JPH02106821A - Manufacture of cable conductor - Google Patents
Manufacture of cable conductorInfo
- Publication number
- JPH02106821A JPH02106821A JP25990588A JP25990588A JPH02106821A JP H02106821 A JPH02106821 A JP H02106821A JP 25990588 A JP25990588 A JP 25990588A JP 25990588 A JP25990588 A JP 25990588A JP H02106821 A JPH02106821 A JP H02106821A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- pipe
- cable conductor
- tapes
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000005452 bending Methods 0.000 claims abstract description 4
- 238000004804 winding Methods 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
Landscapes
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的コ
（産業上の利用分野）
本発明は、内部冷却ケーブル、極低温冷却ケプル、超電
導ケーブル等のケーブル導体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention (Industrial Application Field) The present invention relates to a method for manufacturing cable conductors such as internally cooled cables, cryogenically cooled cables, and superconducting cables.
（従来の技術）
内部冷却ケーブル、極低温冷却ケーブル、超電導ケーブ
ル等のケーブル導体には、スパイラル管または冷媒を流
すアルミ管等のパイプと、そのパイプの外側に数層巻か
れているテープ状導体から構成されている場合がある。(Prior technology) Cable conductors such as internal cooling cables, cryogenic cooling cables, and superconducting cables include a pipe such as a spiral pipe or an aluminum pipe for flowing a refrigerant, and a tape-shaped conductor wrapped in several layers around the outside of the pipe. It may consist of.
このような導体ケーブルはパイプの外側に平板状のテー
プを数層巻き付けて製造するが、第２図に示すように、
パイプ］の外側に平板状のテープ２を巻くと、隣り合う
テープの端部３か凸状となり、ケーブル導体か円筒形に
仕上らないという問題があった。ケーブル導体が円筒形
でないと、次の絶縁層が巻きすらくなる等の問題かあっ
た。Such conductor cables are manufactured by wrapping several layers of flat tape around the outside of the pipe, as shown in Figure 2.
When a flat tape 2 is wrapped around the outside of a pipe, the end portions 3 of adjacent tapes become convex, resulting in a problem in that the cable conductor cannot be finished in a cylindrical shape. If the cable conductor was not cylindrical, there would be problems such as the next insulating layer being difficult to wrap.
（発明か解決しようとする課題）
このように、従来のケーブル導体製造方法では、ケーブ
ル導体が円筒形に仕上らないという課題があった。(Problem to be Solved by the Invention) As described above, in the conventional cable conductor manufacturing method, there was a problem that the cable conductor was not finished in a cylindrical shape.
本発明は、このような課題に鑑みてなされたものであり
、その目的とするところは、仕上り形状が円筒形である
ケーブル導体製造方法を提供することにある。The present invention has been made in view of these problems, and an object of the present invention is to provide a method for manufacturing a cable conductor whose finished shape is cylindrical.
［発明の横１戊］
（課題を解決するだめの手段）
前記目的を達成するために、本発明のケーブル導体製造
方法は、テープ状導体を筒体の外周に沿うように曲げた
後に、前記テープ状導体を前記筒体に巻き付けることを
特徴とする特
（作用）
本発明では、テープ状導体を筒体の外周に沿うように曲
げた後に、テープ状導体を筒体に巻き付けているので、
テープ状導体の端が筒体に沿い、隣り合うテープ状導体
の端部が凸状にならないため、ケーブル導体の仕上り形
状が円筒形となる。[A side aspect of the invention] (Means for solving the problem) In order to achieve the above object, the cable conductor manufacturing method of the present invention includes bending a tape-shaped conductor along the outer periphery of a cylinder, and then bending the tape-shaped conductor along the outer periphery of a cylinder. Features (effects) characterized in that the tape-shaped conductor is wound around the cylindrical body: In the present invention, the tape-shaped conductor is wound around the cylindrical body after the tape-shaped conductor is bent along the outer periphery of the cylindrical body.
Since the ends of the tape-shaped conductors are along the cylindrical body and the ends of adjacent tape-shaped conductors are not convex, the finished shape of the cable conductor is cylindrical.
（実施例）
以下、図面に基づいて本発明の実施例を詳細に説明する
。(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.
第１図は本発明の一実施例に係わるケーブル導体の製造
方法を示す。FIG. 1 shows a method of manufacturing a cable conductor according to an embodiment of the present invention.
第１図（ａ）は曲げられたテープの断面図、第１図（ｂ
）は曲げられたテープを巻き付けられたパイプの断面図
、第１図（Ｃ）はケーブル導体の断面図を示す。Figure 1(a) is a cross-sectional view of the bent tape, Figure 1(b)
) shows a cross-sectional view of a pipe wrapped with a bent tape, and FIG. 1(C) shows a cross-sectional view of a cable conductor.
まず、第１図（ａ）に示すように、銅テープ等のテープ
２を、ロールまたはダイスを通すことにより、内径Ｒ１
の曲率を有するテープ４を形成する。内径Ｒ１はテープ
２を巻き付けようとするパイプ１の外径Ｒ２と同じかそ
れより大きい。内径Ｒ１か外径Ｒ２より小さいとふくろ
状となり逆に凸状となる。First, as shown in FIG. 1(a), by passing a tape 2 such as a copper tape through a roll or die, the inner diameter R1
A tape 4 having a curvature of is formed. The inner diameter R1 is the same as or larger than the outer diameter R2 of the pipe 1 around which the tape 2 is to be wound. If the inner diameter R1 is smaller than the outer diameter R2, it becomes bag-like, or conversely convex.
次に、第１図（ｂ）に示すように、１５〜１６枚のテー
プ４をパイプ１に巻き（＝ｆけていく。この時、テープ
４の端がパイプ１に沿っているので、隣り合うテープ４
の端部３は凸状にならない。Next, as shown in FIG. 1(b), 15 to 16 pieces of tape 4 are wound around pipe 1 (=f). At this time, since the end of tape 4 is along pipe 1, Matching tape 4
The end 3 of is not convex.
同様にしてパイプ１に３層にテープ４を巻き付けて第１
図（Ｃ）に示すケーブル導体を製造する。In the same way, wrap tape 4 in three layers around pipe 1.
A cable conductor shown in Figure (C) is manufactured.
かくして、本実施例では、テープにあらかじめ曲げ加工
してから筒体に巻き付けているので、テープの端が筒体
に沿い、隣り合うテープの端部が凸状にならないため、
ケーブル導体の仕上り形状が円筒形となる。Thus, in this example, since the tape is bent in advance and then wrapped around the cylinder, the ends of the tape follow the cylinder and the ends of adjacent tapes do not become convex.
The finished shape of the cable conductor is cylindrical.
［発明の効果］
以上説明したように本発明によれば、仕上り形状が円筒
形であるケーブル導体製造方法を提供することができる
。[Effects of the Invention] As explained above, according to the present invention, it is possible to provide a method for manufacturing a cable conductor whose finished shape is cylindrical.
第１図（ａ）は曲げられたテープの断面図、第１図（ｂ
）は曲げられたテープを巻き付けられたパイプの断面図
、第１図（Ｃ）はケーブル導体の断面図、第２図は従来
のケーブル導体製造方法を示す図である。
１・・・パイプ、４・・・テープ
第１
図
（ｂ）
第２
図Figure 1(a) is a cross-sectional view of the bent tape, Figure 1(b)
) is a sectional view of a pipe wrapped with a bent tape, FIG. 1(C) is a sectional view of a cable conductor, and FIG. 2 is a diagram showing a conventional cable conductor manufacturing method. 1... Pipe, 4... Tape Figure 1 (b) Figure 2
Claims (1)
記テープ状導体を前記筒体に巻き付けることを特徴とす
るケーブル導体製造方法。A method for manufacturing a cable conductor, comprising: bending the tape-shaped conductor along the outer periphery of the cylindrical body, and then winding the tape-shaped conductor around the cylindrical body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25990588A JPH02106821A (en) | 1988-10-14 | 1988-10-14 | Manufacture of cable conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25990588A JPH02106821A (en) | 1988-10-14 | 1988-10-14 | Manufacture of cable conductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106821A true JPH02106821A (en) | 1990-04-18 |
Family
ID=17340560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25990588A Pending JPH02106821A (en) | 1988-10-14 | 1988-10-14 | Manufacture of cable conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106821A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174222B1 (en) | 1995-06-09 | 2001-01-16 | Hitachi, Ltd. | Process for fabrication of semiconductor device, semiconductor wafer for use in the process and process for the preparation of the wafer |
| US6707160B2 (en) * | 2000-06-05 | 2004-03-16 | Kabushiki Kaisha Toshiba | Semiconductor device using substrate having cubic structure and method of manufacturing the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154830A (en) * | 1984-01-23 | 1985-08-14 | Sumitomo Electric Ind Ltd | Stranding method of deformed wire rod |
| JPS6182940A (en) * | 1984-10-01 | 1986-04-26 | Fujikura Ltd | Production of deformed composite wire rod |
-
1988
- 1988-10-14 JP JP25990588A patent/JPH02106821A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60154830A (en) * | 1984-01-23 | 1985-08-14 | Sumitomo Electric Ind Ltd | Stranding method of deformed wire rod |
| JPS6182940A (en) * | 1984-10-01 | 1986-04-26 | Fujikura Ltd | Production of deformed composite wire rod |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6174222B1 (en) | 1995-06-09 | 2001-01-16 | Hitachi, Ltd. | Process for fabrication of semiconductor device, semiconductor wafer for use in the process and process for the preparation of the wafer |
| US6707160B2 (en) * | 2000-06-05 | 2004-03-16 | Kabushiki Kaisha Toshiba | Semiconductor device using substrate having cubic structure and method of manufacturing the same |
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