JPH02114462U - - Google Patents
Info
- Publication number
- JPH02114462U JPH02114462U JP2375489U JP2375489U JPH02114462U JP H02114462 U JPH02114462 U JP H02114462U JP 2375489 U JP2375489 U JP 2375489U JP 2375489 U JP2375489 U JP 2375489U JP H02114462 U JPH02114462 U JP H02114462U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- hardness
- low
- wheel
- circumferential side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 239000004566 building material Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Description
添付図面は本考案の実施例を示し、第1図から
第5図までは第1実施例を示しており、第1図は
チツプを配設したホイールの外観図、第2図は被
研摩材の断面図を含む研摩時の第1図X−X′線
に沿つた断面の端面図、第3図は第1図の円A内
の拡大図、第4図は第3図Y−Y線に沿つた断面
の端面図、第5図はチツプの製造工程を示す為の
工程図、第6図は第2実施例のチツプのチツプ面
を示す拡大図、第7図は第3実施例のチツプのチ
ツプ面を示す拡大図、第8図は第4実施例のチツ
プのチツプ面を示す拡大図、である。
尚図中、1……チツプ、2……チツプ面、3…
…低硬度研摩面、4……高硬度研摩面、5……ホ
イール、6……被研摩材、7……ホイール面、8
……シヤンク、10……低硬度研摩体、11……
高硬度研摩体、13……カーボン型、14,15
……プレス型、矢示T……低硬度研摩面の波の山
、間隔H……波の山の高さ、間隔L……波の隣り
合う山の間隔、間隔H′……帯状の低硬度研摩面
の幅、矢示R……ホイールの回転、矢示I……内
周側、矢示O……外周側、をそれぞれ示す。
The attached drawings show an embodiment of the present invention, and Fig. 1 to Fig. 5 show the first embodiment. Figure 1 is an end view of the cross section taken along the line X-X' during polishing, Figure 3 is an enlarged view of the circle A in Figure 1, and Figure 4 is the Y-Y line in Figure 3. 5 is a process diagram showing the manufacturing process of the chip, FIG. 6 is an enlarged view showing the chip surface of the chip of the second embodiment, and FIG. 7 is an end view of the chip of the third embodiment. FIG. 8 is an enlarged view showing the chip surface of the chip of the fourth embodiment. In the figure, 1...chip, 2...chip surface, 3...
...Low hardness polished surface, 4...High hardness polished surface, 5...Wheel, 6...Material to be polished, 7...Wheel surface, 8
...Shank, 10...Low hardness abrasive body, 11...
High hardness abrasive body, 13... Carbon type, 14, 15
……Press mold, arrow T……crests of waves on low hardness polished surface, interval H……height of crests of waves, interval L……interval between adjacent crests of waves, interval H′……band-like low The width of the hardness-polished surface, the arrow R indicates the rotation of the wheel, the arrow I indicates the inner circumferential side, and the arrow O indicates the outer circumferential side.
Claims (1)
研摩材の表面仕上・研摩の為の、シヤンクの先端
に設けられると共に当該シヤンクを介して駆動さ
れて回転せしめられる略円板形状のホイールのホ
イール面に、上記ホイールの内周側から外周側に
向かう径方向に沿つて複数配設されると共にそれ
ら全体としては放射状に配設されたチツプであつ
て、当該チツプの個々は2つの高硬度研摩体の間
に当該高硬度研摩体に比して硬度の低い低硬度研
摩体を設けて成ることにより上記チツプの上記被
研摩材に当たるべきチツプ面が高硬度研摩面と低
硬度研摩面で成るものであるポリツシヤー用チツ
プに於いて; 上記チツプ1のうちの個々は、上記低硬度研摩
面3と上記高硬度研摩面4で成る上記チツプ面2
のうちの上記低硬度研摩面3の面積が、上記内周
側Iの上記低硬度研摩面3の面積に比して上記外
周側Oの上記低硬度研摩面3の面積の方が小さく
成るよう形成されていることを特徴とするポリツ
シヤー用チツプ。 上記低硬度研摩面3は、上記チツプ面2上で
上記ホイール5の径方向に沿つて伸びる帯状と成
されていると共に上記チツプ面2上で波状と成さ
れており、しかも上記波の山Tの隣り合う山Tの
間隔L1,L2,L3,L4,L5……が上記内
周側Iから外周側Oに向かうに従つて大きくなる
よう形成されていることを特徴とする請求項第1
項記載のポリツシヤー用チツプ。 上記低硬度研摩面3は、上記チツプ面2上で
上記ホイール5の径方向に沿つて伸びる帯状と成
されていると共に上記チツプ面2上で波状と成さ
れており、しかも上記波の山Tの各々の高さH1
,H2,H3,H4,H5,H6……が、上記内
周側Iから上記外周側Oに向かうに従つて小さく
なるよう形成されていることを特徴とする請求項
第1項記載のポリツシヤー用チツプ。 上記低硬度研摩面3は上記チツプ面2上で上
記ホイール5の径方向に沿つて伸びる帯状と成さ
れており、しかも上記帯状の上記低硬度研摩面3
の幅H′が上記内周面側Iから上記外周側Oに向
かうに従い連続的に小さく成るよう形成されてい
ることを特徴とする請求項第1項及び第2項並び
に第3項記載のポリツシヤー用チツプ。[Claim for Utility Model Registration] A substantially circular plate that is provided at the tip of a shank and is driven and rotated through the shank for surface finishing and polishing of materials to be polished such as stone, building materials, metals, and glass. A plurality of chips are arranged along the radial direction from the inner circumferential side to the outer circumferential side of the wheel on the wheel surface of the shaped wheel, and the chips are arranged radially as a whole, and each of the chips is individually arranged. By providing a low-hardness abrasive body having a lower hardness than the high-hardness abrasive body between two high-hardness abrasive bodies, the tip surface of the chip that should be in contact with the material to be polished is a high-hardness abrasive surface and a low-hardness abrasive surface. In a polisher chip consisting of an abrasive surface;
The area of the low hardness polished surface 3 on the outer peripheral side O is smaller than the area of the low hardness polished surface 3 on the inner peripheral side I. A polisher tip characterized by having a The low-hardness abrasive surface 3 has a band shape extending along the radial direction of the wheel 5 on the chip surface 2, and is also wavy on the chip surface 2, and has crests T of the waves. Claim 1, characterized in that the distances L1, L2, L3, L4, L5, .
Chip for polisher as described in section. The low-hardness abrasive surface 3 has a band shape extending along the radial direction of the wheel 5 on the chip surface 2, and is also wavy on the chip surface 2, and has crests T of the waves. The height H1 of each
, H2, H3, H4, H5, H6... are formed to become smaller from the inner circumferential side I toward the outer circumferential side O. Chip. The low-hardness abrasive surface 3 has a band shape extending along the radial direction of the wheel 5 on the chip surface 2, and the low-hardness abrasive surface 3 is in the form of a band.
The polisher according to claims 1, 2, and 3, wherein the width H' of the polisher is formed so as to become continuously smaller from the inner circumferential side I toward the outer circumferential side O. Chip for use.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989023754U JPH078133Y2 (en) | 1989-03-01 | 1989-03-01 | Polisher tip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989023754U JPH078133Y2 (en) | 1989-03-01 | 1989-03-01 | Polisher tip |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02114462U true JPH02114462U (en) | 1990-09-13 |
JPH078133Y2 JPH078133Y2 (en) | 1995-03-01 |
Family
ID=31243010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989023754U Expired - Lifetime JPH078133Y2 (en) | 1989-03-01 | 1989-03-01 | Polisher tip |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH078133Y2 (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186262U (en) * | 1981-05-21 | 1982-11-26 | ||
JPS5817726U (en) * | 1981-07-27 | 1983-02-03 | シャープ株式会社 | key circuit board |
-
1989
- 1989-03-01 JP JP1989023754U patent/JPH078133Y2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57186262U (en) * | 1981-05-21 | 1982-11-26 | ||
JPS5817726U (en) * | 1981-07-27 | 1983-02-03 | シャープ株式会社 | key circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPH078133Y2 (en) | 1995-03-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |