JPH0210466U - - Google Patents

Info

Publication number

JPH0210466U

JPH0210466U JP8435188U JP8435188U JPH0210466U JP H0210466 U JPH0210466 U JP H0210466U JP 8435188 U JP8435188 U JP 8435188U JP 8435188 U JP8435188 U JP 8435188U JP H0210466 U JPH0210466 U JP H0210466U

Authority

JP

Japan

Prior art keywords

saucer

layer

electrification

plating

peripheral

Prior art date

1988-06-24

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
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• 238000007747 plating Methods 0.000 claims description 7
• 229910052751 metal Inorganic materials 0.000 claims description 4
• 239000002184 metal Substances 0.000 claims description 4
• 229910052709 silver Inorganic materials 0.000 claims description 3
• 239000004332 silver Substances 0.000 claims description 3
• 238000009713 electroplating Methods 0.000 claims description 2
• 239000010409 thin film Substances 0.000 claims description 2
• 230000002093 peripheral effect Effects 0.000 claims 3
• BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
• 239000011347 resin Substances 0.000 claims 2
• 229920005989 resin Polymers 0.000 claims 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
• 239000011889 copper foil Substances 0.000 claims 1
• 229920000915 polyvinyl chloride Polymers 0.000 claims 1
• 239000004800 polyvinyl chloride Substances 0.000 claims 1
• 229910001220 stainless steel Inorganic materials 0.000 claims 1
• 239000010935 stainless steel Substances 0.000 claims 1
• 238000000926 separation method Methods 0.000 description 2
• 230000006355 external stress Effects 0.000 description 1
• 125000006850 spacer group Chemical group 0.000 description 1
• 239000000758 substrate Substances 0.000 description 1