JPH02101547U - - Google Patents

Info

Publication number

JPH02101547U

JPH02101547U JP850789U JP850789U JPH02101547U JP H02101547 U JPH02101547 U JP H02101547U JP 850789 U JP850789 U JP 850789U JP 850789 U JP850789 U JP 850789U JP H02101547 U JPH02101547 U JP H02101547U

Authority

JP

Japan

Prior art keywords

resin

lsi

sealing structure

substrate

shrinkage prevention

Prior art date

1989-01-27

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 8
• 229920005989 resin Polymers 0.000 claims description 8
• 239000007788 liquid Substances 0.000 claims description 4
• 230000002265 prevention Effects 0.000 claims description 4
• 238000007789 sealing Methods 0.000 claims description 4
• 239000000758 substrate Substances 0.000 claims description 3
• 238000010586 diagram Methods 0.000 description 2
• 239000004065 semiconductor Substances 0.000 description 1