JPH02113334U - - Google Patents

Info

Publication number
JPH02113334U
JPH02113334U JP1989019548U JP1954889U JPH02113334U JP H02113334 U JPH02113334 U JP H02113334U JP 1989019548 U JP1989019548 U JP 1989019548U JP 1954889 U JP1954889 U JP 1954889U JP H02113334 U JPH02113334 U JP H02113334U
Authority
JP
Japan
Prior art keywords
pad
preheating
crimping
substrate
metal conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989019548U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989019548U priority Critical patent/JPH02113334U/ja
Publication of JPH02113334U publication Critical patent/JPH02113334U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を示す図、第２図はそ
の作動状態を示す図である。 第１図において、１は基板、２は金属導体、３
は圧着ツール、４は予熱ロツド、４０は発熱体、
４１は伝熱棒である。 FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing its operating state. In FIG. 1, 1 is a substrate, 2 is a metal conductor, and 3
is a crimping tool, 4 is a preheating rod, 40 is a heating element,
41 is a heat transfer rod.

Claims (1)

【実用新案登録請求の範囲】 基板１上に形成されたパツド１０上に金属導体
２を圧着する圧着ツール３と、 この圧着ツール３のパツド１０上への降下に先
だつてパツド１０上に降下し、該パツド１０を予
熱する予熱ロツド４とを有してなるワイヤボンダ
のボンデイングヘツド。[Claims for Utility Model Registration] A crimping tool 3 for crimping a metal conductor 2 onto a pad 10 formed on a substrate 1; , and a preheating rod 4 for preheating the pad 10.
JP1989019548U 1989-02-23 1989-02-23 Pending JPH02113334U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989019548U JPH02113334U (en) 1989-02-23 1989-02-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989019548U JPH02113334U (en) 1989-02-23 1989-02-23

Publications (1)

Publication Number Publication Date
JPH02113334U true JPH02113334U (en) 1990-09-11

Family

ID=31235158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989019548U Pending JPH02113334U (en) 1989-02-23 1989-02-23

Country Status (1)

Country Link
JP (1) JPH02113334U (en)

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