Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/161—Cap
  • H01L2924/1615—Shape
  • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

• Wire Bonding (AREA)

Priority Applications (1)

Applications Claiming Priority (1)

Publications (1)

Family

ID=31216886

Family Applications (1)

Country Status (1)

Citations (3)

• 1989
  • 1989-01-30 JP JP1989009812U patent/JPH02101538U/ja active Pending

Patent Citations (3)

Similar Documents