JPH0211282A - Joining device for platelike body - Google Patents

Joining device for platelike body

Info

Publication number
JPH0211282A
JPH0211282A JP16001788A JP16001788A JPH0211282A JP H0211282 A JPH0211282 A JP H0211282A JP 16001788 A JP16001788 A JP 16001788A JP 16001788 A JP16001788 A JP 16001788A JP H0211282 A JPH0211282 A JP H0211282A
Authority
JP
Japan
Prior art keywords
gap
electromagnet
resin
plate
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16001788A
Other languages
Japanese (ja)
Inventor
Makoto Kono
誠 河野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16001788A priority Critical patent/JPH0211282A/en
Publication of JPH0211282A publication Critical patent/JPH0211282A/en
Pending legal-status Critical Current

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  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE:To efficiently produce a junction body having a uniform cell gap of a liquid crystal cell by placing a magnetic material plate on the surface of one of two pieces of platelike bodies to be joined, placing plural electromagnets on the other platelike body, and controlling a supply current. CONSTITUTION:An adhesive agent 12c of a thermosetting resin is applied to a prescribed position of a glass substrate 12a, a spacer 12d is spread uniformly onto the surface of a substrate 12a, and also, an optical hardening film 12a for tacking is applied to a prescribed position. Thereafter, in a state that a glass substrate 12b is superposed, said substrates are positioned between an electromagnet group 11 and a magnetic material plate 10. In a state that a current is allowed to flow equally to each electromagnet of the electromagnet group 11, a gap between both the glass substrates 12a, 12b is measured by an interference film thickness meter in each part of measuring use through-holes A-I. When a gap in the vicinity of I is narrower than the through-hole A, the gap is measured again by increasing a current which is allowed to flow to the electromagnet in the vicinity of the through-hole A. After a desired result is obtained, the optical hardening resin 12e is irradiated by a UV light, hardened and contained as it is in a cassette, and a rail resin 12c is hardened by heat.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、2枚の板状体をスペーサーを介して所定の間
隙をもって接合する接合装置に関するもので、特に液晶
セルの製造時における液晶セル組立工程に使用して効果
のあるものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a bonding device for bonding two plate-shaped bodies with a predetermined gap through a spacer, and particularly relates to a bonding device for bonding two plate-shaped bodies with a predetermined gap between them. It is effective when used.

従来の技術 例えば、液晶セルの製造工程において、2枚のガラス基
板を所定の間隔を隔てて貼り合せ、空セルを形成する必
要がある。従来、この空セルの製造装置としては、第4
図に示すものが知られている。第4図において、1は液
晶空セル2を載置する載置台である。前記液晶空セ/I
/2は、予め所定の透明電極パターンが配置された2枚
のガラス基板12a、12bの一方のガラス基板12a
に、第6図(イ)に示すようにその両基板を貼合せる為
のシール樹脂12c及び仮止め用シール樹脂12eをス
クリーン印刷及びディスベンディングでパタニング形成
し、もう一方のガラス基板12b上に、第6図(ロ)に
示すように所定のセルギャップを得るだめの所定厚のス
ペーサー12dを散布する。
2. Description of the Related Art For example, in the manufacturing process of a liquid crystal cell, it is necessary to bond two glass substrates with a predetermined distance apart to form an empty cell. Conventionally, as this empty cell manufacturing equipment, the fourth
The one shown in the figure is known. In FIG. 4, reference numeral 1 denotes a mounting table on which an empty liquid crystal cell 2 is placed. Said LCD empty cell/I
/2 is one glass substrate 12a of two glass substrates 12a and 12b on which a predetermined transparent electrode pattern is arranged in advance.
Then, as shown in FIG. 6(a), a sealing resin 12c for bonding the two substrates and a sealing resin 12e for temporary fixing are patterned and formed by screen printing and disbending, and on the other glass substrate 12b, As shown in FIG. 6(b), spacers 12d of a predetermined thickness are distributed to obtain a predetermined cell gap.

その両基板を対向せしめ両基板の透明電極を位置合せし
、仮止め樹脂12eに光を照射せしめ両ガラス板12a
 、 12bを仮接合する。
The two substrates are made to face each other, the transparent electrodes of both substrates are aligned, and the temporary fixing resin 12e is irradiated with light.
, 12b are temporarily joined.

その両基板を第4図に示すように載置台上にセットし、
しかる後に弾性変形可能な材質3よシなる空気室6に外
部より通気孔γを通して高圧気体(N2等)を吹き込む
。この高圧気体の吹き込みにより空気室6は膨張し、こ
れにともなって両ガラス基板12a 、 12bが圧接
され、その状態でシール樹脂12Cに熱を加える事によ
り本接合を行っていた。なお、4は装置架台、6はリー
ク弁、8は圧力計、9は押えナツトである。
Set both boards on the mounting table as shown in Figure 4,
Thereafter, high-pressure gas (such as N2) is blown into the air chamber 6 made of the elastically deformable material 3 from the outside through the vent hole γ. The air chamber 6 expands by blowing in this high-pressure gas, thereby bringing the glass substrates 12a and 12b into pressure contact, and in this state, main bonding is performed by applying heat to the sealing resin 12C. In addition, 4 is a device stand, 6 is a leak valve, 8 is a pressure gauge, and 9 is a holding nut.

発明が解決しようとする課題 しかしながら上記の構成による接合装置では両ガラス基
板の内部ギャップを均一にすることはガラス基板のうね
り、そり、配向膜の厚みのバラツキ等により、困難であ
る。又、均一内部ギャップが得られない為に2枚の基板
12a、12bが加圧焼成時に位置ずれを起こすという
問題点をも有していた。
Problems to be Solved by the Invention However, in the bonding apparatus having the above configuration, it is difficult to make the internal gap between both glass substrates uniform due to undulations and warpage of the glass substrates, variations in the thickness of the alignment film, and the like. Further, since a uniform internal gap cannot be obtained, there is a problem in that the two substrates 12a and 12b are misaligned during pressurized firing.

本発明は、上記問題点に鑑み、液晶セルの均一セルギャ
ップ、又、液晶セルの上下2枚12a。
In view of the above-mentioned problems, the present invention provides a uniform cell gap of the liquid crystal cell and two upper and lower liquid crystal cells 12a.

12bの位置ずれ防止等を高い歩留りで得る為の接合装
置を提供するものである。
The present invention provides a bonding device for preventing misalignment of the bonding device 12b with a high yield.

課題を解決するための手段 本発明の板状体の接合装置は、スペーサーを介して対向
するよう配置された接合すべき2枚の板状体の一方の面
に磁性体板を配置し他方の板状体に対向して複数の電磁
石を配置し前記複数の電磁石へのそれぞれの供給電流を
制御することによシn1J記両板状体を前記スペーサー
を介して押圧せしめることを特徴とするものである。
Means for Solving the Problems The device for joining plate-shaped bodies of the present invention arranges a magnetic plate on one surface of two plate-shaped bodies to be bonded, which are arranged to face each other with a spacer in between, and A device characterized in that a plurality of electromagnets are arranged opposite to the plate-like body, and the electric currents supplied to the plurality of electromagnets are controlled to press both plate-like bodies through the spacer. It is.

作  用 前記構成によれば、個々の電磁石への供給源流を調整す
ることにより、2枚の接合すべき板状体の押圧力を部分
的に変化せしめることが出来る為、両板状体に”そり、
うねり1等の若干の変形が存在しても、2枚の板状体を
均一な間隙でもって接合できるものである。
Effect: According to the above configuration, by adjusting the supply flow to each electromagnet, it is possible to partially change the pressing force between the two plate-like bodies to be joined. sled,
Even if there is slight deformation such as waviness 1, two plate-shaped bodies can be joined with a uniform gap.

実施例 以下本発明の板状体の接合装置の一実施例について、図
面を参照しながら、液晶セルの製造工程に適用した場合
を例にあげ説明する。第1図は本発明の一実施例におけ
る接合装置の要部断面図、第2図は、その平断面図であ
る。第1図において、1Qは従来と同一構成によシなる
液晶セルの上基J12aに隣接する鉄板等よυなる磁性
体板であり、11は他方のガラス基板12bに接して配
置された電磁石群であり、この電磁石群11は、第3図
に示すように、それぞれに供給する電流を制御すること
により、磁力を調節することが出来る複数のコイ/1z
11a、11b、11c、11d・=−により構成され
ている。又、鉄板10には、第2図に示すA〜工の位置
に二枚のガラス基板の内部ギャップ(セルギャップ)測
定の為の透孔14が形成されている。
EXAMPLE Hereinafter, an embodiment of the plate bonding apparatus of the present invention will be described with reference to the drawings, taking as an example the case where it is applied to a manufacturing process of a liquid crystal cell. FIG. 1 is a sectional view of a main part of a bonding device according to an embodiment of the present invention, and FIG. 2 is a plan sectional view thereof. In FIG. 1, 1Q is a magnetic plate υ such as an iron plate adjacent to the upper substrate J12a of the liquid crystal cell having the same configuration as the conventional one, and 11 is a group of electromagnets arranged in contact with the other glass substrate 12b. As shown in FIG. 3, this electromagnet group 11 consists of a plurality of coils/1z whose magnetic force can be adjusted by controlling the current supplied to each coil.
11a, 11b, 11c, 11d.=-. Further, through holes 14 for measuring the internal gap (cell gap) between the two glass substrates are formed in the iron plate 10 at positions A to B shown in FIG.

次にこの具体的構成および使用方法について説明する。Next, the specific configuration and usage method will be explained.

従来と同様に熱硬化性樹脂の接着剤12cがガラス基板
12aの所定の位置に塗布され、厚さ7.1μmのスペ
ーサー12dを第6図に示すように基板12a面上に均
一に散布するとともに、仮止め用の光硬化膜12θを所
定の位置に塗布する。しかる後に、ガラス基板12bと
重ね合せた状態で、第1図の様に電磁石群11と磁性状
板10との間に位置せしめる。次に電磁石群11の各電
磁石に均等に電流を流した状態で、前記測定用透孔四〜
(I)の各箇所において干渉膜圧計により両ガラス基板
12a、12b間の間隙(セルギャップ)を測定する。
As in the past, a thermosetting resin adhesive 12c is applied to a predetermined position on the glass substrate 12a, and spacers 12d having a thickness of 7.1 μm are uniformly spread over the surface of the substrate 12a as shown in FIG. , a photocured film 12θ for temporary fixing is applied to a predetermined position. Thereafter, it is placed between the electromagnet group 11 and the magnetic plate 10, as shown in FIG. 1, with the glass substrate 12b superimposed on it. Next, with a current uniformly flowing through each electromagnet of the electromagnet group 11,
At each location in (I), the gap (cell gap) between both glass substrates 12a and 12b is measured using an interference film pressure gauge.

この測定結果を第1表に示す。The measurement results are shown in Table 1.

第   1   表 この測定結果から判断されることには、透明Aに比べ、
工の近傍の間隔が狭くなっていることである。そこで透
孔Aの近傍に位置する電磁石11a。
Table 1 Judging from these measurement results, compared to transparent A,
The spacing near the structures is becoming narrower. Therefore, the electromagnet 11a is located near the through hole A.

11b、11C911dに流す電流を多くし、再度セル
ギャップを測定する。その結果、第2表の結果が得られ
た。
Increase the current flowing through 11b and 11C911d and measure the cell gap again. As a result, the results shown in Table 2 were obtained.

第   2   表 この測定結果を得たのち、光硬化性樹脂12e(8ポイ
ント)に120 mWのUV光を60秒照射し、硬化し
、そのままカセツトに収納し、シー)v樹脂12cを熱
により150℃で2時間硬化した。その貼合せ硬化した
両基板のセルギヤ、プの測定結果を第3表に示す。
Table 2 After obtaining these measurement results, the photocurable resin 12e (8 points) was irradiated with 120 mW UV light for 60 seconds, cured, and then stored in a cassette. Cure for 2 hours. Table 3 shows the measurement results of cell gear and p of both the bonded and cured substrates.

第   3   表 第3表の結果からも、仮硬化後と本硬化後の差が±0,
01μm 以内にある事がわかる。なおこのセル中にS
TN用の液晶を封入し、光学的電気的特性を検査した結
果、完全な良品であり、両基板の位置も全くずれていな
かった。
Table 3 From the results in Table 3, the difference after temporary curing and after main curing is ±0,
It can be seen that it is within 0.01 μm. Note that S in this cell
The liquid crystal for TN was sealed and the optical and electrical characteristics were inspected. As a result, it was found to be a completely non-defective product, and the positions of both substrates were not shifted at all.

以上の様に本実施例によれば、液晶セルの均一なセルギ
ャップを確実に高歩留りで得られる事ができる。
As described above, according to this embodiment, a uniform cell gap of a liquid crystal cell can be reliably obtained at a high yield.

なお、本実施例における仮接着樹脂は、光硬化性樹脂の
他に、シー/’J脂の本硬化温度以上の軟点を持つ熱可
塑性樹脂であれば良い事は言うまでもない。
It goes without saying that the temporary adhesive resin in this embodiment may be a thermoplastic resin having a soft point higher than the main curing temperature of the C/'J resin, in addition to the photocurable resin.

発明の効果 以上の様に本発明によれば、接合すべき両板状体に部分
的な″そり、うねり”があってもその部分に加えられる
押圧力を容易に変化できる為、均一なセルギャップを有
する接合体を効率良く作成することが出来るものである
As described above, according to the present invention, even if there is a partial warp or undulation in both plate-shaped bodies to be joined, the pressing force applied to that part can be easily changed, so that uniform cells can be obtained. It is possible to efficiently create a bonded body having a gap.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例における板状体の接合装置の
要部断面図、第2図はその平断面図、第3図(イ)は接
合装置の電磁石群を示す平面図、(ロ)は同側断面図、
第4図は従来の接合装置の断面図、第6図(イ)、(ロ
)はそれぞれ接合前の液晶ガラス基板の平面図である。 1o・・・・・磁性体板、11・・・・・・電磁石群、
12a。 12b・・・・・・板状体、12d・・・・・・スペー
サー、14・・・・・・セルギヤツブ測定用透孔。
FIG. 1 is a cross-sectional view of a main part of a joining device for plate-like bodies according to an embodiment of the present invention, FIG. 2 is a plan cross-sectional view thereof, and FIG. B) is an ipsilateral sectional view,
FIG. 4 is a sectional view of a conventional bonding apparatus, and FIGS. 6(a) and 6(b) are plan views of liquid crystal glass substrates before bonding, respectively. 1o... Magnetic plate, 11... Electromagnet group,
12a. 12b... Plate-shaped body, 12d... Spacer, 14... Cell gear tube measurement through hole.

Claims (1)

【特許請求の範囲】[Claims] スペーサーを介して対向するよう配置された接合すべき
2枚の板状体の一方の面に磁性体板を配置し、他方の板
状体に対向して複数の電磁石を配置し、前記複数の電磁
石へのそれぞれの供給電流を制御することにより、前記
両板状体を前記スペーサーを介して押圧せしめるよう構
成したことを特徴とする板状体の接合装置。
A magnetic plate is arranged on one side of two plate-like bodies to be joined which are arranged to face each other via a spacer, and a plurality of electromagnets are arranged opposite to the other plate-like body, 1. A joining device for plate-like bodies, characterized in that the plate-like bodies are pressed together through the spacer by controlling respective supply currents to electromagnets.
JP16001788A 1988-06-28 1988-06-28 Joining device for platelike body Pending JPH0211282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16001788A JPH0211282A (en) 1988-06-28 1988-06-28 Joining device for platelike body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16001788A JPH0211282A (en) 1988-06-28 1988-06-28 Joining device for platelike body

Publications (1)

Publication Number Publication Date
JPH0211282A true JPH0211282A (en) 1990-01-16

Family

ID=15706176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16001788A Pending JPH0211282A (en) 1988-06-28 1988-06-28 Joining device for platelike body

Country Status (1)

Country Link
JP (1) JPH0211282A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159816A (en) * 1982-03-18 1983-09-22 Tsukishima Kikai Co Ltd Method for operating pressure filter
JPH0441799U (en) * 1990-07-31 1992-04-09
JPH0441800U (en) * 1990-07-31 1992-04-09

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58159816A (en) * 1982-03-18 1983-09-22 Tsukishima Kikai Co Ltd Method for operating pressure filter
JPH0211282B2 (en) * 1982-03-18 1990-03-13 Tsukishima Kikai Co
JPH0441799U (en) * 1990-07-31 1992-04-09
JPH0441800U (en) * 1990-07-31 1992-04-09

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