JPH0197916U - - Google Patents
Info
- Publication number
- JPH0197916U JPH0197916U JP19380287U JP19380287U JPH0197916U JP H0197916 U JPH0197916 U JP H0197916U JP 19380287 U JP19380287 U JP 19380287U JP 19380287 U JP19380287 U JP 19380287U JP H0197916 U JPH0197916 U JP H0197916U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- groove
- ring
- protrusion
- gluing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
第１図は、本考案の一実施例のＳＭＣ圧縮成形
型の下型を示す図、第２図は該実施例のＳＭＣ圧
縮成形型の断面図、第３図は第２図の断面図のＯ
リング部分Ａの拡大図、第４図は本考案の他の実
施例のＳＭＣ圧縮成形型のＯリング部分の拡大図
を示す断面図、第５図は比較例のＳＭＣ圧縮成形
型の断面図、第６図は他の比較例のＯリング部分
の拡大図である。
１……ＳＭＣ圧縮成形型、２……下型、３……
Ｏリング、４……溝、５……上型、６……リング
部、７……突起部。
FIG. 1 is a diagram showing the lower mold of an SMC compression molding mold according to an embodiment of the present invention, FIG. 2 is a sectional view of the SMC compression molding mold of the embodiment, and FIG. 3 is a sectional view of the SMC compression molding mold of the embodiment O
An enlarged view of ring part A, FIG. 4 is a sectional view showing an enlarged view of the O-ring part of an SMC compression mold according to another embodiment of the present invention, and FIG. 5 is a sectional view of an SMC compression mold of a comparative example. FIG. 6 is an enlarged view of the O-ring portion of another comparative example. 1... SMC compression mold, 2... lower mold, 3...
O-ring, 4...Groove, 5...Upper die, 6...Ring part, 7...Protrusion part.
Claims (1)
接着し、型締め時に該Ｏリングの一部をもう一方
の型に圧接することによりシールする成形型にお
いて、Ｏリングの内周側に突起が形成され、溝が
、該突起と溝との間に接着剤塗布用の空間が存在
するように形成され、該突起と溝とを接着するこ
とによりＯリングが溝内に固定されていることを
特徴とする成形型。 In a mold in which an O-ring is glued to a groove formed on the outer surface of one mold, and a part of the O-ring is pressed against the other mold when the mold is clamped, a seal is formed on the inner peripheral side of the O-ring. A protrusion is formed, a groove is formed such that a space for adhesive application exists between the protrusion and the groove, and the O-ring is fixed in the groove by gluing the protrusion and the groove. A mold that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19380287U JPH0197916U (en) | 1987-12-21 | 1987-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19380287U JPH0197916U (en) | 1987-12-21 | 1987-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197916U true JPH0197916U (en) | 1989-06-29 |
Family
ID=31484576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19380287U Pending JPH0197916U (en) | 1987-12-21 | 1987-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001129833A (en) * | 1999-11-05 | 2001-05-15 | Miyagi Oki Electric Co Ltd | Mold and method for producing semiconductor device |
-
1987
- 1987-12-21 JP JP19380287U patent/JPH0197916U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001129833A (en) * | 1999-11-05 | 2001-05-15 | Miyagi Oki Electric Co Ltd | Mold and method for producing semiconductor device |
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