JPH02107039U - - Google Patents
Info
- Publication number
- JPH02107039U JPH02107039U JP1587789U JP1587789U JPH02107039U JP H02107039 U JPH02107039 U JP H02107039U JP 1587789 U JP1587789 U JP 1587789U JP 1587789 U JP1587789 U JP 1587789U JP H02107039 U JPH02107039 U JP H02107039U
- Authority
- JP
- Japan
- Prior art keywords
- type semiconductor
- conductive resin
- semiconductor layers
- type
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 1
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Description
第１図は本考案に係る積層熱電素子の一実施例
をｐ型半導体層とｎ型半導体層との積層例で示す
斜視図、第２図は本実施例における積層熱電素子
の断面図、第３図は積層熱電素子の斜視図である
。
１…ｐ型半導体層、２…ｎ型半導体層、３…導
電層、４…絶縁層、５ａ，５ｂ…ｐ型半導体セラ
ミツク板、６，６ａ，６ｂ…ｎ型半導体セラミツ
ク板、７ａ，８ａ，９ａ，１０ａ…表面電極、７
ｂ，８ｂ，９ｂ，１０ｂ…裏面電極、１１…絶縁
シート、１２…導電性樹脂層。
FIG. 1 is a perspective view showing an example of a laminated thermoelectric element according to the present invention as an example of laminating a p-type semiconductor layer and an n-type semiconductor layer, and FIG. 2 is a cross-sectional view of the laminated thermoelectric element in this embodiment. FIG. 3 is a perspective view of a laminated thermoelectric element. DESCRIPTION OF SYMBOLS 1... P-type semiconductor layer, 2... N-type semiconductor layer, 3... Conductive layer, 4... Insulating layer, 5a, 5b... P-type semiconductor ceramic board, 6, 6a, 6b... N-type semiconductor ceramic board, 7a, 8a, 9a, 10a... surface electrode, 7
b, 8b, 9b, 10b... Back electrode, 11... Insulating sheet, 12... Conductive resin layer.
Claims (1)
ｐ型とｎ型の両半導体層を電気的に接続する導電
性樹脂層が介在されるとともに、ｐ型とｎ型の両
半導体層の間の残りの部分には絶縁層が介在され
、これら導電性樹脂層と絶縁層とを介してｐ型半
導体層とｎ型半導体層とが交互に複数積層されて
一体化されている積層熱電素子であつて、前記導
電性樹脂層は弾性導電樹脂によつて形成されてい
る積層熱電素子。 A conductive resin layer that electrically connects both the p-type and n-type semiconductor layers is interposed in a part between the p-type and n-type semiconductor layers, and a conductive resin layer that electrically connects both the p-type and n-type semiconductor layers An insulating layer is interposed in the remaining part in between, and a laminated thermoelectric element in which a plurality of p-type semiconductor layers and n-type semiconductor layers are alternately laminated and integrated through these conductive resin layers and insulating layers. In the laminated thermoelectric element, the conductive resin layer is formed of an elastic conductive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1587789U JPH02107039U (en) | 1989-02-14 | 1989-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1587789U JPH02107039U (en) | 1989-02-14 | 1989-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02107039U true JPH02107039U (en) | 1990-08-24 |
Family
ID=31228319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1587789U Pending JPH02107039U (en) | 1989-02-14 | 1989-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02107039U (en) |
-
1989
- 1989-02-14 JP JP1587789U patent/JPH02107039U/ja active Pending