JPH02108773U - - Google Patents
Info
- Publication number
- JPH02108773U JPH02108773U JP1680089U JP1680089U JPH02108773U JP H02108773 U JPH02108773 U JP H02108773U JP 1680089 U JP1680089 U JP 1680089U JP 1680089 U JP1680089 U JP 1680089U JP H02108773 U JPH02108773 U JP H02108773U
- Authority
- JP
- Japan
- Prior art keywords
- roll
- glue
- gluing
- sided corrugated
- changed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
Landscapes
- Coating Apparatus (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1680089U JPH02108773U (tr) | 1989-02-17 | 1989-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1680089U JPH02108773U (tr) | 1989-02-17 | 1989-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108773U true JPH02108773U (tr) | 1990-08-29 |
Family
ID=31230042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1680089U Pending JPH02108773U (tr) | 1989-02-17 | 1989-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108773U (tr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010051920A (ja) * | 2008-08-29 | 2010-03-11 | Hirano Tecseed Co Ltd | 基材処理装置 |
-
1989
- 1989-02-17 JP JP1680089U patent/JPH02108773U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010051920A (ja) * | 2008-08-29 | 2010-03-11 | Hirano Tecseed Co Ltd | 基材処理装置 |