JPH02114942U - - Google Patents

Info

Publication number
JPH02114942U
JPH02114942U JP2224289U JP2224289U JPH02114942U JP H02114942 U JPH02114942 U JP H02114942U JP 2224289 U JP2224289 U JP 2224289U JP 2224289 U JP2224289 U JP 2224289U JP H02114942 U JPH02114942 U JP H02114942U
Authority
JP
Japan
Prior art keywords
mounting board
semiconductor chip
ceramic film
region
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2224289U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2224289U priority Critical patent/JPH02114942U/ja
Publication of JPH02114942U publication Critical patent/JPH02114942U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
JP2224289U 1989-02-28 1989-02-28 Pending JPH02114942U (el)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2224289U JPH02114942U (el) 1989-02-28 1989-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2224289U JPH02114942U (el) 1989-02-28 1989-02-28

Publications (1)

Publication Number Publication Date
JPH02114942U true JPH02114942U (el) 1990-09-14

Family

ID=31240181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2224289U Pending JPH02114942U (el) 1989-02-28 1989-02-28

Country Status (1)

Country Link
JP (1) JPH02114942U (el)

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