JPH02107788A - Device for continuously removing thin metal film - Google Patents

Abstract

PURPOSE:To partially and accurately remove a thin metal film by continuously uncoiling and travelling a produced coil form the thin film on a substrate and irradiating the thin metal film with laser light through a slit in a mask. CONSTITUTION:A substrate 3 of paper, plastics, etc., with a formed thin metal film is uncoiled from an uncoiling roll 1 and coiled around a coiling roll 2. The thin metal film on the travelling substrate 3 is irradiated with laser light 6 from a laser oscillator 4 through an optical system 5 and a slit in a mask 7 to evaporate and remove the desired part of the thin metal film. The thin metal film can be unrestrictedly removed by controlling irradiation with laser light 6 and the outline of the remaining part of the thin metal film is made clear.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for continuously removing a thin metal film formed on a substrate such as paper or plastic film by vapor deposition or plating.

[Conventional technology]

Conventionally, when manufacturing a continuous substrate such as paper or plastic film having a metal thin film deposited thereon with a material that is partially undeposited, an apparatus as shown in FIG. 2 has been used.

That is, in FIG. 2, 101 is a running substrate, 102 is a vapor deposition chamber, 103 is a deflector roll, 104 is a cooling roll, 105 is a winding roll, and 106 is an unwinding roll.

107 is a vapor deposition device provided below the cooling roll 104; 108 is a vapor deposition material placed in the vapor deposition device; 109 is a vapor deposition material storage container; 110 is a vapor deposition material heating device; 111 is a vapor deposition device provided below the cooling roll 104; edge mask,
112 is a plurality of masking units, and 113 is an exhaust pump unit.

In FIG. 2, a running substrate 101 is sent from an unwinding roll 106 to a cooling roll 104 via a deflector roll 103 in a deposition chamber 102, and is deposited on the cooling roll 104 by a deposition device 107.
05. The vapor deposition chamber 102 is maintained at a degree of vacuum suitable for vapor deposition by a vacuum pump unit 113.

On the other hand, the plurality of masking belts 112 run endlessly at a constant speed with the continuous substrate via the deflector roll 103, and run in close contact with the running substrate 101 on the cooling roll 104. Vapor deposition is performed only on the surface of the running substrate that is not in close contact.

[Problem to be solved by the invention]

In the conventional apparatus described above, there was a problem in that the metal for vapor deposition adhered to the surface of the masking groove, and maintenance was required.

In order to make it easier to remove the metal deposited on the surface of the masking belt, the belt surface was coated with low vapor pressure oil, but as this oil evaporated inside the vacuum container, Maintenance was required.

Furthermore, in order to change the number of masking belts, belt thickness, and belt spacing, it was necessary to open the vacuum container and make adjustments.

The present invention seeks to eliminate the drawbacks of the above-mentioned conventional devices.

[Means to solve the problem]

The metal thin film continuous removal apparatus of the present invention is as follows.

(1) An unwinding roll and a take-up roll that continuously run a product coil with a metal thin film formed on a substrate such as paper or plastic, and a laser oscillator that irradiates the metal thin film formed on the substrate with a laser beam. Equipped with:

(2) Furthermore, in the above continuous metal thin film removal apparatus, a mask was installed between the laser oscillator and the substrate.

[Effect]

In the present invention described in (1) above, by irradiating a metal surface with a laser beam for a short time using a laser oscillator, a thin film is formed on a substrate such as paper or plastic by vapor deposition or plating without damaging the substrate. can only evaporate metals. In this way, it is possible to produce a material that is partially uncoated with a metal thin film.

Further, the range of irradiation by the laser beam can be changed, and the portion of the metal thin film to be left and the portion to be removed can be freely changed.

In addition, the present invention (2) above provides the invention (1) above, in which the portion of the metal surface to be removed is reliably irradiated with a laser beam having a uniform energy intensity distribution by irradiating the laser beam through a mask. The boundary between the part where the metal thin film will remain and the part where it will be removed will become sharper.

〔Example〕

An embodiment of the present invention will be described with reference to FIG.

1 is an unwinding roll, 2 is a take-up roll, 3 is a plate made of paper, plastic film, etc. on one side of which a metal thin film is deposited or plated, 4 is a laser oscillator, and 5 is a controller for controlling the laser beam. An optical system such as a mirror for irradiating the metal thin film of the plate 3, 6 a laser beam, and 7 a mask having a slit provided near the plate 4 between the plate 4 and the optical system 6.

In this embodiment, the plate 3 on which the metal thin film is formed is unwound from an unwinding roll 1 and wound up by a winding roll 2. A laser beam 6 is irradiated from a laser oscillator 4 onto the surface of the running plate 3 on which the metal thin film is formed. The laser beam 6 is emitted from the laser oscillator 4, passes through the optical system 5 and the slit of the mask 7, and reaches the surface of the plate 3 on which the metal thin film is formed.

The laser beam 6 that reaches the surface of the traveling board 3 causes
The metal forming the thin film is evaporated and removed from the plate 3. In this way, the mask 7 is placed on the required part of the surface of the traveling board 30.
By irradiating the laser beam 6 through the laser beam 6, the metal in the required portion is evaporated and removed. Further, the part to be irradiated with the laser beam 6 can be freely controlled, and the part where the metal thin film on the plate 3 is to be left and the part to be removed can be freely determined. Moreover, since the laser beam 6 passes through the slit of the mask 7 and is irradiated onto the surface of the plate 30, the boundary between the portion where the metal thin film is left and the portion where it is removed becomes sharp.

This embodiment may be installed in the atmosphere or in a vacuum.

The energy density of the laser beam 6 in this embodiment is determined from the metal forming the thin film, the type and thickness of the metal, the material of the substrate, the thickness, and the traveling speed.

Further, a plurality of laser beams 6 may be irradiated in the width direction of the running plate 3, or the running direction of the running plate 30 may be changed and the laser beam 6 may be caused to reciprocate.
The laser beam 6 may be made to traverse in the width direction of the running plate 3.

In this example, a case will be described below in which a capacitor material is manufactured from a film in which 40 OA of Aρ is deposited on the surface of a 25-thick polypropylene film.

The amount of heat Q required to evaporate an Aρ deposited film with a thickness of 400 A is o, 34 kmy, 2. On the other hand, the damage thickness of the polypropylene film that is the substrate is 171% of the total thickness.
In order to suppress the laser irradiation time to 0.00, that is, 0.25 μm or less, the laser irradiation time τ is set as δ, where δ is the temperature penetration depth, τT≦0.
25X10-' k) ・'-11) Here, to:
In the thermal conductivity of polypropylene film.

= 2.74 x 10' (be 4).

From formula (1), τ≦1.90 x 10” (L)
= 6.84 x 10' (sec) If the laser irradiation length is 0.5μ, the film running speed V is v
="7f = 438-/ma.

When B is 10 hours during laser irradiation, the laser output W is W=QBL7T=89''/h=104W/x lift.

〔Effect of the invention〕

The present invention can have the following effects.

(1) A laser beam can be irradiated onto a desired part of a substrate such as paper or plastic on which a thin metal film is formed;
The metal forming the thin film on the substrate can be evaporated and removed without damaging the substrate, and the metal thin film portion and the metal-free portion on the substrate can be freely controlled.

(2) Unlike conventional equipment, maintenance of oil adhering to the vacuum container of the vacuum evaporation equipment and maintenance of the masking belt are no longer necessary, and productivity is increased.

(3) By installing a mask, the boundary between the part where the metal thin film is left and the part where it is removed can be made sharper.

[Brief explanation of the drawing]

FIG. 1 is a side view of an embodiment of the present invention, and FIG. 2 is a side view of a conventional metal thin film removal apparatus. 1... Unwinding roll, 2... Winding roll
3... A running board made of paper, plastic film, etc. on which a thin film is formed. 4...Laser oscillator, 5...Optical system. 6...V-f" ray, 7...mask. Agent: Patent attorney Akigai Sakama, 2 people.

Claims (1)

[Claims] (1) An unwinding roll and a take-up roll that continuously run a product coil with a metal thin film formed on a substrate such as paper or plastic, and a laser oscillator that irradiates the metal thin film formed on the substrate with a laser beam. A continuous metal thin film removal device characterized by comprising: (2) The metal thin film continuous removal apparatus according to claim (1), further comprising a mask installed between the laser oscillator and the substrate.