JPH0199957U - - Google Patents
Info
- Publication number
- JPH0199957U JPH0199957U JP19510987U JP19510987U JPH0199957U JP H0199957 U JPH0199957 U JP H0199957U JP 19510987 U JP19510987 U JP 19510987U JP 19510987 U JP19510987 U JP 19510987U JP H0199957 U JPH0199957 U JP H0199957U
- Authority
- JP
- Japan
- Prior art keywords
- cab
- flange
- intake manifold
- carburetor
- heat insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Gasket Seals (AREA)
Description
第1図及び第2図は本考案の実施例を示し、第
1図はその概略側面図、第2図は要部の拡大断面
図、第3図は従来例の縦断側面図である。
1……キヤブボデイ、2……キヤブフランジ、
3……ヒートインシユレータ、5……インテーク
マニホールド、6……メタルガスケツト、6a…
…基板、10……キヤブレタ。
1 and 2 show an embodiment of the present invention; FIG. 1 is a schematic side view thereof, FIG. 2 is an enlarged sectional view of the main part, and FIG. 3 is a vertical sectional side view of a conventional example. 1... Cab body, 2... Cab flange,
3...Heat insulator, 5...Intake manifold, 6...Metal gasket, 6a...
... Board, 10... Carburetor.
Claims (1)
るキヤブレタを、インテークマニホールドに取付
ける構造において、キヤブボデイとキヤブフラン
ジとの間にヒートインシユレータを介装すると共
に、キヤブフランジとインテークマニホールドと
の間に、アルミ合金又はこれ以上の熱伝導率を有
する金属を基板としてなるメタルガスケツトを介
装したことを特徴とするキヤブレタのインテーク
マニホールドへの取付構造。 In a structure in which a carburetor formed by combining a cab body and a cab flange is attached to an intake manifold, a heat insulator is interposed between the cab body and the cab flange, and an aluminum alloy or higher material is installed between the cab flange and the intake manifold. A structure for attaching a carburetor to an intake manifold, the structure comprising a metal gasket having a metal substrate having a thermal conductivity of .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19510987U JPH0199957U (en) | 1987-12-23 | 1987-12-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19510987U JPH0199957U (en) | 1987-12-23 | 1987-12-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0199957U true JPH0199957U (en) | 1989-07-05 |
Family
ID=31485802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19510987U Pending JPH0199957U (en) | 1987-12-23 | 1987-12-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0199957U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816340B2 (en) * | 1976-03-24 | 1983-03-30 | 富士通株式会社 | Method of manufacturing semiconductor memory device |
-
1987
- 1987-12-23 JP JP19510987U patent/JPH0199957U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5816340B2 (en) * | 1976-03-24 | 1983-03-30 | 富士通株式会社 | Method of manufacturing semiconductor memory device |
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