JPH02106993A - Manufacture of flexible printed circuit board - Google Patents
Manufacture of flexible printed circuit boardInfo
- Publication number
- JPH02106993A JPH02106993A JP26124088A JP26124088A JPH02106993A JP H02106993 A JPH02106993 A JP H02106993A JP 26124088 A JP26124088 A JP 26124088A JP 26124088 A JP26124088 A JP 26124088A JP H02106993 A JPH02106993 A JP H02106993A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- printing
- circuit board
- silver
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000007639 printing Methods 0.000 claims abstract description 42
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 40
- 229910052709 silver Inorganic materials 0.000 claims abstract description 40
- 239000004332 silver Substances 0.000 claims abstract description 40
- 238000001035 drying Methods 0.000 claims abstract description 39
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 22
- 238000010019 resist printing Methods 0.000 claims abstract description 11
- 238000005299 abrasion Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 14
- 238000007603 infrared drying Methods 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 abstract description 7
- 238000013508 migration Methods 0.000 abstract description 6
- 230000005012 migration Effects 0.000 abstract description 6
- 238000007650 screen-printing Methods 0.000 abstract description 6
- 239000002904 solvent Substances 0.000 abstract description 5
- 238000000137 annealing Methods 0.000 abstract description 4
- 230000008602 contraction Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 229920005668 polycarbonate resin Polymers 0.000 description 6
- 239000004431 polycarbonate resin Substances 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000005553 drilling Methods 0.000 description 5
- 239000000113 methacrylic resin Substances 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明はフレキシブル印刷回路基板の製造方法に係り
、特にポリエステル樹脂やポリカーボネイト樹脂、ある
いはメタクリル樹脂をフィルム状の極薄シートにしてフ
レキシブル印刷回路基板を形成するフレキシブル印刷回
路基板の製造方法に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a flexible printed circuit board, and in particular to a method for manufacturing a flexible printed circuit board using polyester resin, polycarbonate resin, or methacrylic resin as a film-like ultra-thin sheet. The present invention relates to a method for manufacturing a flexible printed circuit board.
［従来の技術］
印刷回路基板は、ベース部材として高価なポリイミード
樹脂からなるフィルム状の極薄シートを使用している。[Prior Art] Printed circuit boards use a film-like ultra-thin sheet made of expensive polyimide resin as a base member.
そして、ベース部材に所定形状の印刷回路を種々印刷に
よって形成し、特に印刷回路基板の形成を容易に果たし
、この印刷回路基板を電気ピアノやオルガン、あるいは
その他の鍵盤楽器に使用している。Then, a printed circuit of a predetermined shape is formed on the base member by various printing methods, and in particular, a printed circuit board is easily formed, and this printed circuit board is used for an electric piano, an organ, or other keyboard instruments.
［発明が解決しようとする問題点］
２・ころで、従来のフレキシブル印刷回路基板の製造方
法においては、フレキシブル印刷回路基板（Ｂ製造行程
中に銀パターン印刷とカーボン印刷とに゛おける熱乾燥
を使用している。[Problems to be Solved by the Invention] 2. By the way, in the conventional method for manufacturing flexible printed circuit boards, thermal drying of silver pattern printing and carbon printing is not carried out during the manufacturing process of flexible printed circuit boards (B). I am using it.
このため、夫々６０分程度の長い乾燥時間が必要となり
、大量生産がし難く、実用上不利であるという不都合が
ある。Therefore, a long drying time of about 60 minutes is required for each, which makes mass production difficult and is disadvantageous in practical terms.
また、フレキシブル印刷回路基板のベース部材として高
価なポリイミード樹脂からなるフィルム状の極薄シート
を使用していることにより、製造コストを大となり、経
済的にも不利であるという不都合がある。Furthermore, since an ultra-thin film-like sheet made of expensive polyimide resin is used as the base member of the flexible printed circuit board, manufacturing costs are increased, which is disadvantageous economically.
更に、ベース部材上の銀印刷回路による銀食われ現象を
発生することにより、部品の実装を確実に果たすことが
できず、導電性加工部位にスクリーン印刷を施さないこ
とと相俟って加工部位の信頼性が著しく低下させ、導電
性加工部位の接続不良が増大し、品質および生産性を低
下させ、実用上不利であるという不都合がある。Furthermore, due to the silver etching phenomenon caused by the silver printed circuit on the base member, it is not possible to reliably mount the parts, and together with the fact that screen printing is not performed on the conductive processing area, the processing area This has disadvantages in that the reliability of the conductive material is significantly reduced, the number of connection failures in the conductive processed parts is increased, the quality and productivity are reduced, and this is disadvantageous in practice.
更にまた、前記フレキシブル印刷回路基板のベース部材
の密着力・絶縁性−マイグレーションを防止することが
できないことにより、フレキシブル印刷回路基板の品質
向上が望めないという不都合がある。Furthermore, since it is impossible to prevent migration of the adhesion and insulation properties of the base member of the flexible printed circuit board, there is a disadvantage that the quality of the flexible printed circuit board cannot be improved.
［発明の目的コ
そこでこの発明の目的は、上述不都合を除去するために
、フレキシブル印刷回路基板の製造方法の銀パターン印
刷とカーボン印刷とにおける熱乾燥の替わりに遠赤外線
乾燥処理を施してフレキシブル印刷回路基板を゛製造す
ることにより、乾燥時間を極端に短縮させて製造時間を
減少させることができ、大量生産ができ、実用上有利で
あるとともに、安価なポリエステル樹脂やポリカーボネ
イト樹脂、あるいはメタクリル樹脂をフレキシブル印刷
回路基板のベース部材として使用でき、製造コストを低
廉とし得て、経済的に有利なフレキシブル印刷回路基板
の製造方法を実現するにある。[Purpose of the Invention] Therefore, in order to eliminate the above-mentioned disadvantages, the purpose of the present invention is to perform flexible printing by performing far-infrared drying treatment instead of heat drying in silver pattern printing and carbon printing in a method for manufacturing a flexible printed circuit board. By manufacturing circuit boards, it is possible to dramatically shorten the drying time and reduce the manufacturing time, allowing for mass production, which is advantageous in practice, and also allows the use of inexpensive polyester resin, polycarbonate resin, or methacrylic resin. It is an object of the present invention to provide an economically advantageous method for manufacturing a flexible printed circuit board that can be used as a base member of a flexible printed circuit board and that can reduce manufacturing costs.
［問題点を解決するための手段］
この目的を達成するためにこの発明は、フレキシブル印
刷回路基板のベース部材に寸法精度を良好とすべくアニ
ール処理を施し、このベース部材に銀インキによってス
クリーン印刷を施すとともにその後に熱乾燥を施して銀
パターン印刷を行い、次に耐摩耗性を大とすべくカーボ
ンインキを印刷するとともにその後に熱乾燥を施してカ
ーボン印刷を行い、前記ベース部材にレジスト印刷によ
り絶縁層を印刷し、次に銀印刷回路を印刷して銀パター
ン印刷を施し、前記ベース部材の全面に絶縁インキを印
刷してオーバレジスト印刷を行い、そしてベース部材を
打ち抜き加工し、ハンダを塗布してチップ部品とリード
部とを前記ベース部材に実装し、封止樹脂によって被覆
し硬化させて製造したフレキシブル印刷回路基板の製造
方法において、前記銀パターン印刷とカーボン印刷とに
おける熱乾燥の替わりに遠赤外線乾燥処理を施して前記
フレキシブル印刷回路基板を製造することを特徴とする
。[Means for Solving the Problem] In order to achieve this object, the present invention applies an annealing treatment to the base member of a flexible printed circuit board to improve dimensional accuracy, and screen prints the base member with silver ink. and then thermal drying to print a silver pattern, then print carbon ink to increase wear resistance, and then thermal drying to perform carbon printing, and resist printing on the base member. to print an insulating layer, then print a silver printed circuit to perform silver pattern printing, print insulating ink on the entire surface of the base member to perform over-resist printing, and then punch out the base member and solder it. In the manufacturing method of a flexible printed circuit board manufactured by coating and mounting chip components and lead parts on the base member, covering with a sealing resin and curing, the method replaces heat drying in the silver pattern printing and carbon printing. The flexible printed circuit board is manufactured by subjecting the flexible printed circuit board to far-infrared drying treatment.
［作用コ
上述の如〈発明したことにより、フレキシブル印刷回路
基板を製造する際に、銀パターン印刷とカーボン印刷と
における熱乾燥の替わりに遠赤外線乾燥処理を施してフ
レキシブル印刷回路基板を製造し、製造時間を減少させ
、実用上有利であるとともに、安価なポリエステル樹脂
やポリカーボネイト樹脂、あるいはメタクリル樹脂をフ
レキシブル印刷回路基板のベース部材として使用でき、
製造コストを低廉としている。[Function] As mentioned above, according to the invention, when manufacturing a flexible printed circuit board, instead of heat drying in silver pattern printing and carbon printing, far infrared drying treatment is applied to produce a flexible printed circuit board, It reduces manufacturing time, is practically advantageous, and allows the use of inexpensive polyester resin, polycarbonate resin, or methacrylic resin as the base material of the flexible printed circuit board.
Manufacturing costs are low.
［実施例］
以下図面に基づいてこの発明の実施例を詳細に説明する
。[Examples] Examples of the present invention will be described in detail below based on the drawings.
図面はこの発明の実施例を示すフレキシブル印刷回路基
板の製造用フローチャートである。The drawing is a flowchart for manufacturing a flexible printed circuit board showing an embodiment of the invention.
前記フレキシブル印刷回路基板のベース部材として高価
なポリイミード樹脂からなるフィルム状の極薄シートの
替わりに、安価なポリエステル樹脂やポリカーボネイト
樹脂、あるいはメタクリル樹脂を使用する。As the base member of the flexible printed circuit board, inexpensive polyester resin, polycarbonate resin, or methacrylic resin is used instead of an extremely thin film-like sheet made of expensive polyimide resin.
また、前記フレキシブル印刷回路基板の製造に際し、銀
パターン印刷とカーボン印刷とにおける熱乾燥の替わり
に、遠赤外線乾燥処理を施すものである。Furthermore, when manufacturing the flexible printed circuit board, far-infrared drying treatment is performed instead of heat drying in silver pattern printing and carbon printing.
次に図面のフレキシブル印刷回路基板の製造用フローチ
ャートに沿って説明する。Next, a description will be given along with a flowchart for manufacturing a flexible printed circuit board in the drawings.
先ず、前記フレキシブル印刷回路基板のベース部材に寸
法精度を良好とすべく、つまりベース部材の伸縮を阻止
すべく１５０°Ｃで６０分間加熱するアニール処理（ス
テップ１００）を施す。First, the base member of the flexible printed circuit board is subjected to an annealing treatment (step 100) in which it is heated at 150° C. for 60 minutes in order to improve dimensional accuracy, that is, to prevent expansion and contraction of the base member.
そして、ベース部材に溶剤型の銀インキによってスクリ
ーン印刷を施し、その後に、１２０℃で６０分間の熱乾
燥の替わりに９０秒間の遠赤外線乾燥処理を施して銀パ
ターン印刷（ステップ１０２）を行う。Then, screen printing is performed on the base member using solvent-based silver ink, and then, instead of heat drying at 120° C. for 60 minutes, far-infrared drying treatment is performed for 90 seconds to perform silver pattern printing (step 102).
次に、接点部位やコネクタ部の耐摩耗性を大とすべくカ
ーボンインキを印刷するとともに、その後に、１２０℃
で６０分間の熱乾燥の替わりに９０秒間の遠赤外線乾燥
処理を施してカーボン印刷（ステップ１０４）を行う。Next, we printed carbon ink to increase the wear resistance of the contact points and connectors, and then
Carbon printing (step 104) is performed by performing far-infrared drying treatment for 90 seconds instead of heat drying for 60 minutes.
前記ベース部材にジャンパー用レジスト印刷（ステップ
１０６）により絶縁層を印刷する。このとき、このレジ
スト印刷の印刷インキとしては、熱乾燥タイプのものや
紫外線硬化タイプのものがあり、印刷後に熱乾燥やＵＶ
（紫外線）乾燥を行う。An insulating layer is printed on the base member by jumper resist printing (step 106). At this time, the printing ink for this resist printing includes heat drying type and ultraviolet curing type, and after printing, heat drying and UV curing are used.
(Ultraviolet) Dry.
前記絶縁層は、上下印刷回路の絶縁と銀によるマイグレ
ーシロンを防止している。The insulating layer insulates the upper and lower printed circuits and prevents migration due to silver.
次に、銀印刷回路をスクリーン印刷して銀パターン印刷
（ステップ１０８）を施し、１２０℃で６０分間の乾燥
を行う。Next, silver pattern printing (step 108) is performed by screen printing a silver printed circuit, and drying is performed at 120° C. for 60 minutes.
前記ベース部材の銀印刷回路の全面に絶縁インキを印刷
し、外部接触時の絶縁とマイグレーシロンを防止すべく
オーバレジスト印刷（ステップ１１０）を行う。Insulating ink is printed on the entire surface of the silver printed circuit of the base member, and over-resist printing (step 110) is performed to prevent insulation and migration during external contact.
そして、外周穴あけ加工（ステップ１１２）を前記フレ
キシブル印刷回路基板に施す。Then, the flexible printed circuit board is subjected to outer periphery drilling (step 112).
つまり、フレキシブル印刷回路基板の保合及び外形を整
えるために穴あけと外形切削とを行うものであり、特に
穴の直径が５１１１１以上の場合にトムソンプレスが可
能となり、穴の直径が２１以下の場合または複数個の穴
の場合には金型プレス機による打ち抜き加工が可能とな
る。In other words, drilling and contour cutting are performed to secure and adjust the external shape of the flexible printed circuit board, and Thomson press is particularly possible when the hole diameter is 51111 or more, and when the hole diameter is 21 or less. Alternatively, in the case of multiple holes, punching using a die press machine is possible.
前記外周穴あけ加工（ステップ１１２）において、穴あ
けと外形切削とを一行程で同時に、あるいはいずれか一
方を先に行うことも可能である。In the outer periphery drilling process (step 112), it is also possible to perform the drilling and the external cutting simultaneously in one process, or one of them may be performed first.
実装部品のリード部と印刷回路とを保持させるべくクリ
ームハンダを塗布してハンダ塗布（ステップ１１４）を
行う。このとき、塗布剤としては、１５０″Ｃ以下で硬
化するクリームハンダや導電性接着剤を使用できる。Cream solder is applied to hold the lead portion of the mounted component and the printed circuit (step 114). At this time, as the coating agent, cream solder or conductive adhesive that hardens at 150''C or less can be used.
また、前記フレキシブル印刷回路基板にダイオードをチ
ップ化したチップ部品を自動マウンタによって実装し、
部品実装（ステップ１１６）を行う。Further, a chip component in which a diode is chipped is mounted on the flexible printed circuit board using an automatic mounter,
Component mounting (step 116) is performed.
そして、実装後に熱乾燥炉により所定温度にて乾燥硬化
させる。After mounting, it is dried and hardened at a predetermined temperature in a heat drying oven.
乾燥硬化後には、上述の部品実装の補強や銀印刷回路の
マイグレーション防止、あるいは絶縁対策のために封止
樹脂を用いてチップ部品と導電性接着剤との全体を被覆
すべくデイスペンサから吐出させつつ塗布し、封止剤カ
バー（ステップ１１８）を行う。After drying and curing, a sealing resin is used to cover the entire chip component and conductive adhesive by discharging it from a dispenser to reinforce the component mounting described above, prevent migration of the silver printed circuit, or as an insulation measure. and sealant cover (step 118).
そして、熱乾燥またはＵＶ乾燥ラインによって乾燥硬化
させる。Then, it is dried and cured using heat drying or a UV drying line.
このとき、前記封止樹脂としての必要条件は、■、絶縁
性が１０＋２Ωｃ１１以上の抵抗値のもの■、ポリエス
テルやポリカーボに密着の良いもの
■、銀のマイグレーション防止効果のあるもの■、フレ
キシブル印刷回路基板の伸縮率と柔らかさとに適合し、
多少の湾曲時にも順応できる柔軟性を有するもの
等が要求される。At this time, the necessary conditions for the sealing resin are: (1) It has insulation properties with a resistance value of 10 + 2 Ωc11 or more. (2) It has good adhesion to polyester or polycarbonate. (2) It has the effect of preventing silver migration. (2) It is a flexible printed circuit. Matches the expansion/contraction rate and softness of the substrate,
It is required to be flexible enough to adapt to some degree of bending.
すなわち、乾燥硬化時に温度や湿度変化に対して封止樹
脂とベース部材との変形率に差があると、フレキシブル
印刷回路基板全体の歪みや変形の原因となるためである
。That is, if there is a difference in deformation rate between the sealing resin and the base member due to changes in temperature and humidity during drying and curing, this will cause distortion and deformation of the entire flexible printed circuit board.
そして、チエッカ−による断線・シｓ−トーダイオード
判定などの製品検査（ステップ１２０）を行う。Then, a product inspection (step 120) is performed using a checker to determine whether there is a disconnection or a shutoff diode.
つまり、フレキシブル印刷回路基板の印刷回路の普通常
態φ抵抗値・チップ部品の作動部品と印刷回路との結線
状態−短絡等の検査、また外観上の異形、シワ、絶縁部
の剥離等をチエツクし、基準値内のもののみを包装出荷
する。In other words, we inspect the normal φ resistance value of the printed circuit on the flexible printed circuit board, the connection status between the working parts of the chip components and the printed circuit, and check for short circuits, as well as check for external irregularities, wrinkles, peeling of the insulation, etc. , only those within the standard values are packaged and shipped.
これにより、前記フレキシブル印刷回路基板の製造行程
中の銀パターン印刷とカーボン印刷とにおける熱乾燥の
替わりに遠赤外線乾燥処理を施し、乾燥時間を６０分か
ら９０秒に極端に短縮させて製造時間を減少させること
ができ、大量生産ができ、実用上有利である。そして、
所望の密着性と抵抗値とを得るために、遠赤外線乾燥処
理後に熱乾燥炉内で１２０°Ｃで６０分間乾燥させるこ
とも可能である。このとき、熱乾燥において、熱乾燥炉
への入り数や遠赤外線での仮乾燥後、ある程度の溶剤分
の蒸発などが相俟って５〜２０枚の重ね乾燥が可能とな
り、生産性を向上させることができる。As a result, in place of thermal drying during silver pattern printing and carbon printing during the manufacturing process of the flexible printed circuit board, far-infrared drying processing is applied, dramatically shortening the drying time from 60 minutes to 90 seconds, reducing manufacturing time. It can be produced in large quantities and is advantageous in practice. and,
In order to obtain desired adhesion and resistance values, it is also possible to dry in a thermal drying oven at 120° C. for 60 minutes after the far-infrared drying treatment. At this time, during thermal drying, the number of sheets entering the thermal drying oven, after temporary drying with far infrared rays, and the evaporation of a certain amount of solvent make it possible to dry 5 to 20 sheets in layers, improving productivity. can be done.
また、高価なポリイミード樹脂からなるフィルム状の極
薄シートの替わりに、安価なポリエステル樹脂やポリカ
ーボネイト樹脂、あるいはメタクリル４’Ｊ １ｍをフ
レキシブル印刷回路基板のベース部材として使用できる
ことにより、製造コストを低廉とし得て、経済的に有利
である。In addition, manufacturing costs can be reduced by using inexpensive polyester resin, polycarbonate resin, or methacrylic 4'J 1m as the base material for flexible printed circuit boards instead of using expensive polyimide resin film-like ultra-thin sheets. It is economically advantageous.
更に、低温でのハンダ付は作業や導電性接着剤を使用し
ての部品実装を行うことにより、銀印刷回路による銀食
われ現象を防止でき、部品の実装を確実に果たすことが
できる。Furthermore, by performing soldering at a low temperature and mounting components using a conductive adhesive, it is possible to prevent silver from being eaten away by the silver printed circuit, and the components can be mounted reliably.
更にまた、封止剤によって前記フレキシブル印刷回路基
板のベース部材の密着力・絶縫性・マグレージ日ソを防
止することができることにより、前記フレキシブル印゛
刷回路基板の品質を向上させることができるものである
。Furthermore, the quality of the flexible printed circuit board can be improved by using the sealant to prevent adhesive strength, seam-proofing properties, and magnification of the base member of the flexible printed circuit board. It is.
また、導電性加工部位にスクリーン印刷を施すことによ
り、加工部位の信頓性を向上し得て、導電性加工部位の
接続不良を減少させ、品質および生産性を向上させるこ
とができる。Furthermore, by applying screen printing to the electrically conductive processing area, the credibility of the processing area can be improved, connection failures of the electrically conductive processing area can be reduced, and quality and productivity can be improved.
なお、この発明は上述実施例に限定されるものではなく
、種々の応用改変が可能である。Note that the present invention is not limited to the above-described embodiments, and various modifications can be made.
例えば、この発明の実施例においては、ベース部材に溶
剤型の銀インキによってスクリーン印刷を施し、その後
に１２０°Ｃで６０分間の熱乾燥の替わりに９０秒間の
遠赤外線乾燥処理を施して銀パターン印刷（ステップ１
０２）を行ったが、スクリーン印刷の替わりに箔押しに
て回路をベース部材に密着させることも可能である。For example, in an embodiment of the present invention, the base member is screen printed with solvent-based silver ink, and then a far infrared drying process is performed for 90 seconds instead of heat drying at 120°C for 60 minutes to form a silver pattern. Printing (Step 1)
02), but it is also possible to adhere the circuit to the base member by foil stamping instead of screen printing.
また、この発明の実施例においては、接点部位やコネク
タ部の耐摩耗性を大とすべくカーボンインキを印刷する
とともに、その後に１２０°Ｃで６０分間の熱乾燥の替
わりに９０秒間の遠赤外線乾燥処理を施してカーボン印
刷（ステップ１０４）を行ったが、カーボン印刷（ステ
ップ１０４）の替わりに、ニッケル粉体を溶剤系バイン
ダでコンパウンドした材料を使用してニッケル印刷とす
ることもできる。In addition, in the embodiment of the present invention, carbon ink is printed to increase the abrasion resistance of the contact points and connector parts, and instead of heat drying at 120°C for 60 minutes, far infrared rays are applied for 90 seconds. Although carbon printing (step 104) was performed by performing a drying process, instead of carbon printing (step 104), nickel printing can also be performed using a material obtained by compounding nickel powder with a solvent-based binder.
更に、この発明の実施例においては、実装部品のリード
部と印刷回路とを保持させるべくクリームハンダを塗布
してハンダ塗布（ステップ１１４）を行い、塗布剤とし
て１５０°Ｃ以下で硬化するクリームハンダや導電性接
着剤を使用したが、膜厚等の関係によってタンポン印刷
にて実装部品のリード部と印刷回路とを保持させるべく
塗布することも可能である。Furthermore, in the embodiment of the present invention, cream solder is applied to hold the lead portion of the mounted component and the printed circuit (step 114), and cream solder that hardens at 150° C. or lower is used as the coating agent. Although a conductive adhesive was used, depending on the film thickness, etc., it is also possible to apply it by tampon printing to hold the lead part of the mounted component and the printed circuit.
［発明の効果］
以上詳細に説明した如くこの発明によれば、フレキシブ
ル印刷回路基板の製造方法の銀パターン印刷とカーボン
印刷とにおける熱乾燥の替わりに遠赤外線乾燥処理を施
してフレキシブル印刷回路基板を製造するので、前記フ
レキシブル印刷回路基板の製造行程中の銀パターン印刷
とカーボン印刷とにおける熱乾燥の替わりに遠赤外線乾
燥処理を施し、乾燥時間を極端に短縮させて製造時間を
減少させ得て、大量生産ができ、実用上有利である。ま
た、安価なポリエステル樹脂やポリカーボネイト樹脂、
あるいはメタクリル樹脂をフレキシブル印刷回路基板の
ベース部材として使用できることにより、製造コストを
低廉とし得て、経済的に有利である。更に、低温でのハ
ンダ付は作業や導電性接着剤を使用しての部品実装を行
うことにより、銀印刷回路による銀食われ現象を防止し
得て、部品の実装を確実に果し得る。更にまた、封止剤
によって前記フレキシブル印刷回路基板のべ−ス部材の
密着力・絶縁性・マグレーションを防止することができ
ることにより、前記フレキシブル印刷回路基板の品質を
向上させ得るものである。[Effects of the Invention] As explained in detail above, according to the present invention, a far infrared drying process is performed instead of heat drying in silver pattern printing and carbon printing in a method for manufacturing a flexible printed circuit board to produce a flexible printed circuit board. In order to manufacture the flexible printed circuit board, instead of thermal drying in silver pattern printing and carbon printing during the manufacturing process of the flexible printed circuit board, far-infrared drying treatment is applied, thereby drastically shortening the drying time and reducing the manufacturing time. It can be mass produced and has practical advantages. In addition, inexpensive polyester resin and polycarbonate resin,
Alternatively, since methacrylic resin can be used as the base member of the flexible printed circuit board, manufacturing costs can be reduced, which is economically advantageous. Furthermore, by performing soldering at low temperatures and mounting components using a conductive adhesive, it is possible to prevent the silver printed circuit from being eaten away by the silver, and the components can be mounted reliably. Furthermore, the quality of the flexible printed circuit board can be improved by using the sealant to prevent adhesion, insulation, and magration of the base member of the flexible printed circuit board.
図面はこの発明の実施例を示すフレキシブル印刷回路基
板の製造用フローチャートである。
図において、ステップ１００はアニール処理、ステップ
１０２は銀パターン印刷、ステップ１０４はカーボン印
刷、ステップ１０６はジャンパー用レジスト印刷、ステ
ップ１０８は銀パターン印刷、ステップ１１０はオーバ
レジスト印刷、ステップ１１２は外周穴あけ加工、ステ
ップ１１４はハンダ塗布、ステップ１１６は部品実装、
ステップ１１８は封止剤カバー ステップ１２０は製品
検査である。The drawing is a flowchart for manufacturing a flexible printed circuit board showing an embodiment of the invention. In the figure, step 100 is annealing, step 102 is silver pattern printing, step 104 is carbon printing, step 106 is jumper resist printing, step 108 is silver pattern printing, step 110 is over resist printing, and step 112 is outer periphery drilling. , step 114 is solder application, step 116 is component mounting,
Step 118 is encapsulant cover. Step 120 is product inspection.
Claims (1)
を良好とすべくアニール処理を施し、このベース部材に
銀インキによってスクリーン印刷を施すとともにその後
に熱乾燥を施して銀パターン印刷を行い、次に耐摩耗性
を大とすべくカーボンインキを印刷するとともにその後
に熱乾燥を施してカーボン印刷を行い、前記ベース部材
にレジスト印刷により絶縁層を印刷し、次に銀印刷回路
を印刷して銀パターン印刷を施し、前記ベース部材の全
面に絶縁インキを印刷してオーバレジスト印刷を行い、
そしてベース部材を打ち抜き加工し、ハンダを塗布して
チップ部品とリード部とを前記ベース部材に実装し、封
止樹脂によって被覆し硬化させて製造したフレキシブル
印刷回路基板の製造方法において、前記銀パターン印刷
とカーボン印刷とにおける熱乾燥の替わりに遠赤外線乾
燥処理を施して前記フレキシブル印刷回路基板を製造す
ることを特徴とするフレキシブル印刷回路基板の製造方
法。1. The base member of the flexible printed circuit board is annealed to improve dimensional accuracy, screen printed with silver ink and then heat dried to print a silver pattern, and then abrasion resistant. In order to increase the surface area, carbon ink is printed, followed by heat drying to perform carbon printing, an insulating layer is printed on the base member by resist printing, and then a silver printed circuit is printed to print a silver pattern. , performing over-resist printing by printing insulating ink on the entire surface of the base member,
In the method for manufacturing a flexible printed circuit board, the base member is punched out, solder is applied, chip components and lead parts are mounted on the base member, and the flexible printed circuit board is manufactured by covering and curing with a sealing resin. A method for manufacturing a flexible printed circuit board, characterized in that the flexible printed circuit board is manufactured by performing far-infrared drying treatment instead of thermal drying in printing and carbon printing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26124088A JPH02106993A (en) | 1988-10-17 | 1988-10-17 | Manufacture of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26124088A JPH02106993A (en) | 1988-10-17 | 1988-10-17 | Manufacture of flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106993A true JPH02106993A (en) | 1990-04-19 |
Family
ID=17359086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26124088A Pending JPH02106993A (en) | 1988-10-17 | 1988-10-17 | Manufacture of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106993A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015506778A (en) * | 2012-02-09 | 2015-03-05 | ドンミン ジョン | Custom insole for shoes and custom sandals |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553476A (en) * | 1978-10-13 | 1980-04-18 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic circuit device |
| JPS57134995A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of producing electric part wiring device |
| JPS5896799A (en) * | 1981-12-04 | 1983-06-08 | 松下電器産業株式会社 | Method of producing printed board |
| JPS58101488A (en) * | 1981-12-11 | 1983-06-16 | 北陸電気工業株式会社 | Method of drying printed resistor |
| JPS59123626A (en) * | 1982-12-29 | 1984-07-17 | Nitto Electric Ind Co Ltd | Method for annealing treatment of stretched plastic film |
-
1988
- 1988-10-17 JP JP26124088A patent/JPH02106993A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5553476A (en) * | 1978-10-13 | 1980-04-18 | Matsushita Electric Ind Co Ltd | Method of manufacturing electronic circuit device |
| JPS57134995A (en) * | 1981-02-14 | 1982-08-20 | Matsushita Electric Works Ltd | Method of producing electric part wiring device |
| JPS5896799A (en) * | 1981-12-04 | 1983-06-08 | 松下電器産業株式会社 | Method of producing printed board |
| JPS58101488A (en) * | 1981-12-11 | 1983-06-16 | 北陸電気工業株式会社 | Method of drying printed resistor |
| JPS59123626A (en) * | 1982-12-29 | 1984-07-17 | Nitto Electric Ind Co Ltd | Method for annealing treatment of stretched plastic film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015506778A (en) * | 2012-02-09 | 2015-03-05 | ドンミン ジョン | Custom insole for shoes and custom sandals |
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