JPH0211391U - - Google Patents

Info

Publication number

JPH0211391U

JPH0211391U JP8926888U JP8926888U JPH0211391U JP H0211391 U JPH0211391 U JP H0211391U JP 8926888 U JP8926888 U JP 8926888U JP 8926888 U JP8926888 U JP 8926888U JP H0211391 U JPH0211391 U JP H0211391U

Authority

JP

Japan

Prior art keywords

heat dissipation

copper foil

double

circuit board

generating component

Prior art date

1988-07-05

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
• 239000011889 copper foil Substances 0.000 claims description 5
• 230000017525 heat dissipation Effects 0.000 claims description 5
• 239000004020 conductor Substances 0.000 claims description 2
• 230000005855 radiation Effects 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1

Cited By (3)