JPH0211360U - - Google Patents
Info
- Publication number
- JPH0211360U JPH0211360U JP1988089180U JP8918088U JPH0211360U JP H0211360 U JPH0211360 U JP H0211360U JP 1988089180 U JP1988089180 U JP 1988089180U JP 8918088 U JP8918088 U JP 8918088U JP H0211360 U JPH0211360 U JP H0211360U
- Authority
- JP
- Japan
- Prior art keywords
- type
- emitting diode
- silicon carbide
- type layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089180U JPH0644116Y2 (ja) | 1988-07-05 | 1988-07-05 | 炭化ケイ素発光ダイオード装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089180U JPH0644116Y2 (ja) | 1988-07-05 | 1988-07-05 | 炭化ケイ素発光ダイオード装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211360U true JPH0211360U (US07122547-20061017-C00273.png) | 1990-01-24 |
| JPH0644116Y2 JPH0644116Y2 (ja) | 1994-11-14 |
Family
ID=31313734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988089180U Expired - Lifetime JPH0644116Y2 (ja) | 1988-07-05 | 1988-07-05 | 炭化ケイ素発光ダイオード装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644116Y2 (US07122547-20061017-C00273.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002336275A (ja) * | 2001-05-17 | 2002-11-26 | Yoshida Dental Mfg Co Ltd | 歯科用光照射器 |
| WO2007126074A1 (ja) * | 2006-04-28 | 2007-11-08 | Shimane Prefectural Government | 半導体発光モジュール、装置、およびその製造方法 |
| JPWO2014196285A1 (ja) * | 2013-06-04 | 2017-02-23 | 富士電機株式会社 | 半導体装置 |
-
1988
- 1988-07-05 JP JP1988089180U patent/JPH0644116Y2/ja not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002336275A (ja) * | 2001-05-17 | 2002-11-26 | Yoshida Dental Mfg Co Ltd | 歯科用光照射器 |
| WO2007126074A1 (ja) * | 2006-04-28 | 2007-11-08 | Shimane Prefectural Government | 半導体発光モジュール、装置、およびその製造方法 |
| JP2009290238A (ja) * | 2006-04-28 | 2009-12-10 | Shimane Pref Gov | 半導体発光モジュール、およびその製造方法 |
| KR101136442B1 (ko) * | 2006-04-28 | 2012-04-19 | 가부시키가이샤 시마네 덴시 이마후쿠 세이사쿠쇼 | 반도체 발광모듈, 장치 및 그 제조방법 |
| JPWO2014196285A1 (ja) * | 2013-06-04 | 2017-02-23 | 富士電機株式会社 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644116Y2 (ja) | 1994-11-14 |
