JPH0211328U - - Google Patents
Info
- Publication number
- JPH0211328U JPH0211328U JP8969588U JP8969588U JPH0211328U JP H0211328 U JPH0211328 U JP H0211328U JP 8969588 U JP8969588 U JP 8969588U JP 8969588 U JP8969588 U JP 8969588U JP H0211328 U JPH0211328 U JP H0211328U
- Authority
- JP
- Japan
- Prior art keywords
- island
- wiring pattern
- chip
- bonding pad
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969588U JPH0211328U (fr) | 1988-07-05 | 1988-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8969588U JPH0211328U (fr) | 1988-07-05 | 1988-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211328U true JPH0211328U (fr) | 1990-01-24 |
Family
ID=31314240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8969588U Pending JPH0211328U (fr) | 1988-07-05 | 1988-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211328U (fr) |
-
1988
- 1988-07-05 JP JP8969588U patent/JPH0211328U/ja active Pending