JPH02108569U - - Google Patents
Info
- Publication number
- JPH02108569U JPH02108569U JP1989014408U JP1440889U JPH02108569U JP H02108569 U JPH02108569 U JP H02108569U JP 1989014408 U JP1989014408 U JP 1989014408U JP 1440889 U JP1440889 U JP 1440889U JP H02108569 U JPH02108569 U JP H02108569U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wire solder
- wire
- tank
- journey
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 210000000078 claw Anatomy 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本願考案にかかる線ハンダの供給装置
８の全体構成図、第２図は本願考案に係る線ハン
ダ送り機構の要部拡大側面図、第３図は線ハンダ
の案内状態を示す拡大断面図、第４図は従来例の
全体構成図である。
１……ボビン、２……線ハンダ、５……線ハン
ダ送り機構、６……ハンダ槽、７……ガイド部材
、８……線ハンダの供給装置、１０……溶融ハン
ダ、１１ａ，１１ｂ……爪。
FIG. 1 is an overall configuration diagram of the wire solder supply device 8 according to the present invention, FIG. 2 is an enlarged side view of the main part of the wire solder feeding mechanism according to the present invention, and FIG. 3 is an enlarged view showing the wire solder guiding state. The sectional view, FIG. 4, is an overall configuration diagram of a conventional example. DESCRIPTION OF SYMBOLS 1... Bobbin, 2... Wire solder, 5... Wire solder feeding mechanism, 6... Solder tank, 7... Guide member, 8... Wire solder supply device, 10... Molten solder, 11a, 11b... …nail.
Claims (1)
繰り出される線ハンダを供給する線ハンダの供給
装置であつて、 線ハンダの供給経路に沿つて所定距離を往復移
動するとともに、上記線ハンダを上記ハンダ槽に
供給する往路において上記線ハンダの両側を挟圧
保持する一方、始点に戻る復路においては上記線
ハンダの挟圧保持を解除する一対の爪を備える線
ハンダ送り機構と、上記線ハンダ送り機構によつ
て送られる線ハンダを上記ハンダ槽へ曲折案内す
るガイド部材とを備えることを特徴とする、線ハ
ンダの供給装置。[Scope of Claim for Utility Model Registration] A wire solder supply device that supplies wire solder fed out from a bobbin to a solder tank that stores molten solder, which reciprocates a predetermined distance along a wire solder supply route. , a wire solder feed mechanism comprising a pair of claws that clamps and holds both sides of the wire solder on the outward journey for supplying the wire solder to the solder tank, and releases the clamping hold on the wire solder on the return journey to the starting point; and a guide member that bends and guides the wire solder sent by the wire solder feeding mechanism to the solder tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989014408U JPH0622539Y2 (en) | 1989-02-09 | 1989-02-09 | Wire solder supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989014408U JPH0622539Y2 (en) | 1989-02-09 | 1989-02-09 | Wire solder supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02108569U true JPH02108569U (en) | 1990-08-29 |
| JPH0622539Y2 JPH0622539Y2 (en) | 1994-06-15 |
Family
ID=31225580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989014408U Expired - Lifetime JPH0622539Y2 (en) | 1989-02-09 | 1989-02-09 | Wire solder supply device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622539Y2 (en) |
-
1989
- 1989-02-09 JP JP1989014408U patent/JPH0622539Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622539Y2 (en) | 1994-06-15 |
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