JPH0210796A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH0210796A JPH0210796A JP16148188A JP16148188A JPH0210796A JP H0210796 A JPH0210796 A JP H0210796A JP 16148188 A JP16148188 A JP 16148188A JP 16148188 A JP16148188 A JP 16148188A JP H0210796 A JPH0210796 A JP H0210796A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- resin layer
- insulating
- resin
- electroless copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 74
- 239000011347 resin Substances 0.000 claims abstract description 74
- 238000007747 plating Methods 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000010949 copper Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 7
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 239000003054 catalyst Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 9
- 238000001723 curing Methods 0.000 claims 1
- 238000000016 photochemical curing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 6
- 238000011109 contamination Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000003197 catalytic effect Effects 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 9
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 3
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線板の製造方法に関し、特に無電解銅め
っきにより回路パターンを形成する印刷配線板の製造方
法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a printed wiring board, and particularly to a method for manufacturing a printed wiring board in which a circuit pattern is formed by electroless copper plating.
従来、この種の印刷配線板の製造方法は、第３図＜ａ）
〜（ｆ）に示す工程により製造されていた。ずなわち第
３図（ａ）に示す如く、絶縁基板１にスルホール、ピア
ホール等になる孔１ｏを穿設し、第３図（ｂ）の如く、
無電解銅めっき用の触媒４の処理を行ない、次いで、第
３図（ｃ）の如くドライフィルム状の光硬化型の樹脂パ
ターン３ａを形成し、次に、第３図（ｄ）の如く無電解
銅めっきパターン５を形成した後、第３図（ｅ）の如く
、ドライフィルム状の光硬化型の樹脂バタ−ン３ａを剥
離除去し、次いで、第３図（ｆ）の如くはんだ付は不用
部分に、第２絶縁樹脂ノ＜ターン６を形成する印刷配線
板の製造方法となっていた。Conventionally, the manufacturing method of this type of printed wiring board is as shown in Fig. 3<a).
It was manufactured by the steps shown in ~(f). That is, as shown in FIG. 3(a), holes 1o, which will become through holes, peer holes, etc., are bored in the insulating substrate 1, and as shown in FIG. 3(b),
A catalyst 4 for electroless copper plating is treated, and then a dry film-like photocurable resin pattern 3a is formed as shown in FIG. After forming the electrolytic copper plating pattern 5, the dry film-like photocurable resin pattern 3a is peeled off as shown in FIG. 3(e), and then the soldering is carried out as shown in FIG. 3(f). The method for manufacturing a printed wiring board involves forming second insulating resin turns 6 in unnecessary parts.
上述した従来の印刷配線板の製造方法には次のような欠
点がある。The conventional printed wiring board manufacturing method described above has the following drawbacks.
（１）無電解銅めっきパターン以外の絶縁基板表面に、
触媒残渣が残りやすいため、回路パターン間の絶縁抵抗
特性が悪い。（一般に触媒には、金属のバラジウあるい
は銅を使用するため）り２）無電解銅めっきを行なう場
合、剥離可能な光硬化型の樹脂を使用して逆版めつきレ
ジストパターンを形成するため、無電解銅めっき液中に
光硬化型の樹脂より有機物が溶出し、無電解銅めっき渋
を汚染する。(1) On the surface of the insulating substrate other than the electroless copper plating pattern,
Catalyst residue tends to remain, resulting in poor insulation resistance characteristics between circuit patterns. 2) When performing electroless copper plating, a reversible plating resist pattern is formed using a removable photocurable resin. Organic substances are eluted from the photocurable resin into the electroless copper plating solution and contaminate the electroless copper plating.
本発明の目的は、従来の欠点を除去し、回路パターン間
の絶縁抵抗特性がすぐれ、また無電解鋼めっき液中に光
硬化型の樹脂より有機物が溶出することがない印刷配線
板の製造方法を提供することにある。The purpose of the present invention is to eliminate the drawbacks of the conventional method, to have excellent insulation resistance characteristics between circuit patterns, and to prevent organic substances from being leached from a photocurable resin into an electroless steel plating solution. Our goal is to provide the following.
〔課題を解決するための手段〕
本発明の印刷配線板の製造方法は、絶縁基板表面に光硬
化型でかつ熱硬化型の第１絶縁樹脂層を形成する工程と
、前記第１絶縁樹脂層の上面に光硬化型の樹脂層を形成
する工程と、前記樹脂層の形成された絶縁基板に孔を穿
設する工程と、前記第１絶縁樹脂層および前記光硬化型
の樹脂層にマスクフィルムを介して露光した後、前記第
１絶縁樹脂層および前記光硬化型の樹脂層の未露光部分
を現像除去し、樹脂パターンを形成する工程と、前記樹
脂パターンのうち前記第１絶縁樹脂層のパターンを熱硬
化する工程と、前記絶縁基板に無電解銅めっき用の触媒
処理をする工程と、前記樹脂パターンのうち前記光硬化
型の樹脂のパターンを剥離除去する工程と、前記絶縁基
板の触媒処理された部分に無電解銅めっきを形成する工
程と、前記無電解銅めっきパターンのはんだ付は不用部
分に第２絶縁樹脂層を形成する工程とを含むことを特徴
として構成される。[Means for Solving the Problems] The method for manufacturing a printed wiring board of the present invention includes the steps of forming a photocurable and thermosetting first insulating resin layer on the surface of an insulating substrate, and the first insulating resin layer. forming a photocurable resin layer on the upper surface; forming holes in the insulating substrate on which the resin layer is formed; and forming a mask film on the first insulating resin layer and the photocurable resin layer. After exposing the first insulating resin layer and the photo-curable resin layer to light through a a step of thermally curing the pattern, a step of treating the insulating substrate with a catalyst for electroless copper plating, a step of peeling and removing the photocurable resin pattern of the resin pattern, and a step of treating the insulating substrate with a catalyst. The present invention is characterized in that it includes a step of forming electroless copper plating on the treated portion, and a step of forming a second insulating resin layer on the portion where soldering of the electroless copper plating pattern is unnecessary.
本発明の印刷配線板の製造方法は、第１絶縁樹脂層と光
硬化型の樹脂層を重ねて形成し、同時にパターンを形成
し、触媒処理をしているため、光硬化型の樹脂パターン
を剥離除去すると、触媒が無電解銅めっきパターンを形
成したい所望の部分だけに残るため触媒残渣が回路パタ
ーン間に残らないため回路パターン間の絶縁抵抗の低下
を来さない。In the method for manufacturing a printed wiring board of the present invention, the first insulating resin layer and the photocurable resin layer are stacked, and the pattern is simultaneously formed and catalyzed, so the photocurable resin pattern is formed. When the catalyst is peeled off and removed, the catalyst remains only in the desired areas where the electroless copper plating pattern is to be formed, and no catalyst residue remains between the circuit patterns, so that the insulation resistance between the circuit patterns does not decrease.
また、光硬化型の樹脂は、無電解銅めっき液中で有機物
を溶出させやすく無電解銅めっき液を汚染するが、本発
明では無電解銅めっきを行う前に光硬化型の樹脂を剥離
除去しているため無電解銅めっき液を汚染することがな
い。In addition, photocurable resins tend to elute organic matter in the electroless copper plating solution and contaminate the electroless copper plating solution, but in the present invention, the photocurable resin is peeled off and removed before electroless copper plating. Therefore, it does not contaminate the electroless copper plating solution.
次に、本発明について図面を参照して説明する。第１図
（ａ）〜（ｇ＞は本発明の第１の実施例を説明するため
に工程順に示した印刷配線板の断面図である。Next, the present invention will be explained with reference to the drawings. FIGS. 1A to 1G are cross-sectional views of a printed wiring board shown in the order of steps for explaining the first embodiment of the present invention.
まず、第１図（ａ）の如く、絶縁基板１の表面に光硬化
型でかつ熱硬化型の液状の第１絶縁樹脂層２をカーテン
コーター、ロールコータ−及びスクリーン印刷法などに
より形成し、７０〜１００℃で５〜３０分間乾燥する。First, as shown in FIG. 1(a), a photocurable and thermosetting liquid first insulating resin layer 2 is formed on the surface of an insulating substrate 1 using a curtain coater, a roll coater, a screen printing method, etc. Dry at 70-100°C for 5-30 minutes.
次に、第１絶縁樹脂層２の上面にドライフィルム状の光
硬化型の樹脂層３をラミネートして形成する。Next, a photocurable resin layer 3 in the form of a dry film is laminated onto the upper surface of the first insulating resin layer 2 .
次に、第１図（ｂ）の如く、スルホール、ピアホール等
になる孔１０を形成し、次いで、第１図（ｃ）の如く、
マスクフィルムを介して露光し、第１絶縁樹脂層２およ
びドライフィルム状の光硬化型の樹脂層３の未露光部分
を１．１．１トリクロロエタンで現像除去し、所望の第
１絶縁樹脂パターン２ａおよびドライフィルム状の光硬
化型の樹脂パターン３ａを形成し、第１絶縁樹脂パター
ン２ａの熱硬化分を硬化させるために、１３０〜１５０
℃で３０〜６０分間の加熱処理を行なう。Next, as shown in FIG. 1(b), a hole 10 such as a through hole or a pier hole is formed, and then, as shown in FIG. 1(c),
The unexposed portions of the first insulating resin layer 2 and dry film-like photocurable resin layer 3 are developed and removed with 1.1.1 trichloroethane by exposing to light through a mask film to form a desired first insulating resin pattern 2a. 130 to 150 to form a dry film-like photocurable resin pattern 3a and cure the thermosetting portion of the first insulating resin pattern 2a.
Heat treatment is performed at ℃ for 30 to 60 minutes.
次に、第１図（ｄ）の如く、触媒処理を行ない触媒４を
絶縁基板１．ドライフィルム状の光硬化型の樹脂パター
ン３ａの表面およびスルホール。Next, as shown in FIG. 1(d), catalyst treatment is performed to transfer the catalyst 4 to the insulating substrate 1. The surface and through holes of a dry film-like photocurable resin pattern 3a.
ピアホールとなる孔の壁面に付着する。It adheres to the wall of the hole that becomes the pier hole.
次に、第１図（ｅ）の如く塩化メチレンでドライフィル
ム状の光硬化型の樹脂パターン３ａを剥離除去し、第１
図（ｆ）の如く無電解銅めっき処理により所望の無電解
銅めっきパターン５を形成する。Next, as shown in FIG. 1(e), the dry film-like photocurable resin pattern 3a is peeled off and removed using methylene chloride, and the first
As shown in Figure (f), a desired electroless copper plating pattern 5 is formed by electroless copper plating.
最後に、第１図（ｇ）の如くはんだ付は不用部分に第２
絶縁樹脂パターン６を形成することにより所望の印刷配
線板を得た。Finally, as shown in Figure 1 (g), solder the second
By forming the insulating resin pattern 6, a desired printed wiring board was obtained.
第２図（ａ）〜（ｇ）は、本発明の第２の実施例を説明
するために工程順に示した印刷配線板の断面図である。FIGS. 2(a) to 2(g) are cross-sectional views of a printed wiring board shown in the order of steps for explaining a second embodiment of the present invention.
まず、第２図（ａ）の如く、絶縁基板１の表面に、光硬
化型でかつ熱硬化型の液状の第１絶縁樹脂層２をカーテ
ンコーター、ロールコータ−及びスクリーン印刷法など
により形成し、７０〜１００℃で５〜３０分間乾燥する
。次に、第１絶縁樹脂層２の上面に液状の光硬化型の樹
脂層７をカーテンコーター、ロールコータ−及びスクリ
ーン印刷法などにより形成し、７０〜１００℃で５〜３
０分間乾燥する。First, as shown in FIG. 2(a), a photocurable and thermosetting liquid first insulating resin layer 2 is formed on the surface of the insulating substrate 1 using a curtain coater, a roll coater, a screen printing method, or the like. , dry at 70-100°C for 5-30 minutes. Next, a liquid photocurable resin layer 7 is formed on the upper surface of the first insulating resin layer 2 using a curtain coater, a roll coater, a screen printing method, etc.
Dry for 0 minutes.
次に、第２図（ｂ）の如く、マスクフィルムを介して露
光し、第１絶縁樹脂層２および液状の光硬化型の樹脂層
７の未露光部分を１．１．１トリクロロエタンで現像除
去し、所望の第１絶縁樹脂パターン２ａおよび液状の光
硬化型の樹脂パターン７ａを形成し、第１絶縁樹脂パタ
ーン２ａの熱硬化分を硬化させるために、１３０〜１５
０℃で３０〜６０分間に加熱処理を行なう。Next, as shown in FIG. 2(b), the unexposed portions of the first insulating resin layer 2 and the liquid photocurable resin layer 7 are removed by developing with 1.1.1 trichloroethane. Then, in order to form a desired first insulating resin pattern 2a and a liquid photocurable resin pattern 7a, and to harden the thermosetting portion of the first insulating resin pattern 2a,
Heat treatment is performed at 0° C. for 30 to 60 minutes.
次に、第２図（ｄ）の如く触媒処理を行ない触媒４を絶
縁基板１、液状の光硬化型の樹脂パターン７ａの表面お
よびスルホール、ピアホールとなる孔の壁面に付着する
。Next, as shown in FIG. 2(d), catalyst treatment is performed to adhere the catalyst 4 to the surfaces of the insulating substrate 1, the liquid photocurable resin pattern 7a, and the walls of the holes that will become through holes and peer holes.
次に、第２図（ｅ）の如く塩化メチレンで液状の光硬化
型の樹脂パターン７ａを剥離除去し、第２図（ｆ）の如
く、無電解銅めっき処理により所望の無電解鋼めっきパ
ターン５を形成する。Next, as shown in FIG. 2(e), the liquid photocurable resin pattern 7a is peeled off using methylene chloride, and as shown in FIG. 2(f), a desired electroless steel plating pattern is formed by electroless copper plating. form 5.
最後に、第２図（ｇ）の如く、はんだ付は不用部分に第
２絶縁樹脂パターン６を形成することにより所望の印刷
配線板を得た。Finally, as shown in FIG. 2(g), a desired printed wiring board was obtained by forming a second insulating resin pattern 6 in areas where soldering was not required.
以上説明したように本発明によれば、次の効果がある。 As explained above, the present invention has the following effects.
（１）無電解銅めっきパターン間に、触媒残渣４ａが残
らないため回路パターン間の絶縁抵抗特性が良い。(1) Since no catalyst residue 4a remains between the electroless copper plating patterns, the insulation resistance characteristics between the circuit patterns are good.
（２）無電解銅めっきを行う場合に剥離タイプの光硬化
型の樹脂パターンを剥離除去してから無電解銅めっきを
行うため無電解銅めっき液を光硬化型の樹脂パターンか
らの溶出物で汚染することなく無電解銅めっき液の野命
を長くできる。(2) When performing electroless copper plating, the peel-off type photocurable resin pattern is peeled off and then electroless copper plating is performed. The lifespan of electroless copper plating solution can be extended without contamination.
硬化型の樹脂層、３ａ・・・ドライフィルム状の光硬化
型の樹脂パターン、４・・・触媒、４ａ・・・触媒残渣
、５・・・無電解銅めっきパターン、６・・・第２絶縁
樹脂パターン、７・・・液状の光硬化型の樹脂層、７ａ
・・・液状の光硬化型の樹脂パターン、１０・・・孔。Curable resin layer, 3a... Dry film-like photocurable resin pattern, 4... Catalyst, 4a... Catalyst residue, 5... Electroless copper plating pattern, 6... Second Insulating resin pattern, 7...Liquid photocurable resin layer, 7a
...Liquid photocurable resin pattern, 10...holes.
Claims (1)
層を形成する工程と、前記第１絶縁樹脂層の上面に光硬
化型の樹脂層を形成する工程と、前記樹脂層の形成され
た絶縁基板に孔を穿設する工程と、前記第１絶縁樹脂層
および前記光硬化型の樹脂層にマスクフィルムを介して
露光した後、前記第１絶縁樹脂層および前記光硬化型の
樹脂層の未露光部分を現像除去し、樹脂パターンを形成
する工程と、前記樹脂パターンのうち前記第１絶縁樹脂
層のパターンを熱硬化する工程と、前記絶縁基板に無電
解銅めっき用の触媒処理をする工程と、前記樹脂パター
ンのうち前記光硬化型の樹脂のパターンを剥離除去する
工程と、前記絶縁基板の触媒処理された部分に無電解銅
めっきを形成する工程と、前記無電解銅めっきパターン
のはんだ付け不用部分に第２絶縁樹脂層を形成する工程
とを含むことを特徴とする印刷配線板の製造方法。forming a photocurable and thermosetting first insulating resin layer on the surface of the insulating substrate; forming a photocuring resin layer on the top surface of the first insulating resin layer; and forming the resin layer. After exposing the first insulating resin layer and the photocurable resin layer to light through a mask film, the first insulating resin layer and the photocurable resin are exposed to light through a mask film. a step of developing and removing an unexposed portion of the layer to form a resin pattern; a step of thermally curing the pattern of the first insulating resin layer among the resin patterns; and a catalyst treatment for electroless copper plating on the insulating substrate. a step of peeling and removing the photocurable resin pattern of the resin pattern; a step of forming electroless copper plating on the catalyst-treated portion of the insulating substrate; and a step of forming electroless copper plating on the catalyst-treated portion of the insulating substrate. A method for manufacturing a printed wiring board, comprising the step of forming a second insulating resin layer on a portion of the pattern that does not require soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161481A JPH0744337B2 (en) | 1988-06-28 | 1988-06-28 | Method for manufacturing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161481A JPH0744337B2 (en) | 1988-06-28 | 1988-06-28 | Method for manufacturing printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0210796A true JPH0210796A (en) | 1990-01-16 |
| JPH0744337B2 JPH0744337B2 (en) | 1995-05-15 |
Family
ID=15735906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161481A Expired - Fee Related JPH0744337B2 (en) | 1988-06-28 | 1988-06-28 | Method for manufacturing printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0744337B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57134996A (en) * | 1981-02-16 | 1982-08-20 | Nippon Electric Co | Method of producing printed circuit board |
| JPS57153497A (en) * | 1981-03-17 | 1982-09-22 | Tokyo Shibaura Electric Co | Method of forming printed circuit board |
| JPS6074692A (en) * | 1983-09-30 | 1985-04-26 | セイコーエプソン株式会社 | Method of producing landless through hole circuit board |
| JPS63302593A (en) * | 1987-06-03 | 1988-12-09 | Nippon Mining Co Ltd | Manufacture of printed circuit board |
-
1988
- 1988-06-28 JP JP63161481A patent/JPH0744337B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57134996A (en) * | 1981-02-16 | 1982-08-20 | Nippon Electric Co | Method of producing printed circuit board |
| JPS57153497A (en) * | 1981-03-17 | 1982-09-22 | Tokyo Shibaura Electric Co | Method of forming printed circuit board |
| JPS6074692A (en) * | 1983-09-30 | 1985-04-26 | セイコーエプソン株式会社 | Method of producing landless through hole circuit board |
| JPS63302593A (en) * | 1987-06-03 | 1988-12-09 | Nippon Mining Co Ltd | Manufacture of printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0744337B2 (en) | 1995-05-15 |
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