body, 13...
...Lead, 14...Mounted member (printed wiring body), 16...Wiring pattern, 20, 20'...
...Elastic member with conductivity (anisotropic conductive rubber),
27, 27', 40, 44...Support mechanism.
Claims (1)
子部品を、その部品本体から導出されたリードを
マウント部位の配線パターンに電気的に接続して
実装したリード付き電子部品の組付け構体におい
て、 上記被マウント部材のマウント部位に在る配線
パターンと電子部品のリードとの間に導電性を有
する弾性部材を介在させ、その弾性部材に上記リ
ードを押え付ける支持機構を具備したことを特徴
とするリード付き電子部品の組付け構体。[Scope of Claim for Utility Model Registration] An assembly of electronic parts with leads mounted on the mounting part of a mounted member by electrically connecting the leads derived from the main body of the part to the wiring pattern of the mounting part. In the mounting structure, a conductive elastic member is interposed between the wiring pattern at the mounting portion of the mounted member and the lead of the electronic component, and a support mechanism is provided to press the lead against the elastic member. An assembly structure for electronic components with leads, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2330989U JPH02114965U (en) | 1989-02-28 | 1989-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2330989U JPH02114965U (en) | 1989-02-28 | 1989-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114965U true JPH02114965U (en) | 1990-09-14 |
Family
ID=31242183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2330989U Pending JPH02114965U (en) | 1989-02-28 | 1989-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114965U (en) |
-
1989
- 1989-02-28 JP JP2330989U patent/JPH02114965U/ja active Pending
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