JPH02113267U - - Google Patents
Info
- Publication number
- JPH02113267U JPH02113267U JP2179589U JP2179589U JPH02113267U JP H02113267 U JPH02113267 U JP H02113267U JP 2179589 U JP2179589 U JP 2179589U JP 2179589 U JP2179589 U JP 2179589U JP H02113267 U JPH02113267 U JP H02113267U
- Authority
- JP
- Japan
- Prior art keywords
- modular jack
- circuit board
- printed circuit
- claw portion
- mounting hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179589U JPH02113267U (xx) | 1989-02-27 | 1989-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2179589U JPH02113267U (xx) | 1989-02-27 | 1989-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02113267U true JPH02113267U (xx) | 1990-09-11 |
Family
ID=31239338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2179589U Pending JPH02113267U (xx) | 1989-02-27 | 1989-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02113267U (xx) |
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1989
- 1989-02-27 JP JP2179589U patent/JPH02113267U/ja active Pending