JPS63140642U - - Google Patents
Info
- Publication number
- JPS63140642U JPS63140642U JP3207187U JP3207187U JPS63140642U JP S63140642 U JPS63140642 U JP S63140642U JP 3207187 U JP3207187 U JP 3207187U JP 3207187 U JP3207187 U JP 3207187U JP S63140642 U JPS63140642 U JP S63140642U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- bonding pad
- shape
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3207187U JPS63140642U (fr) | 1987-03-04 | 1987-03-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3207187U JPS63140642U (fr) | 1987-03-04 | 1987-03-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63140642U true JPS63140642U (fr) | 1988-09-16 |
Family
ID=30838393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3207187U Pending JPS63140642U (fr) | 1987-03-04 | 1987-03-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63140642U (fr) |
-
1987
- 1987-03-04 JP JP3207187U patent/JPS63140642U/ja active Pending