JPH02113334U - - Google Patents
Info
- Publication number
- JPH02113334U JPH02113334U JP1989019548U JP1954889U JPH02113334U JP H02113334 U JPH02113334 U JP H02113334U JP 1989019548 U JP1989019548 U JP 1989019548U JP 1954889 U JP1954889 U JP 1954889U JP H02113334 U JPH02113334 U JP H02113334U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- preheating
- crimping
- substrate
- metal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/075—
-
- H10W72/07141—
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- H10W72/5363—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019548U JPH02113334U (index.php) | 1989-02-23 | 1989-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019548U JPH02113334U (index.php) | 1989-02-23 | 1989-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113334U true JPH02113334U (index.php) | 1990-09-11 |
Family
ID=31235158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989019548U Pending JPH02113334U (index.php) | 1989-02-23 | 1989-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113334U (index.php) |
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1989
- 1989-02-23 JP JP1989019548U patent/JPH02113334U/ja active Pending