JPH02110361U - - Google Patents
Info
- Publication number
- JPH02110361U JPH02110361U JP1989018197U JP1819789U JPH02110361U JP H02110361 U JPH02110361 U JP H02110361U JP 1989018197 U JP1989018197 U JP 1989018197U JP 1819789 U JP1819789 U JP 1819789U JP H02110361 U JPH02110361 U JP H02110361U
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring
- lsi chip
- mounting
- pilot hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989018197U JPH02110361U (US20100056889A1-20100304-C00004.png) | 1989-02-17 | 1989-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989018197U JPH02110361U (US20100056889A1-20100304-C00004.png) | 1989-02-17 | 1989-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02110361U true JPH02110361U (US20100056889A1-20100304-C00004.png) | 1990-09-04 |
Family
ID=31232625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989018197U Pending JPH02110361U (US20100056889A1-20100304-C00004.png) | 1989-02-17 | 1989-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110361U (US20100056889A1-20100304-C00004.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017815A (ja) * | 2001-06-29 | 2003-01-17 | Optrex Corp | フレキシブル配線基板およびその製造方法 |
| JP2010040116A (ja) * | 2008-08-06 | 2010-02-18 | Nitto Denko Corp | 回路付サスペンション基板、その製造方法および回路付サスペンション基板の位置決め方法 |
-
1989
- 1989-02-17 JP JP1989018197U patent/JPH02110361U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017815A (ja) * | 2001-06-29 | 2003-01-17 | Optrex Corp | フレキシブル配線基板およびその製造方法 |
| JP4673507B2 (ja) * | 2001-06-29 | 2011-04-20 | オプトレックス株式会社 | フレキシブル配線基板の位置合わせ方法 |
| JP2010040116A (ja) * | 2008-08-06 | 2010-02-18 | Nitto Denko Corp | 回路付サスペンション基板、その製造方法および回路付サスペンション基板の位置決め方法 |
| US9072207B2 (en) | 2008-08-06 | 2015-06-30 | Nitto Denko Corporation | Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
| US10028370B2 (en) | 2008-08-06 | 2018-07-17 | Nitto Denko Corporation | Suspension board and load beam combination including a positioning reference hole and a reinforcing layer |
