JPH02113334U - - Google Patents
Info
- Publication number
- JPH02113334U JPH02113334U JP1989019548U JP1954889U JPH02113334U JP H02113334 U JPH02113334 U JP H02113334U JP 1989019548 U JP1989019548 U JP 1989019548U JP 1954889 U JP1954889 U JP 1954889U JP H02113334 U JPH02113334 U JP H02113334U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- preheating
- crimping
- substrate
- metal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019548U JPH02113334U (enFirst) | 1989-02-23 | 1989-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989019548U JPH02113334U (enFirst) | 1989-02-23 | 1989-02-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113334U true JPH02113334U (enFirst) | 1990-09-11 |
Family
ID=31235158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989019548U Pending JPH02113334U (enFirst) | 1989-02-23 | 1989-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113334U (enFirst) |
-
1989
- 1989-02-23 JP JP1989019548U patent/JPH02113334U/ja active Pending