JPH02104658U - - Google Patents
Info
- Publication number
- JPH02104658U JPH02104658U JP1989012240U JP1224089U JPH02104658U JP H02104658 U JPH02104658 U JP H02104658U JP 1989012240 U JP1989012240 U JP 1989012240U JP 1224089 U JP1224089 U JP 1224089U JP H02104658 U JPH02104658 U JP H02104658U
- Authority
- JP
- Japan
- Prior art keywords
- sided
- double
- chip
- semiconductor device
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989012240U JPH0639466Y2 (ja) | 1989-02-06 | 1989-02-06 | 表面実装型半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989012240U JPH0639466Y2 (ja) | 1989-02-06 | 1989-02-06 | 表面実装型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02104658U true JPH02104658U (fi) | 1990-08-20 |
JPH0639466Y2 JPH0639466Y2 (ja) | 1994-10-12 |
Family
ID=31221513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989012240U Expired - Fee Related JPH0639466Y2 (ja) | 1989-02-06 | 1989-02-06 | 表面実装型半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0639466Y2 (fi) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011138880A (ja) * | 2009-12-28 | 2011-07-14 | Canon Inc | 回路基板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56135984A (en) * | 1980-03-27 | 1981-10-23 | Matsushita Electric Ind Co Ltd | Manufacture of leadless light emitting diode chip |
JPS58194383A (ja) * | 1982-05-07 | 1983-11-12 | Sumitomo Electric Ind Ltd | 連続組立発光ダイオ−ド |
-
1989
- 1989-02-06 JP JP1989012240U patent/JPH0639466Y2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56135984A (en) * | 1980-03-27 | 1981-10-23 | Matsushita Electric Ind Co Ltd | Manufacture of leadless light emitting diode chip |
JPS58194383A (ja) * | 1982-05-07 | 1983-11-12 | Sumitomo Electric Ind Ltd | 連続組立発光ダイオ−ド |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011138880A (ja) * | 2009-12-28 | 2011-07-14 | Canon Inc | 回路基板 |
Also Published As
Publication number | Publication date |
---|---|
JPH0639466Y2 (ja) | 1994-10-12 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |