JPH0198512A - Carrier device - Google Patents

Abstract

PURPOSE:To make easy and quick measures for variations of an out side dimension by making a suitable guide member to be selected by a positioning interval corresponding to variations of outside dimensions of goods, and making the guide member to be positioned between the side plates with intervals adjusted, in a carrier device applied to an action test device, etc., of a semiconductor device. CONSTITUTION:Plural guide members 3-6. in which plural positioning parts 3a-6a are formed at different intervals, are detachably mounted on each side surface of a polygonal column body 1, and the members 3-6, which is having an optimum positioning part interval L to the outside dimension of goods 7, are selected to be positioned between side plates 8 and 9 with the body 1 rotated around a rotation axis 2. Then the plates 8 and 9 are adjusted so as to have a given interval corresponding to the outside dimension of the goods 7. And the goods are made to move one pitch at a time with repeating the forward movement of the body 1 of the interval L, the ascendant movement of the plates 8 and 9, a reverse movement of the body 1, and the descending of the plates 8 and 9. Thus measures for variations of an outside dimension can be quickly made.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a transportation technique, and particularly to a technique that is effective when applied to transportation of a semiconductor device in an operation test apparatus in the manufacture of semiconductor devices.

[Conventional technology]

Regarding the transportation technology of semiconductor devices in operation test equipment, Kogyo Kenkyukai Co., Ltd., published November 18, 1986,
"Electronic Materials J November 1986 issue, P243-P
248.

By the way, in such an operation test equipment, the semiconductor devices supplied from the outside are transported from the receiving section where they are accumulated to the test stand where the actual operation test is performed, and from the test stand to the delivery section. Examples of transport mechanisms include:
Walking beam is known.

The outline of the system is to provide a guide plotter with positioning protrusions protruding at a predetermined pitch in the length direction, and a pair of moving guides that face each other in parallel with the guide block in between. A semiconductor device mounted on a plotter is intermittently moved in one direction by a predetermined pitch.

[Problem that the invention seeks to solve]

However, in the conventional transport mechanism as described above, the pitch of the positioning protrusions formed on the guide block and the interval between the moving guides are fixed to certain values, so the There is a problem in that it can only be used for semiconductor devices and cannot easily handle the transportation of different types of semiconductor devices with different external dimensions.

An object of the present invention is to provide a transport technique that can easily and quickly respond to changes in the external dimensions of an object to be transported.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, there is a rotating body that can rotate freely around the axis and reciprocate in the axial direction, and a device that is removably attached to the side of the rotating body and positions the transported objects at different intervals in the axial direction of the rotating body. and a plurality of side plates disposed in parallel near the side surfaces of the rotating body via the guide members and displaceable in the width direction of the guide member and the radial direction of the rotating body, By rotating the rotating body at any time,
Any one of the plurality of guide members provided on the side surface of the rotating body is selected and positioned between the side plates.

[Effect]

According to the above-mentioned means, for example, in accordance with changes in the external dimensions of the transported object, the guide member with the optimum spacing between the positioning parts can be selected and positioned between the side plates, and the spacing between the side plates can be changed as appropriate. Therefore, it is possible to easily and quickly respond to changes in the external dimensions of the transported object without performing complicated operations such as replacing parts.

[Embodiment 1] Fig. 1 is a perspective view showing the main parts of a conveying device which is an embodiment of the present invention, Figs. 2 and 3 are thin sectional views thereof, and Fig. 4 is a cross-sectional view thereof. FIG. 2 is a schematic plan view showing a main part of a semiconductor device operation testing apparatus B in which a plurality of transport apparatuses A and A2 of the present embodiment are incorporated.

As shown in FIG. 1, the transport device AI of this embodiment
(A2) is equipped with a horizontally provided polygonal prism 1 (rotating body), and this polygonal prism 1 is rotatably supported on a rotation shaft 2, and the rotation shaft 2 is rotated at any time. By rotating it, one of the plurality of side surfaces is placed in an upward horizontal state, and it is configured to reciprocate in the axial direction.

A plurality of guide members 3. Guide member 4. Guide member 5. The guide member 6 is removably fitted and attached with its longitudinal direction parallel to the axial direction of the polygonal column body 1.

On the external side surface of each of these guide members 3.4, 5.6, a plurality of positioning parts 3a, positioning parts 4a, and positioning parts 5a are provided at different intervals in the length direction of the polygonal prism body 1.
, a positioning portion Eia is provided protrudingly.

In addition, in FIG. 1, for convenience of illustration, the positioning part 5 is
a, (ia are not shown.

The side surfaces of the plurality of positioning parts 3a, 4a, 5a, and 6a are tapered 3b, taper 4b, taper 5b, and taper 6b, respectively.

Then, two adjacent positioning parts 3a (4a) (5a
) (6a), the tips of the plurality of leads 7a of the semiconductor device 7 (object to be transported) are tapered to the tapers 3b (4b) (5b) (6b), as shown in FIG. The guide member 3 (4) (5) (6
) is stabilized in the longitudinal direction.

Moreover, the width dimension of the plurality of guide members 3, 4, 5, 6 is the plurality of positioning portions 3a, 4a in each.

The distance between the leads 7a and 5a is set smaller than the distance between the leads 7a of the semiconductor device 7 to be mounted, so that the leads 7a of the semiconductor device 7 to be placed protrude in the width direction.

In the vicinity of the upward side surface of the polygonal prism body 1, parallel guide members 3 (4), (5), and A plurality of right side plates 8 and side plates 9 are provided at positions that support the leads 7a of the semiconductor device 7 protruding from the lower side in the width direction from the side plate 6).

A plurality of bearings 10 and a plurality of bearings 11 are respectively engaged with the side plates 8 and 9, and these bearings 10 and 1
1 includes a guide member 3 located between the side plates 8 and 9;
(4) A plurality of guide shafts 12 in the direction crossing (5) and (6)
is inserted.

By moving the bearings 10 and 11 toward or away from each other along the guide shaft 12 by a drive mechanism (not shown), the distance between the plurality of side plates 8 and 9 is freely set to a predetermined dimension. In addition, by vertically reciprocating the plurality of guide shafts 12, the plurality of side plates 8 and 9 are raised and lowered relative to the polygonal column 1.

As illustrated in FIG. A taper 8a and a taper 9a are formed so that the distance between them gradually narrows, and by being positioned at the bottom of the groove formed by the taper 8a and 9a, the guide member 3 (4) (5 ) (6) The semiconductor device 7 is configured so that its position in the width direction is stabilized.

In the transport device AI (A2) having such a configuration, the forward movement of the guide member 3 (4), (5), and (6) by the displacement of the polygonal prism body 1 in the forward direction, and the forward movement of the semiconductor device 7 by the guide member 3 (4) Due to the upward movement of the plurality of side plates 8 and 9 lifted from (5) and (6), and the retreat of the polygonal prism l,
Guide member 3 (4) in a state where semiconductor device 7 is not placed
) (5) Guide member 3 for the plurality of semiconductor devices 7 due to the backward movement of (6) and the downward displacement of the plurality of side plates 8 and 9 (4)
By sequentially repeating the lowering operation for (5) and (6), the plurality of semiconductor devices 7 placed on the guide member 3 (4), (5), and (6) are transported in one predetermined direction. is to be carried out.

On the other hand, as shown in FIG. 4, the operation test apparatus B includes a receiving section 13 to which a plurality of semiconductor devices 7 are supplied from the outside in a state of being housed in a tray, etc., and a receiving section 13 into which the semiconductor devices 7 are mounted for operation testing. A test stand 14 is provided with a socket (14a) on which a test is performed, a delivery unit 15 is provided with a plurality of semiconductor devices 7 that have undergone a predetermined operation test, and is temporarily stored before being transported outside; The semiconductor device 7 is provided with a defective product storage section 16 in which the semiconductor device 7 is stored.

Then, the transport device i of the present embodiment mentioned above! A1 and A2 are respectively installed between the receiving section 13 and the test stand 14 and between the test stand 14 and the dispensing section 15, and are used to transport the semiconductor device 7 between the respective sections.

For example, between the receiving section 13 and the transport device A+,
A vacuum suction arm 17 is provided which individually moves a plurality of semiconductor devices 7 from the receiving 1iR 513 onto the transfer device A1 by holding the individual semiconductor devices 7 detachably by vacuum suction or the like.

A vacuum suction arm 18 is provided near the test stand 14, and connects the transport devices A and A2 to the sockets of the test stand 14.
4a, loading and unloading operations of the semiconductor device 7 are performed.

Similarly, a vacuum suction arm 19 is provided between the transport device A2 and the payout unit 15, and is configured to transfer the semiconductor device 7 from the transport device A2 to the payout unit 15.

The operation of this embodiment will be explained below.

First, a plurality of positioning parts 3a are provided at different intervals.

The selection operation of the plurality of guide members 3.4.5.6 in which 4a, 5a, and 6a are respectively formed according to the external dimensions of the semiconductor device 7 will be described.

That is, in the conveyance device AI (A2), after the plurality of side plates 8 and 9 are displaced in the expanding direction and the rotational displacement of the polygonal columnar body 1 is not inhibited, the polygonal columnar body 1 is
By appropriately rotating the guide member 3, for example, the guide member 3 is placed in an upward horizontal position, with the spacing of the positioning portions corresponding to the external dimensions of the semiconductor device 7 to be transported.
Thereafter, the plurality of side plates 8 and 9 are moved close to each other at a predetermined interval according to the external dimensions of the semiconductor device 7, and the operation of changing the conveyance pitch in the conveyance device AI (A2) is performed without complicated parts replacement. It is done quickly and without any work.

Next, the plurality of semiconductor devices 7 supplied from the outside to the receiving section 13 of the operation test device B are individually transferred onto the transfer device A+ by the vacuum suction arm 17, and at this time, the positioning section of the guide member 3 Taper 3b of 3a, and tapers 8a and 9a formed on opposing surfaces of the plurality of side plates 8 and 90
As a result, the semiconductor device 7 is stably positioned at a predetermined position.

In the transport device A1, the guide member 3 moves forward in the forward direction of the polygonal prism body 1 by the distance, and the plurality of side plates 8 and 9 move upward to lift the semiconductor device 7 from the guide member 3. , a plurality of semiconductor devices 1i! due to the retreating movement of the guide member 3 without the semiconductor device 7 placed thereon due to the retreat of the polygonal prism 1, and the downward displacement of the plurality of guide members 8 and 9! By sequentially repeating each of the lowering operations with respect to the guide member 3 of 7, the plurality of semiconductor devices 7 placed on the guide member 3 are intermittently moved in the direction of the test stand 14 by successive intervals.

The semiconductor device 7 thus transported to the vicinity of the test stand 14 on the transport device A1 is set in the socket 14a of the test stand 14 by the vacuum suction arm 18, and is subjected to a predetermined operation at a predetermined temperature. Operation tests such as applying signals are performed to determine whether or not the operation characteristics are acceptable.

Thereafter, the semiconductor device 7 that has completed the operation test is removed from the socket 14a of the test stand 14 by the vacuum suction arm 18, transferred onto the transport bag RA2, and transferred to the transport device A.
The paper is transported to the vicinity of the dispensing section 15 by the intermittent transport operations of 2.

In addition, the semiconductor device 7 determined to be defective in the above operation test
is transferred to the defective product storage section 16 by a pickup mechanism (not shown) during the transport device A2.

On the other hand, the non-defective semiconductor devices 7 that have reached the vicinity of the delivery section 15 are transferred to a tray (not shown) in the delivery section 150 by the vacuum suction arm 19, and when a predetermined quantity is reached, they are carried out to the next packing process, etc. be done.

Each time the 70 types of semiconductor devices supplied to the receiving section 13 from the outside in a tray (not shown) or the like changes, and the external dimensions such as the distance from one end of the lead 7a to the other end change, By combining the above-mentioned rotational movement of the polygonal column body 1 and expansion movement of the side plates 8 and 9,
A plurality of positioning parts 3a (4a) at different intervals
(5a) Guide members 3, 4.5 formed with (6a)
．． By performing any one selection operation of 6, it is possible to easily and quickly respond to changes in external dimensions due to changes in the type of semiconductor device W7.

Also, a plurality of guide members 3.4 attached to the polygonal column body 1.
By replacing 5.6 as appropriate, the types of the plurality of guide members 3 and 4 degrees 5.6 are not restricted by the number of side surfaces of the polygonal prism body 1.

In this way, the following effects can be obtained in this embodiment.

(1) 1 A polygonal prism body 1 that can be freely rotated around a rotation axis 2 and reciprocated in the axial direction, and a polygonal prism body that is removably fitted to each side of this polygonal prism body l. The positioning parts 3a and 4 of the semiconductor device 7 are arranged at different intervals in the axial direction of the semiconductor device 7.
A plurality of guide members 3.4.5 formed with a, 5a, 6a
．． 6, and a guide member 3 (4) (
5) is arranged in parallel via (6) and guide member 3 (4
) (5) (6) A plurality of side plates 7 and 8 which are freely displaceable in the width direction and the radial direction of the polygonal prism 1 are provided, and the polygonal prism 1 can be
, select any one of the plurality of guide members 3.4, 5.6 provided on each side of the polygonal prism body 1 and position it between the side plates 8 and 9. By appropriately changing the intervals between the leads 7a and 9, it is possible to transport different types of semiconductor devices 7 with different width dimensions between the ends of the leads 7a, for example, without having to perform complicated operations such as replacing parts. You can respond easily and quickly.

(2) As a result of the above “(1),” the conveyance device A of this embodiment,
In the operation test equipment in which A is incorporated, it is possible to quickly perform operation tests on various types of semiconductor devices 7 having different external dimensions, etc., without having to replace parts, etc. The performance and productivity of operational test equipment are improved.

(3) As a result of the above (1), in the operation test device B,
Operation tests of multiple types of semiconductor devices 7 having different external dimensions etc. can be automatically and continuously performed without intervening part replacement or adjustment work by an operator or the like.
It is possible to improve the operating rate of the operation test device B in which the plurality of transport devices At and A2 are incorporated.

(4) As a result of (1) to (3) above, productivity in manufacturing semiconductor devices is improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the shape of the rotating body is not limited to a polygonal column, but may be any other shape such as a cylinder.

Further, the shape of the positioning portions formed on the plurality of guide members is not limited to a tapered protrusion, but may be a concave groove formed in the plane of the guide member.

In the above explanation, the invention made by the present inventor was mainly applied to the transportation technology of semiconductor devices in operation test equipment, which is the background field of application, but the invention is not limited to this, and various It can be widely applied to the transportation of articles with various shapes.

[Effects of the Invention] A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In other words, there is a rotating body that can freely rotate around an axis and reciprocate in the axial direction, and objects to be transported are attached to the sides of the rotating body in a detachable manner and arranged at different intervals in the axial direction of the rotating body. a plurality of guide members in which positioning portions are formed; and a plurality of guide members disposed in parallel with each other near the side surface of the rotary body via the guide members and displaceable in the width direction of the guide member and in the radial direction of the rotary body. and side plates, and by rotating the rotating body at any time, any one of the plurality of guide members provided on the side surface of the rotating body is selected and positioned between the side plates. Therefore, depending on changes in the external dimensions of the transported object, for example, by selecting a guide member with the optimum spacing between the positioning parts and positioning it between the side plates, and by changing the spacing between the side plates as appropriate, parts removal can be facilitated. It is possible to easily and quickly respond to changes in the external dimensions of the transported object without having to perform complicated operations such as replacement.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing the main parts of a conveying device which is an embodiment of the present invention, Fig. 2 is a partial cross-sectional view thereof, Fig. 3 is a partial cross-sectional view thereof, and Fig. 4 is a present embodiment. FIG. 2 is a schematic plan view showing the main parts of the semiconductor device operation testing apparatus in which a transport bag is incorporated. l... Polygonal prism body (rotating body), 2... Rotation axis, 3, 4
, 5.6...Guiding member, 3a, 4a, 5a, 6a...
- Positioning parts, 3b, 4b, 5b. 6b...Taper, 7...Semiconductor device (transferred object),
7a...Lead, 8.9...Side plate, 8a, 9a...
・Taper, 10.11... Bearing, 12... Guide shaft,
13... Receiving section, 14... Test stand, 14a... Socket, 15... Dispensing section, 16... Defective product storage section,
17,18.19...Vacuum suction arm, A+,
A2...Conveyance device, B...Operation test device, L.
··interval. Agent: Patent Attorney Daiwa Tsutsui 4th Figure Dan

Claims (1)

[Scope of Claims] 1. A rotating body capable of rotational displacement around an axis and reciprocating displacement in the axial force direction, and a rotating body detachably attached to each side of the rotating body, A plurality of guide members each having positioning portions for objects to be conveyed formed at mutually different intervals; and a plurality of guide members disposed in parallel with each other through the guide members near the side surface of the rotating body, and arranged in parallel in the width direction of the guide member and of the rotating body. and a plurality of side plates that are freely displaceable in the radial direction, and by rotating the rotating body at any time, any one of the plurality of guide members provided on the side surface of the rotating body is selected and moved between the side plates. A conveying device characterized in that it is located at. 2. The conveyance device according to claim 1, wherein the rotating body is a polygonal column, and a plurality of the guide members are attached to each of a plurality of side surfaces of the polygonal column. . 3. By combining the reciprocating motion of the rotary body in the axial direction and the reciprocating motion of the plurality of side plates in the radial direction of the rotary body, the article positioned between the positioning portions of the guide member is rotated. 2. The conveyance device according to claim 1, wherein the conveyance device is adapted to be moved intermittently in one predetermined direction in the axial direction of the body. 4. The conveying device according to claim 1, wherein the positioning portion formed on the guide member is a projection having a tapered side surface. 5. The conveying device according to claim 1, wherein a tapered portion is formed on each of the opposing surfaces of the plurality of side plates. 6. The conveyance apparatus according to claim 1, wherein the object to be conveyed is a semiconductor device, and is mounted on an operation test device that performs an operation test of the semiconductor device.