JPH02110166A - Actinic radiation-curable resin composition - Google Patents

Abstract

PURPOSE:To obtain the title composition which can be applied to even a finely rugged surface of a material by mixing a low-viscosity mixture comprising a compound having a specified functional group, a leveling agent and an organic solvent or its mixture with water. CONSTITUTION:100 pts.wt. mixture of a viscosity <=3000cps (at 25 deg.C), comprising desirably 30-70 pts.wt. compound having one carboxyl group and one (meth) acryloyl group in the molecule (e.g., acrylic acid), desirably 20-65 pts.wt. compound having one (meth)acryloyl group in the molecule, other than the above compound (e.g., hydroxyethyl methacrylate), and desirably 1-30 pts.wt. compound having at least two (meth)acryloyl groups (e.g., pentaerythritol hexaacrylate) is mixed with desirably 0.01-5 pts.wt. leveling agent (e.g., nonionic fluoroalkyl ester) and desirably 100-450 pts.wt. organic solvent (e.g., isopropanol) or mixture of this solvent with water.

Description

Detailed Description of the Invention (a) Purpose of the Invention [Field of Industrial Application] The resin composition according to the present invention can be applied to the surface of a material having minute irregularities without forming bubbles, and can be applied by heating, etc. Even after the solvent is removed by this method, it remains a low-viscosity liquid and can be easily cured by irradiation with active energy rays such as ultraviolet rays or electron beams, and the cured resin film is resistant to acid treatment. Because it exhibits corrosion resistance and has the ability to dissolve and peel when treated with alkali, it is particularly useful as a resin composition for the leg stopper of a shadow mask, and is also used as a casting material, in various industries. It is used as a paint or molding material.

[Conventional technology]

The shadow mask has the function of causing electrons emitted from the electron gun in the cathode ray tube for color television to collide with a light emitting body of a predetermined color, and is a metal plate in which many fine holes are formed by etching. This fine hole is formed by providing hemispherical recesses with different diameters at corresponding positions on both the front and back surfaces of the metal plate, and by making the bottoms of the corresponding recesses communicate with each other.

To explain the outline of the manufacturing process of a shadow mask, first, a photosensitive resin film is applied to both the front and back sides of a thin metal plate made of iron or the like, and then a negative film with a pattern placed on it is closely attached to the metal plate to coat the photosensitive resin film. Photographic printing is performed to harden the exposed areas, and non-exposed areas of the photosensitive resin film are removed by development. Next, primary etching is performed using a corrosive solution such as iron perchloride, and a diameter of 10 mm is formed that does not penetrate from both the front and back surfaces.
A hemispherical recess of 0 to 200 μm is formed. Next, by applying a resin composition for backing material only on one side, a film is formed that fills the four minute parts on one side of the metal plate, and the resin composition is cured by irradiating this with light such as ultraviolet rays. .

After protecting one side as described above, secondary etching is performed again on the recesses on the other side using a corrosive solution, and the recesses on one side and the recesses on the other side due to secondary etching are removed at their bottoms. After communicating, the cured films of the pattern-forming photosensitive resin and the backing material resin composition are removed by alkali treatment to obtain a shadow mask. The alkaline treatment at this time is performed to melt and peel off the cured resin film, and the higher the alkaline liquid temperature is 4 degrees or higher, the more likely it is to dissolve.
20χ aqueous solution of caustic soda or caustic potash,
Use one heated to 50 to 90°C.

In the method for manufacturing the shadow mask described above, the resin composition for the backing material applied after the second etching must satisfy the following characteristics (1) to (4).

■ Hole-filling property: A property that uniformly wets the surface of a material having hemispherical recesses with a diameter of 100 to 200 μm and fills the recesses without creating air bubbles in the recesses.

■Surface smoothness: The property that air bubbles originating from microbubbles generated when the resin composition for backing material fills the hemispherical recesses do not remain on the resin surface layer after curing, and the surface of the cured resin film is smooth. .

■Curing property: The property of uniformly curing all the way to the bottom of the recess.

■Etching resistance: The hardened resin film has etching resistance against secondary etching caused by corrosive liquids such as iron perchloride, and has the property of protecting the surface of the coated material.

■Alkali dissolution/peelability: Characteristic that the hardened resin film can be easily dissolved and peeled off by alkali treatment.

If the performance requirements ① to ② above are not met, the following defects will occur in the manufactured shadow mask.

1) White bottle (the diameter of the through hole is larger than the standard value, and the amount of light transmitted is too high) 2) Black bottle (the diameter of the through hole is smaller than the standard value, and the light transmittance is too high) Too few defects) 3) Hole clogging due to residual coating film In order to satisfy the above performance, we use a composition in which a resin that forms a film that is soluble in alkaline liquid is dissolved in a organic solvent, or a film that is soluble in alkaline liquid and is cured with ultraviolet light. Various methods have been proposed for forming mold resins, but none of them have been able to satisfy all of the above-mentioned performances.

(Problems to be Solved by the Invention) The present inventors have discovered that the present invention satisfies all of the performance requirements of ■ to ■ above, can be coated on the surface of material 1↓ having minute irregularities without producing bubbles, and is highly active. The resin film hardened by irradiation with energy rays exhibits corrosion resistance against acid treatment and dissolves and peels when treated with alkali, making it suitable for a variety of applications, especially as a backing material for shadow masks. An object of the present invention is to provide an active energy ray-curable resin composition that is useful as a composition.

(El) Structure of the Invention [Means for Solving the Problems] As a result of intensive studies to solve the above-mentioned problems, the present inventors have determined that a low-viscosity mixture consisting of a compound having a specific functional group can be mixed with an organic solvent or It was discovered that a compound diluted with a mixture of an organic solvent and water exhibits good hole-filling properties and is extremely superior in backing materials for shadow masks and other uses, leading to the completion of the present invention. Ta.

That is, the present invention provides the following (a), (b), (c)
), (d) and (e); (a), (b)
The present invention relates to an active energy ray-curable resin composition characterized in that the viscosity of a mixture consisting of ) and (c) at 25°C is 3000 cps or less.

(a) A compound having one carboxyl group and one acryloyl or methacryloyl group in the molecule.

(b) Compounds other than the above (a) having one acryloyl or methacryloyl group in the molecule.

(c) Compounds having two or more acryloyl or methacryloyl groups in the molecule.

(d) Leveling agent.

(e) A mixture of an organic solvent or Ja78 agent and water.

Each component constituting the composition of the present invention will be explained below.

Component (a) contains one carboxyl group and one acryloyl or methacryloyl group [hereinafter (meth)
It is a compound with an acryloyl group, for example,
There are the following:

(2) A reaction product between a dibasic acid or/and its acid anhydride and an acrylate or methacrylate having a hydroxyl group at the end (hereinafter abbreviated as (meth)acrylate).

Examples of dibasic acids and/or their acid anhydrides include phthalic acid,
Examples include tetrahydrophthalic acid, hexahydrophthalic acid, maleic acid, and succinic acid, and they also have a hydroxyl group at the end (
As the meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, etc. can be used, and among the above reaction products,
Those having a carboxyl group at the end of the molecule are used.

Specific compounds include (meth)acryloyloxyethyl monophthalate (trade name "Aronixt 5400 J, etc., manufactured by Toagosei Kagaku Kogyo Co., Ltd.), (meth)acryloyloxypropyl monophthalate, and (meth)acryloyloxyethylmonotetrahydrophthalate. ,(
meth)acryloyloxypropyl monotetrahydrophthalate, (meth)acryloyloxyethyl monohexahydrophthalate, (meth)acryloyloxypropyl monohexahydrophthalate, (meth)acryloyloxyethyl monosuccinate (product manufactured by Toagosei Chemical Industry Co., Ltd.) Name "Aroninox h ~ 5500 J etc.),
Examples include (meth)acryloyloxypropyl monosuccinate and monohydroxyethyl maleate (meth)acrylate.

■Reaction product between lactone and (meth)acrylic acid.

As the lactone, ε-caprolactone etc. can be used, and this is combined with acrylic acid or methacrylic acid [hereinafter referred to as (
A compound having a carboxyl group at the end of the molecule, obtained by reacting meth)acrylic acid (abbreviated as meth)acrylic acid
For example, it is a product name manufactured by Toagosei Kagaku Kogyo Co., Ltd. (Aronixst 5300 J, etc.).

■Other compounds.

Specific compounds include (meth)acrylic acid and its dimer (trade name rQM-824 manufactured by Rohm and Haas).
J, etc.).

By blending one or more of the compounds exemplified in the above ■ to ■ as component (a) in the composition of the present invention,
A composition with good release properties can be obtained by alkali treatment of the cured product, but especially acrylic acid dimer (trade name: rQM-824, manufactured by Rohm and Haas) and (meth)acryloyloxyethyl monosuccinate. has a relatively low viscosity (viscosity at 25°C is 200 to 4'0
0 cps) is preferred in order to obtain a low viscosity composition.

The preferred blending amount of the above component (a) is as follows: (a) component (b)
Assuming that the total amount of the component and component (c) is 100 parts by weight (hereinafter, "part" means "part by weight"), the blending amount is 30 to 70 parts, and a more preferable blending amount is 40 to 60 parts. The blending amount is 30
If the amount is less than 100%, the alkali dissolution and peelability will not be sufficient. If the amount is more than 70 parts, the viscosity of the composition tends to be high, the hole-filling properties are insufficient, and the surface smoothness is also poor.

Component (b) is a compound other than the compound of component (a) above, which has one (meth)acryloyl group in the molecule.

This component (b) is effective in imparting elongation, flexibility, etc. to a cured coating film by blending it into the composition of the present invention. Examples of compounds suitable as component (b) include hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, acrylamide,
diacetone acrylamide, dimethyl acrylamide,
Benzyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-ethylhexyl (meth)
Acrylate, polyalkylene (carbon number 2-3) glycol monoalkyl (carbon number 1-9) ether mono(meth)acrylate, polyethylene glycol mono
Examples include (meth)acrylate and phenoxyethoxyethyl acrylate (trade name: Aronix M-101J, manufactured by Toagosei Kagaku Kogyo Co., Ltd.), and one or more of these may be used.

The above-mentioned compounds have a boiling point of 100'C or more at normal pressure, so they have the advantage of being less irritating to the skin when handled.

The preferred blending amount of component (b) is 20 to 6 parts, with the total amount of component (a), component (b), and component (c) being 100 parts.
There are 5 parts. If component (b) is less than 20 parts, the cured coating film will lack elongation and flexibility, and if it is more than 65 parts, the cured resin film will have insufficient alkali dissolution/peelability and etching resistance. Become.

Component (c) is a compound having two or more (meth)acryloyl groups in the molecule, and includes, for example, the following.

■Polyol poly(meth)acrylate.

It is a reaction product of a polyhydric alcohol and (meth)acrylic acid, and polyglycols such as polyethylene glycol and polypropylene glycol, trimethylolpropane, and pentaerythritol can be used as the polyhydric alcohol.

A specific compound is polyprolene glycol di(
meth)acrylate, polybrobylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate
Examples include acrylate.

In addition, reaction products of (meth)acrylic acid and compounds obtained by adding alkylene oxides such as ethylene oxide and propylene oxide to polyhydric alcohols, and (meth)acrylates having a terminal hydroxyl group with acids such as phosphoric acid are also used. Difunctional or trifunctional compounds such as the obtained phosphoric acid acrylate can also be used.

■Polyester poly(meth)acrylate.

Reaction products of polyester-type polyhydric alcohols and (meth)acrylic acid, such as dibasic acids such as adipic acid and phthalic acid, and their anhydrides, and polyhydric alcohols such as diethylene glycol, trimethylolpropane, and pentaerythritol. A polyfunctional compound obtained by reaction with (meth)acrylic acid can be used.

■Epoxy (meth)acrylate.

It is a compound obtained by reacting the epoxy group of an epoxy compound having two or more epoxy groups in the molecule with (meth)acrylic acid. For example, it is a polyglycidyl ether of a polyhydric alcohol such as diglycidyl ether of bisphenol A. and (meth)acrylic acid. By adding one or more of the above compounds to the composition of the present invention, the curability of the composition and the etching resistance of the cured resin film can be improved. In addition, the above compound has a concentration of 1 at normal pressure.
It has a boiling point of 00°C or higher and has the advantage of being less irritating to the skin when handled.

The preferred amount of component (c) is 1 to 30 parts, and the more preferred amount is 3 to 15 parts, based on 100 parts of the total amount of component (a), component (b), and component (c). The blending amount is 1
If the amount is less than 100%, the curability of the composition will be lowered, and the etching resistance of the cured resin film will also be lowered. If the amount is more than 30 parts, the alkali dissolution and peelability of the cured film may become insufficient.

Component (d) is a leveling agent.

This component makes it possible to adjust the hole-filling properties of the composition and the surface smoothness of the cured resin film, and by using the -a surfactant, the purpose can be fully achieved.

As a specific leveling agent, for example, Florado FC-430, which is a nonionic fluorinated alkyl ester, is used.
(manufactured by Sumitomo 3M Ltd.), Megafac P-17
7 (manufactured by Dainippon Ink Co., Ltd.), and silicone surfactants L-7001 and L-7002 (Nippon Unicar Co., Ltd.).

The blending amounts of component (d) are component (a), component (b), and (
The total amount of component c) is preferably 0.01 to 5 parts, based on 100 parts. If it is less than 0.01 part, it is difficult to impart properties such as hole-filling properties and surface smoothness, and if it exceeds 5 parts, the cured resin film may crack (abbreviated as cissing) or swell. Surface defects are more likely to occur. component(
A more preferred amount of d) is 0.05 to 1 part.

Component (e) is a mixture of an organic solvent or an organic solvent and water.

This component is added as a diluent in order to further reduce the viscosity of the composition to facilitate the coating operation and to reduce the film thickness during coating by drying or other means.

The R solvent is blended for the purpose of improving drying properties, and preferred solvents include organic solvents such as alcohol, cellosolve, ketone, and ester solvents that have good miscibility with water. .

The blending amounts of component (e) are component (a), component (b), and (
c) 100 parts to 450 parts, assuming the total amount of ingredients as 100 parts
When using water as component (e), the weight ratio of water and organic solvent is preferably water/organic solvent =
It is preferable to set it to 3/l or less.

(f) Other ingredients.

When the resin composition of the present invention is cured by irradiation with light such as ultraviolet rays, in order to provide the composition with sufficient photocurability, sensitizers such as benzophenone and its Derivatives such as benzoin, benzoin alkyl ether, pendyl methyl ketul, and 1-hydroxycyclohexylphenyl ketone (Irgacure 184 manufactured by Ciba Geigy) can be blended.

The compounding amount of the aggravating agent is (a) component, (b) component, and (c)
The amount is preferably 1 to 10 parts, based on 100 parts of the total amount of the components. If it is less than 1 part, the effect of promoting the initiation of photopolymerization will be insufficient, and if it exceeds 10 parts, the components necessary for forming a cured film will be relatively depleted, and the properties required for the cured resin film will deteriorate. It's coming. A more preferable amount of component (f) to be used is 2 to 8 parts.

Component (a), component (b) and (
The viscosity at 25° C. of the three-component mixture consisting of component c) is 3000 cps or less, and a more preferable viscosity is 10
00 cps or less, and the viscosity of the mixture is from (a) to (
It can be easily adjusted by appropriately selecting and using the types and blending amounts of the various components c).

If the viscosity of the composition at 25° C. exceeds 3000 cps, it becomes difficult to uniformly wet the surface of the material having hemispherical recesses and fill the holes.

In order to obtain the resin composition of the present invention, it is sufficient to uniformly mix each component by a normal mixing means, and there are no particular limitations on the order of mixing the various components, the mixing device, etc. It should be noted that the components are solid at room temperature. When mixing, the components can be heated to a temperature at which they melt.

As a method for applying the resin composition of the present invention, any conventional application method such as spraying, flow coating, dip coating, etc. can be used. Heating the resin coating to a temperature equal to or higher than room temperature is a preferred operation if there are no restrictions on equipment, etc., because it can improve the hole-filling properties by lowering the viscosity of the composition.

Curing of the composition of the present invention by irradiation with active energy rays and alkali treatment of the cured product may be carried out according to conventional methods.

[Examples and comparative examples]

Next, the present invention will be explained in more detail by giving Examples and Comparative Examples.

In addition, various characteristics of the composition and its cured product were evaluated by the following methods.

Viscosity> The viscosity of the composition at 25°C was measured using an E-type viscometer.

Hole-filling property> The hole-filling state when the resin composition of the present invention was applied to a shadow mask that had undergone primary etching was visually determined.

O There are no bubbles at all.

8. There are air bubbles in some holes.

× There are air bubbles all over the surface.

<Surface Smoothness> After the resin composition applied onto the shadow mask was cured by irradiation with ultraviolet rays, the surface condition of the cured product and the uniformity of the film thickness were visually determined.

Uniform O film thickness, no defects.

8. Some parts have uneven film thickness and surface defects.

× Many cissing or unevenness occurred.

Etching resistance〉 A shadow mask with a cured resin film formed at a concentration of 43%
After being immersed in an aqueous FeCl* solution at 60° C. for 30 minutes, the surface condition of the cured resin film was visually determined.

O No change at all.

8. Colored.

× Bulging or peeling occurred.

Alkali dissolution/removability> A shadow mask with a cured resin film formed at a concentration of 20%
After being immersed in an aqueous NaOH solution at 80° C. for 1 minute, the dissolution and peelability of the cured resin film was visually determined.

◎ Completely dissolved and peeled off.

O Although it did not completely melt, it peeled off.

× No peeling occurred.

Example 1 50 parts of acryloyloxyethyl monophthalate (trade name [Aronixt 5400J, manufactured by Toagosei Kagaku Kogyo Co., Ltd.] as the component (a), and 35 parts of acryloylmorpholine (rACMO manufactured by Kojin Co., Ltd.) as the component (b) Trimethylolpropane triacrylate (trade name manufactured by Toagosei Kagaku Kogyo Co., Ltd. [
(d) to 100 parts of a composition mixed with 15 parts of Aronixst 309 J) while heating it to 60°C.
After dissolving and mixing 0.1 part of Megafunk F177 (manufactured by Dainippon Ink & Chemicals Co., Ltd.) as a component and 5 parts of 1-hydroxycyclohexylphenyl ketone (Irgacure 184 manufactured by Ciba Geigy) as a sensitizer, the mixture was cooled to room temperature. , 210 parts of water, 2 parts of isopropanol as component (e)
]0 parts were mixed to obtain an ultraviolet curable resin composition.

Examples 2 to 3 The blending ratio of component (a), component (b) and component (c) was
An ultraviolet curable resin composition was obtained in the same manner as in Example 1 except for the changes shown in Table 1.

Comparative Example 1 An ultraviolet curable resin composition was obtained in the same manner as in Example 3, except that the component (c) was not blended and the amount of the component (b) was increased.

Comparative Example 2 An ultraviolet curable resin composition was obtained in the same manner as in Example 3 except that component (d) was not blended.

Comparative Example 3 An ultraviolet curable resin composition was obtained in the same manner as in Example 3 except that component (e) was not blended.

The ultraviolet curable resin compositions according to Examples 1 to 3 and Comparative Examples 1 to 3 were applied to a shadow mask (hole diameter: 100 to 200 μm) that had undergone secondary enoting using an airless sprayer to obtain a film thickness of 200 μm. It was coated to a thickness of ~300 μm. The resin coating film dried at 120° C. for 3 minutes was irradiated with ultraviolet rays using an 80 kW/cm concentrating high-pressure mercury lamp, and it was confirmed that the resin was cured by the absence of tack on the surface of the resin coating film. When the coating film performance was evaluated, the results shown in Table 1 were obtained.

Example 4 30 parts of the above-mentioned Aronixst 5400 j (trade name, manufactured by Toagosei Chemical Industry Co., Ltd.) and acryloyloxyethyl monosuccinate (trade name, "Aronixt-5500", manufactured by Toagosei Chemical Industry Co., Ltd.) were used as components (a). 20 parts, 35 parts of dimethylacrylamide (rDMAAJ manufactured by Kojin Co., Ltd.) as the component (b), 15 parts of Aronixst 309 (trade name, manufactured by Toagosei Kagaku Kogyo Co., Ltd.) as the component (c), Florade as the component (d) F.C.
-430 (manufactured by Sumitomo 3M Ltd.), 5 parts of Irgacure 184 as a sensitizer, 210 parts of water and 210 parts of isopropanol as component (e) were mixed in the same manner as in Example 1, and UV curing was carried out. A mold resin composition was obtained.

Example 5 50 parts of acrylic acid dimer (trade name [Aronixt 5600J, manufactured by Toagosei Kagaku Kogyo Co., Ltd.) as component (a), 20 parts of hydroxyethyl methacrylate (lIE?IA) and tetrahydrofurfuryl as component (b) Methacrylate (T) IF? l^) 20 copies, (c
) component is pentaerythritol hexaacrylate (product name: Aroninox M manufactured by Toagosei Chemical Industry Co., Ltd.).
-4004), 1 part of Megafac F-177 (manufactured by Dainippon Ink Co., Ltd.) as the component (d), 5 parts of Irgacure 184 as the sensitizer, 100 parts of water as the component (e), and 1 part of Irgacure 184 as the sensitizer. 100 parts of tool and 45 parts of butyl cellosolve were mixed in the same manner as in Example 1 to obtain an ultraviolet curable resin composition.

Example 6 As component (a), Toagosei Kagaku Kogyo Co., Ltd. product name [
65 parts of Aroninox M-5400J, 20 parts of monoζACMO as component (b), tris(acryloyloxyethyl) isocyanurate as component (c) (trade name "Aroninx 1-315J, manufactured by Toagosei Chemical Industry Co., Ltd.")
15 parts of Megafanoku I'-177 as component (d)
0.1 part, 5 parts of Irgacure 184 as a sensitizer,
(e) 100 parts of water and 32 parts of isopropanol as ingredients
0 parts were mixed in the same manner as in Example 1 to obtain an ultraviolet curable resin composition.

Comparative Example 4 As component (a), Toagosei Kagaku Kogyo Co., Ltd. product name “
90 parts of Aronix M-5400J, 1 part of polyester polyacrylate (trade name "Aronix M-8060J, manufactured by Toagosei Kagaku Kogyo Co., Ltd.) as component (c)"
(e
) 210 parts of water and 210 parts of isopropanol were mixed in the same manner as in Example 1 to obtain an ultraviolet curable resin composition.

Comparative Example 5 As component (a), Toagosei Chemical Industry Co., Ltd. product name [
50 parts of Aronix M-54004, as component (c), manufactured by Toagosei Kagaku Kogyo Co., Ltd. under the trade name "Aronilla"
50 parts of "M-8060", 0.1 part of Megafanoku F-177 as component (d), 5 parts of Irgacure 184 as a sensitizer, 210 parts of water and 210 parts of isopropanol as component (e). , and were mixed in the same manner as in Example 1 to obtain an ultraviolet curable resin composition.

The above-mentioned ultraviolet curable resin composition was applied to the shadow mask that had been subjected to the secondary enotting using an airless sprayer so that the film thickness was 200 to 3001 Im. 1
After drying at 20° C. for 3 minutes, it was cured using an 80 kW/cm condensing high pressure mercury lamp. The coating film was evaluated and Table 2
The results shown are obtained.

(c) Effects of the Invention The composition of the present invention is applied to the surface of a material having fine irregularities without forming bubbles, and after drying the diluent, it is rapidly cured by irradiation with active energy rays, and is dissolved in alkali. This is a resin composition that forms a cured product with peelability.

Therefore, it is particularly useful as a resin composition for a backing material after secondary etching, which is one step in the manufacturing process of a shadow mask. By producing this, properties such as hole-filling properties, surface smoothness, hardenability, etching resistance, and alkali dissolution/peelability are fully satisfied. Furthermore, since it is possible to prevent liquid flow during drying and to make the cured film thinner, it is possible to create a shadow mask that has very good removability and does not cause defects such as white pins, black pins, and hole clogging due to residual paint. It can be manufactured.

Because the composition of the present invention has the above-mentioned features, it can be used in many fields other than as a resin composition for backing material in the production of shadow masks, such as as a casting material, paint, or molding material9. The composition of the present invention is useful in that it can improve existing processes, and its industrial value is extremely large.

Claims (1)

[Claims] 1. Consisting of the following (a), (b), (c), (d) and (e), 2 of a mixture consisting of (a), (b) and (c)
An active energy ray-curable resin composition having a viscosity of 3000 cps or less at 5°C. (a) A compound having one carboxyl group and one acryloyl or methacryloyl group in the molecule. (b) Compounds other than the above (a) having one acryloyl or methacryloyl group in the molecule. (c) Compounds having two or more acryloyl or methacryloyl groups in the molecule. (d) Leveling agent. (e) Organic solvents or mixtures of organic solvents and water.