JPH02111538A - Pseudorestriction type vibration damping material and its manufacture - Google Patents

Pseudorestriction type vibration damping material and its manufacture

Info

Publication number
JPH02111538A
JPH02111538A JP26272788A JP26272788A JPH02111538A JP H02111538 A JPH02111538 A JP H02111538A JP 26272788 A JP26272788 A JP 26272788A JP 26272788 A JP26272788 A JP 26272788A JP H02111538 A JPH02111538 A JP H02111538A
Authority
JP
Japan
Prior art keywords
layer
synthetic resin
damping material
vibration damping
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26272788A
Other languages
Japanese (ja)
Other versions
JP2671029B2 (en
Inventor
Yukio Matsuo
松尾 行夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yokohama Rubber Co Ltd
Original Assignee
Yokohama Rubber Co Ltd
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Filing date
Publication date
Application filed by Yokohama Rubber Co Ltd filed Critical Yokohama Rubber Co Ltd
Priority to JP63262727A priority Critical patent/JP2671029B2/en
Publication of JPH02111538A publication Critical patent/JPH02111538A/en
Application granted granted Critical
Publication of JP2671029B2 publication Critical patent/JP2671029B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To contrive simplification of manufacture and processing and making into a low noise, by a method wherein a synthetic resin layer of a restriction type vibration damping material is constituted of two layers of a soft resin layer and high-rigidity resin layer. CONSTITUTION:Nonrestriction type vibration damping material is constituted of a synthetic resin layer 12 comprised of a vibration member 11 such as aluminum or iron and epoxy resin having a fixed thickness and the synthetic resin layer 12 is molded integrally of a synthetic resin upper layer 14a comprised of epoxy resin to which a glass strand chip or a metallic fiber chip 13 is compounded and a synthetic resin lower layer 14b comprised of a single epoxy resin material. In other words, a 10-50 Phr glass strand chip or metallic fiber chip is compounded to liquid epoxy resin by making use of a difference in specific gravity so that a chip layer is formed on a surface layer side. The synthetic resin layer (lower layer) 14b having flexibility and the synthetic resin layer (upper layer) 14a to which a glass chip layer whose rigidity is high are molded integrally, which is stuck to a metallic oscillation member and made into the nonrestriction type vibration damping material displaying capacity close to that of restriction type vibration damping material.

Description

【発明の詳細な説明】 この発明は、擬似拘束型制振材及びその製造方法に係わ
り、更に詳しくは振動発生源の近傍に装着して振動や騒
音等を低減させる擬似拘束型の制振材及びその製造方法
に関するものである。
Detailed Description of the Invention The present invention relates to a pseudo-constraint type vibration damping material and a method for manufacturing the same, and more specifically, a pseudo-constraint type vibration damping material that is installed near a vibration source to reduce vibrations, noise, etc. and its manufacturing method.

〔従来の技術〕[Conventional technology]

一般に、船舶や車両のエンジン部等の振動発生源には、
振動部材となる金属1 (鉄や、アルミ等)にエポキシ
樹脂等の合成樹脂2から成る制振材を装着(接着)して
振動や騒音を低減させている。
In general, vibration sources such as the engine parts of ships and vehicles have
A damping material made of a synthetic resin 2 such as epoxy resin is attached (adhered) to a metal 1 (iron, aluminum, etc.) serving as a vibration member to reduce vibration and noise.

上記制振材には、第2図(alに示すような非拘束型制
振材Xと、第3図(alに示すような拘束型制振材Yと
の2種類があり、両者とも振動エネルギーを制振材料の
内部損失(熱エネルギーに変換)により低減し、低雑音
化を図っている。
There are two types of vibration damping materials: unrestricted damping material X as shown in Figure 2 (al) and restrained damping material Y as shown in Figure 3 (al). Energy is reduced through internal loss (converted to thermal energy) in the damping material, resulting in lower noise.

非拘束型制振材Xは、上記第2図t8)のような状態か
ら振動を受けると第2図(blに示すように変形し、ベ
ースポリマー自体の内部損失(tanδ)と、ポリマー
中に配合された充填材とが振動部材のヘンディング(振
動)時に、充填材間及び充填材ポリマー間で剪断変形を
受け、振動エネルギーを摩擦エネルギーに変換し、振動
を吸収している。
When the unconstrained damping material The blended filler undergoes shearing deformation between the fillers and the filler polymer when the vibrating member is hended (vibrated), converting vibrational energy into frictional energy and absorbing vibrations.

また、拘束型制振材Yは、第3図(a)、 (blに示
すように、基板l上の合成樹脂材2を、アルミ。
Furthermore, as shown in FIG. 3(a) and (bl), the constraint type vibration damping material Y is made by replacing the synthetic resin material 2 on the substrate l with aluminum.

鉄等の金属材料から成る拘束板3で挟持して構成したも
のであり、内部損失機構は非拘束型制振材Xと同様であ
るが、拘束板3と合成樹脂材2との弾性率に大きな差が
あるため、振動部材がベンディング(振動)した時、拘
束板3と合成樹脂材2との間に第3図(blの矢印方向
に示すようなすり変形が生じ、この変形により振動エネ
ルギーを熱エネルギー(摩擦)に変換し、振動を吸収し
ている。
It is constructed by being sandwiched between restraint plates 3 made of a metal material such as iron, and the internal loss mechanism is the same as that of the non-constraint type vibration damping material X, but the elastic modulus of the restraint plates 3 and the synthetic resin material 2 Because of the large difference, when the vibrating member bends (vibrates), abrasion deformation occurs between the restraint plate 3 and the synthetic resin material 2 as shown in the arrow direction in Fig. 3 (bl), and this deformation causes vibration energy to be converts it into thermal energy (friction) and absorbs vibration.

このすり変形は、非拘束型制振材Xの内部損失機構より
効率的に振動エネルギーを熱エネルギーに変換する。
This sliding deformation converts vibration energy into thermal energy more efficiently than the internal loss mechanism of the non-restricted damping material X.

従って、振動部材への装着厚みが、拘束型制振材Yく非
拘束型制振材X、振動部材への装着重量が、拘束型制振
材Yく非拘束型制振材Xそした場合、厚み1重量が少な
くても拘束型制振材Yは、非拘束型制振材Xに比して高
特性を有すると言う利点がある。
Therefore, if the thickness of the vibration damping material installed on the vibration member is Y, the non-restraint type damping material Even though the restraint-type damping material Y has less thickness and weight, it has the advantage that it has higher characteristics than the non-restraint-type vibration damping material X.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

然しなから、拘束型制振材Yには、次のような問題があ
る。
However, the restraint type damping material Y has the following problems.

(a)、金属板であることから加工が不便である。(a) Since it is a metal plate, it is inconvenient to process.

(b)、複雑な形状に装着できず、特にR部には装着が
困難である。
(b) It cannot be attached to a complicated shape, and it is especially difficult to attach it to an R portion.

(C)、製作工程が非拘束型に比して面倒である。(C) The manufacturing process is more troublesome than that of the non-constrained type.

(d)1表面に防錆塗装が必要な場合がある。(d) Anti-rust coating may be required on one surface.

〔発明の目的〕[Purpose of the invention]

この発明は、かかる従来の問題点に着目して案出された
もので、拘束型制振材の合成樹脂層を柔軟な樹脂層と剛
性の高い樹脂層の2層に構成して従来の欠点を有効に解
消し、製作及び加工が容易で、任意の位置に装着でき、
振動エネルギーを制振材料の内部損失により低減し、低
雑音化を図るようにした擬似拘束型制振材及びその製造
方法を提供することを目的とするものである。
This invention was devised by focusing on such conventional problems, and by configuring the synthetic resin layer of the restraint type vibration damping material into two layers, a flexible resin layer and a highly rigid resin layer, It effectively solves the problem, is easy to manufacture and process, and can be installed in any position.
It is an object of the present invention to provide a pseudo-constraint type damping material that reduces vibration energy through internal loss of the damping material and reduces noise, and a method for manufacturing the same.

〔課題を解決するための手段〕[Means to solve the problem]

この発明は上記目的を達成するため、制振材を構成する
合成樹脂層を単一材料とした合成樹脂下層と、ガラス繊
維チップを配合した合成樹脂上層とで一体的に成形し、
上下層の弾性率に差を持たせ、特にガラスチップ層を配
合した合成樹脂上層を1疑慎拘束層として機能させ、す
り変形を生じさせて振動エネルギーを熱エネルギーに効
率良く変換させて、低雑音化を図るようにしたことを要
旨とするものである。
In order to achieve the above object, the present invention integrally molds the synthetic resin layer constituting the damping material with a synthetic resin lower layer made of a single material and a synthetic resin upper layer blended with glass fiber chips,
By creating a difference in the elastic modulus of the upper and lower layers, and in particular, the synthetic resin upper layer containing a glass chip layer functions as a restraining layer, causing abrasion deformation and efficiently converting vibration energy into thermal energy. The gist of this is to reduce noise.

即ち、合成樹脂材として、エポキシ樹脂を使用すると共
に、ガラスチップ層を配合した合成樹脂上層の表面側に
ガラス繊維チップ層が形成されるように配合して、ガラ
ス繊維チップ層を配合した合成樹脂上層と単一材料から
成る合成樹脂下層とを一体的に成形して構成した。
That is, an epoxy resin is used as the synthetic resin material, and the synthetic resin is blended with a glass fiber chip layer so that the glass fiber chip layer is formed on the surface side of the upper layer of the synthetic resin containing the glass chip layer. The upper layer and the synthetic resin lower layer made of a single material are integrally molded.

〔発明の作用〕[Action of the invention]

この発明は、上記のように構成され、液状の合成樹脂材
に、所定量のガラスストランドチップまたは金属繊維チ
ップを配合し、合成樹脂材の比重と、前記チップとの比
重差により表面層側にチップ層を形成し、柔軟性を有す
る合成樹脂層と、剛性の高いガラスチップ層を配合した
合成樹脂層とを一体的に成形して、金属性の基板上に固
定することを特徴とし、ガラスチップ層を配合したエポ
キシ樹脂の上層と単一材料から成るエポキシ樹脂下層と
のガラス転位点(Tg)を、30℃〜40℃の差がある
ようにするのが好ましく、上層のガラス転位点(Tg)
を高いくする。
The present invention is constructed as described above, in which a predetermined amount of glass strand chips or metal fiber chips is blended into a liquid synthetic resin material, and the difference in specific gravity between the synthetic resin material and the chips is applied to the surface layer side. The chip layer is formed by integrally molding a flexible synthetic resin layer and a synthetic resin layer containing a highly rigid glass chip layer and fixing it on a metal substrate. It is preferable that the glass transition point (Tg) of the upper layer of epoxy resin containing the chip layer and the lower layer of epoxy resin made of a single material be 30 to 40 degrees Celsius. Tg)
make it expensive.

〔発明の実施例〕[Embodiments of the invention]

以下添付図面に基いて、この発明の詳細な説明する。 The present invention will be described in detail below based on the accompanying drawings.

第1図は、この発明を実施した擬似拘束型制振材を示し
、11はアルミや鉄等の振動部材を仮想したもので、1
2は所定厚さのエポキシ樹脂から成る合成樹脂層を示し
、両部材により非拘束型制振材を構成し、この発明では
、上記合成樹脂層12を、ガラスストランドチップまた
は金属繊維チップ13を配合したエポキシ樹脂から成る
合成樹脂上層14aと、単一のエポキシ樹脂材料から成
る合成樹脂下層14bとで一体的に成形されている。
Fig. 1 shows a pseudo-restriction type vibration damping material in which the present invention is implemented, 11 is a hypothetical vibrating member such as aluminum or iron, and 1
2 indicates a synthetic resin layer made of epoxy resin with a predetermined thickness, and both members constitute a non-restrictive vibration damping material. In the present invention, the synthetic resin layer 12 is blended with glass strand chips or metal fiber chips 13. A synthetic resin upper layer 14a made of epoxy resin and a synthetic resin lower layer 14b made of a single epoxy resin material are integrally molded.

前記、合成樹脂上層14aと、合成樹脂下層14bとの
エポキシ樹脂のガラス転位点(Tg)は、30℃〜40
℃差があるのが望ましく、特に合成樹脂上層14aのガ
ラス転位点(Tg)が高い方が良い。
The glass transition point (Tg) of the epoxy resin of the synthetic resin upper layer 14a and the synthetic resin lower layer 14b is 30°C to 40°C.
It is desirable that there is a difference in degrees Celsius, and in particular, it is better that the glass transition point (Tg) of the synthetic resin upper layer 14a is high.

以上のように構成することで、ガうス繊維チップまたは
金属繊維チップ13を配合した合成樹脂上層14aと、
単一のエポキシ樹脂材料から成る合成樹脂下層14bと
の弾性率に差を持たせ、特にガラスチップ層を配合した
合成樹脂上層を擬似拘束層として機能させ、すり変形を
生じさせて振動エネルギーを熱エネルギーに効率良く変
換させるようにしたせのである。
With the above configuration, the synthetic resin upper layer 14a containing Gauss fiber chips or metal fiber chips 13,
The elastic modulus of the synthetic resin lower layer 14b made of a single epoxy resin material is different from that of the synthetic resin upper layer 14b, which is made of a single epoxy resin material.In particular, the synthetic resin upper layer containing a glass chip layer functions as a pseudo-restriction layer, causing abrasion deformation to transfer vibration energy to heat. This is to convert it into energy efficiently.

このような擬似拘束型制振材の製造方法としては、液状
のエポキシ樹脂材に、ガラスストランドチップまたは金
属繊維チップを10〜50Phr配合し、16mm厚さ
のモールド成形したものを擬似拘束型制振材とする。
A method for manufacturing such a pseudo-constraint type vibration damping material is to mix 10 to 50 Phr of glass strand chips or metal fiber chips into a liquid epoxy resin material and mold it to a thickness of 16 mm. Use as wood.

即ち、ガラスストランドチップまたは金属繊維チップ1
3とエポキシ樹脂材との比重差を利用して、表面層側に
チップ層が形成されるように配合し、柔軟性を有する合
成樹脂層(下層)14bと、剛性の高いガラスチップ層
を配合した合成樹脂層(上層)14aとを一体的に成形
して、金属性振動部材に装着(接着)し、拘束型制振材
に近い性能を発揮する非拘束型制振材とするものである
That is, glass strand chips or metal fiber chips 1
Using the difference in specific gravity between 3 and the epoxy resin material, the material is blended so that a chip layer is formed on the surface layer side, and a flexible synthetic resin layer (lower layer) 14b and a highly rigid glass chip layer are blended. The synthetic resin layer (upper layer) 14a and the synthetic resin layer (upper layer) 14a are integrally molded and attached (adhered) to a metal vibration member, resulting in a non-constrained vibration damping material that exhibits performance close to that of a constrained vibration damping material. .

第4図、第5図は、従来の非拘束型制振材と本願発明の
擬似拘束型制振材との構造であり、第6図に両側振材の
損失係数(η)を比較したグラフ説明図を示している。
Figures 4 and 5 show the structures of a conventional non-constrained damping material and a pseudo-constrained damping material of the present invention, and Fig. 6 is a graph comparing the loss coefficient (η) of the vibration damping material on both sides. An explanatory diagram is shown.

第6図において、周波数200Hzと、1o00Hzと
の損失係数を比較した結果、本願発明の擬似拘束型制振
材が、従来の非拘束型制振材に較べて温度に対する損失
係数(η)が大きく、割振効果が大きいことが判る。
In Fig. 6, as a result of comparing the loss coefficients at frequencies of 200 Hz and 1000 Hz, the pseudo-constraint damping material of the present invention has a larger loss coefficient (η) with respect to temperature than the conventional non-constraint damping material. , it can be seen that the allocation effect is large.

なお、擬似拘束型制振材における繊維層厚みは、制振材
の全体厚みの1/2以下に設定しである。
The thickness of the fiber layer in the pseudo-constraint damping material is set to 1/2 or less of the total thickness of the damping material.

〔発明の効果〕〔Effect of the invention〕

この発明は、上記のように所定厚さの合成樹脂層を形成
してなる制振材において、前記合成樹脂層を単一材料と
した合成樹脂下層と、ガラスチップ層を配合した合成樹
脂上層とで一体的に成形したので、製作及び加工が容易
で、任意の位置に装着でき、特に上下の樹脂層の弾性率
に差を持たせ、ガラスチップを配合した合成樹脂上層を
擬似拘束層として機能させることで、すり変形を生じさ
せて振動エネルギーを熱エネルギーに効率良く変換させ
て騒音や振動等を有効に低減させることが出来る効果が
ある。
This invention provides a vibration damping material formed by forming a synthetic resin layer of a predetermined thickness as described above, which comprises a synthetic resin lower layer made of the synthetic resin layer as a single material, and a synthetic resin upper layer blended with a glass chip layer. Since it is integrally molded, it is easy to manufacture and process, and can be installed in any position.In particular, the upper and lower resin layers have different moduli of elasticity, and the upper layer of synthetic resin containing glass chips functions as a pseudo-restriction layer. By doing so, there is an effect that noise, vibration, etc. can be effectively reduced by causing sliding deformation and efficiently converting vibration energy into thermal energy.

また、液状のエポキシ樹脂材に、所定量のガラスストラ
ンドチップまたは金属繊維チップを配合し、前記エポキ
シ樹脂材の比重と、前記チップ材との比重差により表面
層側にチップ層を形成し、柔軟性を有する合成樹脂層と
、剛性の高いガラスチップ層を配合した合成樹脂層とを
一体的に成形するので、従来の加工性や装着性を有効に
解決することが出来る。
In addition, a predetermined amount of glass strand chips or metal fiber chips is mixed into a liquid epoxy resin material, and a chip layer is formed on the surface layer side due to the difference in specific gravity between the epoxy resin material and the chip material, making it flexible. Since the synthetic resin layer having high properties and the synthetic resin layer containing the glass chip layer having high rigidity are integrally molded, conventional processability and installation problems can be effectively solved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、この発明を実施した擬似拘束型制振材を振動
部材に装着した時の断面図、第2図(al、 (blは
、従来の非拘束型制振材を振動部材に装着した時の断面
図と振動を受けた時の断面図、第3図(al、 (bl
は、従来の拘束型制振材の断面図と振動を受けた時の断
面図、第4図及び第5図は従来の非拘束型制振材とこの
発明の擬似拘束型制振材との断面図、第6図は第4図及
び第5図の制振材の損失係数を比較したグラフ説明図で
ある。 11・・・基板(振動部材)、12・・・合成樹脂層、
3・・・ガラスストランドチップまたは金属繊維チップ
、 4a・・・合成樹脂上層、 4b・・・合成 樹脂下層。
Figure 1 is a cross-sectional view when a quasi-restrictive damping material according to the present invention is attached to a vibrating member, and Figure 2 (al and (bl) is a cross-sectional view when a conventional non-restrictive damping material is attached to a vibrating member. Figure 3 (al, (bl)
4 and 5 are cross-sectional views of a conventional restraint-type vibration damping material and a cross-sectional view when subjected to vibration, and FIGS. 4 and 5 are cross-sectional views of a conventional non-constraint vibration damping material and a pseudo-constraint vibration damping material of the present invention. The cross-sectional view and FIG. 6 are graph explanatory diagrams comparing the loss coefficients of the damping materials of FIGS. 4 and 5. 11... Substrate (vibrating member), 12... Synthetic resin layer,
3...Glass strand chip or metal fiber chip, 4a...Synthetic resin upper layer, 4b...Synthetic resin lower layer.

Claims (1)

【特許請求の範囲】 1、所定厚さの合成樹脂層を形成してなる制振材におい
て、前記合成樹脂層を単一材料とした合成樹脂下層と、
ガラスチップ層を配合した合成樹脂上層とで一体的に成
形したことを特徴とする擬似拘束型制振材。 2、前記、ガラスチップ層を配合した合成樹脂上層の表
面側にガラスチップ層が形成されるように配合した請求
項1に記載の擬似拘束型制振材。 3、合成樹脂材として、エポキシ樹脂を使用する請求項
1に記載の擬似拘束型制振材。 4、液状のエポキシ樹脂材に、所定量のガラスストラン
ドチップまたは金属繊維チップを配合し、前記エポキシ
樹脂材の比重と、前記チップ材との比重差により表面層
側にチップ層を形成し、柔軟性を有する合成樹脂層と、
剛性の高いガラスチップ層を配合した合成樹脂層とを一
体的に成形して、金属性の基板上に固定する擬似拘束型
制振材の製造方法。
[Scope of Claims] 1. A vibration damping material formed by forming a synthetic resin layer of a predetermined thickness, comprising: a synthetic resin lower layer in which the synthetic resin layer is a single material;
A quasi-constrained vibration damping material characterized by being integrally molded with a synthetic resin upper layer containing a glass chip layer. 2. The pseudo-constraint type vibration damping material according to claim 1, wherein the glass chip layer is formed on the surface side of the synthetic resin upper layer blended with the glass chip layer. 3. The pseudo-constraint type vibration damping material according to claim 1, wherein an epoxy resin is used as the synthetic resin material. 4. Mix a predetermined amount of glass strand chips or metal fiber chips with liquid epoxy resin material, form a chip layer on the surface layer side due to the difference in specific gravity of the epoxy resin material and the chip material, and make it flexible. a synthetic resin layer having properties;
A method for producing a pseudo-constrained damping material in which a synthetic resin layer containing a highly rigid glass chip layer is integrally molded and fixed onto a metal substrate.
JP63262727A 1988-10-20 1988-10-20 Pseudo-restraint type damping material manufacturing method Expired - Lifetime JP2671029B2 (en)

Priority Applications (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003036131A1 (en) * 2001-10-19 2003-05-01 Koyo Seiko Co., Ltd. Auto tensioner
EP1504890A2 (en) * 2003-08-08 2005-02-09 Nitto Denko Corporation Adhesive sheet for steel plate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113632A (en) * 1978-02-27 1979-09-05 Kansai Paint Co Ltd Vibration damping
JPS5943299A (en) * 1982-09-02 1984-03-10 Nippon Denso Co Ltd Device for indicating exchange timing of lubricating oil for vehicle

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113632A (en) * 1978-02-27 1979-09-05 Kansai Paint Co Ltd Vibration damping
JPS5943299A (en) * 1982-09-02 1984-03-10 Nippon Denso Co Ltd Device for indicating exchange timing of lubricating oil for vehicle

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003036131A1 (en) * 2001-10-19 2003-05-01 Koyo Seiko Co., Ltd. Auto tensioner
US7267626B2 (en) 2001-10-19 2007-09-11 Koyo Seiko Co., Ltd. Auto tensioner
EP1504890A2 (en) * 2003-08-08 2005-02-09 Nitto Denko Corporation Adhesive sheet for steel plate
EP1504890A3 (en) * 2003-08-08 2005-05-25 Nitto Denko Corporation Adhesive sheet for steel plate
US8092906B2 (en) 2003-08-08 2012-01-10 Nitto Denko Corporation Adhesive sheet for steel plate

Also Published As

Publication number Publication date
JP2671029B2 (en) 1997-10-29

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